Denso Corporation

Nec Electronics Corporation

Tomohiro Yokochi

Koji Kondo

Yoshitaro Yazaki

Toshikazu Harada

Toshihiro Miyake

Yoshihiko Shiraishi

Satoshi Takeuchi

Makoto Totani

Takehito Teramae

Hajime Nakagawa

Ryohei Kataoka

Yasutaka Kamiya

Gentaro Masuda

Akimori Hayashi

Ryuichi Onoda

Tetsuaki Kamiya

Katsunobu Suzuki

Kazuyuki Deguchi

Yoshitarou Yazaki

Tadashi Murai

Makoto Nakagoshi

Ryuichi Oikawa

Norihisa Imaizumi

Kouji Kondoh

Masakazu Terada

Katsuaki Kojima

Akihiro Yamaguchi

Naohisa Niimi

Hirotaka Miyano

Tomoyuki Nanami

Chiho Ogihara

Hiroyasu Iwama

Katsumi Yamazaki

Naoki Hasegawa

Hiroshi Nagasaka

Naoko Sera

Kenzo Hirano

Ryuma Kamikomaki

Gentarou Masuda

Hiroshi Tanioku

A control device controls a water supply device that supplies irrigation water to an open farm field in which a plant grows. The control device includes a storage unit, a calculation unit, and an output unit. The storage unit stores an environment value of each of a plurality of divided areas obtained by dividing the farm field and weather forecast of the farm field. The calculation unit calculates, based on an environment value and the weather forecast, an irrigation schedule in which supply time and amount of the irrigation water individually supplied to each of the plurality of divided areas during the irrigation period are determined. The output unit outputs to the water supply device, a control signal to control supply and no supply of the irrigation water to each of the plurality of divided areas based on the irrigation schedule.

Control device and non-transitory computer readable medium

A semiconductor package includes a semiconductor chip, a heat radiating member on which the semiconductor chip is mounted, and a sealing member sealing the semiconductor chip. The sealing member is made of a liquid crystal polymer.

Semiconductor package, electronic device, and method for manufacturing semiconductor package

A plurality of film insulators having conductive patterns that are formed on surfaces and conductive vias that pass through the film insulators in the direction of thickness are stacked together and collectively subjected to pressure and heat to be formed as a single unit. On one outermost layer of the multilayer board that has been thus formed, a plurality of connection terminals are exposed to the outside, connection bumps of an LSI chip being secured to these connection terminals. On the outermost layer of the opposite side, a multiplicity of metal pads are provided, and a solder ball is secured on each metal pad to form a ball grid array (BGA) structure for connecting to a motherboard.

Package substrate for a semiconductor device having thermoplastic resin layers and conductive patterns

In a printed board having a land as an electrode, a colored thermoplastic resin film is arranged on a land forming surface of a thermoplastic resin member so as to set a difference in light reflectivity between the land and the colored thermoplastic resin film, to be greater than that between the land and the thermoplastic resin member. An opening portion is provided in the colored thermoplastic resin film so that at least a part of the land is exposed from the opening portion. Because the colored thermoplastic resin film is positioned on the circumference portion of the opening portion, the difference in light reflectivity of the land with respect to its circumference portion can be effectively increased. As a result, a recognition ratio of the land can be effectively improved.

Printed circuit board having colored outer layer

Conductive paste containing tin particles and silver particles is packed in a substantially cylindrical via hole formed in a thermoplastic resin film that interposes between conductor patterns and is hot-pressed from both sides. When the metal particles contained in the conductive paste are sintered to form a unified conductive compound, the volume of the conductive paste shrinks. Synchronously, the resin film around the via-hole protrudes into the via-hole. Therefore, the shape of the side wall on the cross-section of the conductive compound provides an arch shape, and a side wall adjacent to a junction part of the conductive compound, which contacts the conductor pattern, is formed with an inclination. Therefore, it is possible to prevent the stress concentration due to deformation of the board.

Method for manufacturing printed wiring board

A manufacturing method of a printed wiring board having an embedded electric device is as follows. A first resin film having an opening or a sheet member having a recess is piled with a plurality of second resin films, on which a plurality of conductive layers is formed. The first and second resin films and the sheet member include thermoplastic resin. An electric device is inserted in the opening or the recess. Then, the piled body including the electric device is pressed and heated to integrate the piled body. When the piled body is pressed and heated, electrodes of the electric device are electrically connected to the conductive layers while the first and second resin films and the sheet member plastically deformed to seal the electric device.

Method for manufacturing printed wiring board with embedded electric device

An inspection apparatus for a base substrate of a multi-layered board irradiates light to the base substrate of a multilayered board to which a protective film is attached. An image of a surface, to which the protective film is attached, is picturized by a camera, so that an acceptability of a state of a via hole is inspected on the basis of a difference between a light reflectivity of the via hole and a light reflectivity of the protective film. The protective film is colored so as to lower its light reflectivity so that the difference between the light reflectivity of the via hole and that of the protective film is clearly generated. Accordingly, on the basis of the image picturized by the camera, the size of the via hole, dusts therein and the acceptability of the via hole can be accurately inspected.

Protective film for base substrates of multi-layered board and method and apparatus for inspecting base substrates

In a manufacturing method of a rigid-flexible printed circuit board, slits for defining two sides of a removing portion are formed in a part of plural resin films, and the plural resin films are stacked and bonded to form a circuit board. Then, a product portion is cut from the circuit board. Before the bonding, a separation sheet is disposed between predetermined adjacent layers of the plural resin films to separate the removing portion from a residual portion of the product portion. Accordingly, while the product portion is cut from the circuit board, the removing portion is separated from the product portion, because the removing portion are defined by the separation sheet, the slits, and a cutting outline of the product portion.

Manufacturing method of rigid-flexible printed circuit board and structure thereof

A heated and pressed printed wiring board is made by filling via holes formed in layers of insulating film of the wiring board with an interlayer conducting material. The insulating film is stacked with conductor patterns, and each conductor pattern closes a via hole. The interlayer conducting material forms a solid conducting material in the via holes after a heating a pressing procedure. The solid conducting material includes two types of conducting materials. The first type of conducting material includes a metal, and the second type of conductive material includes an alloy formed by the metal and conductor metal of the conductor patterns. The conductor patterns are electrically connected reliably without relying on mere mechanical contact.

Method of manufacturing a printed wiring board

Lands formed on a flexible printed circuit board are electrically connected with lands formed on a rigid printed circuit board through solder. At this point, solder resist is formed between neighboring two lands on the rigid printed circuit board, and is terminated with an end portion that is interposed between the rigid printed circuit board and the flexible printed circuit board. Accordingly, even when surplus solder is extruded onto the rigid printed circuit board, the solder resist can prevent solder bridges from being formed between the lands.

Connecting structure of printed circuit boards

Single-sided conductor patterned films are prepared, each of which has a conductor pattern formed only one side of a resin film and via hole filled with conductive paste. A single-sided conductor patterned film which has a conductor pattern formed only one side of a resin film and an opening formed in the resin film so as to expose an electrode is laminated on the single-sided conductor patterned films. Moreover, a cover layer with an opening to expose an electrode is laminated on a bottom surface of the single-sided conductor patterned films to form a laminate. Then, by pressing while heating the laminate, a multilayer substrate having the electrodes at both sides thereof can be produced.

Manufacturing method of multilayer substrate

Printed wiring board and method for manufacturing printed wiring board

A printed wiring board having an embedded electric device is manufactured as follows. A first resin film having an opening or a sheet member having a recess is piled with a plurality of second resin films, on which a plurality of conductive layers are formed. The first and second resin films and the sheet member include thermoplastic resin. An electric device is inserted in the opening or the recess. Then, the piled body including the electric device is pressed and heated to integrate the piled body. When the piled body is pressed and heated, a plurality of electrodes of the electric device are electrically connected to the conductive layers while the first and second resin films and the sheet member plastically deformed to seal the electric device.

Printed wiring board with embedded electric device and method for manufacturing printed wiring board with embedded electric device

Manufacturing method of multilayer substrate and multilayer substrate produced by the manufacturing method

Printed wiring board and method of manufacturing a printed wiring board

Growing community of inventors

Kariya, Japan

Tomohiro Yokochi