Kabushiki Kaisha Toshiba

Mitsubishi Electric Corporation

Tdk Corporation

Mitsubishi Materials Corporation

Tomohiro Tsutsui

Osamu Ikenaga

Akira Inoue

Makoto Takagi

Ryoji Yoshikawa

Katsumi Ono

Akira Nitta

Chinatsu Sanda

Michiaki Onishi

Kenichi Tomioka

A solar panel manufacturing apparatus includes a stage on which a substrate is placed, a pressing plate to press an adhesive applied on the substrate and thereby spread the adhesive via a solar cell arranged at a predetermined position on the adhesive, and to retain the position of the solar cell relative to the substrate, and a curing unit to cure only a part of the adhesive spread between the substrate and the solar cell, while the pressing plate is pressing the adhesive and retaining the position of the solar cell relative to the substrate.

Solar cell panel manufacturing apparatus, solar cell panel manufacturing method, and solar cell panel

According to the sampling method of the aspect of the present invention, the coordinate (location information) of the sampling location on the sampling specimen is generated randomly by the controller, such as a personal computer, of the sampling location display. Based on the location information, the sampling location is displayed on the sampling specimen, which is a part of the recycled raw material, by laser light. Because of this, arbitrariness, in which the operator artificially selects the sampling location, during incremental sampling for setting the average quality of the sampling specimen, such as the average content of valuable metal, can be excluded reliably.

Sampling location displaying apparatus and sampling method

A writing pattern producing method includes obtaining a width of an overlapping portion of first and second patterns, determining whether the width of the overlapping portion is greater than a predetermined width, producing a writing pattern according to a first method when the width of the overlapping portion is determined to be greater than the predetermined width, producing a writing pattern according to a second method when the width of the overlapping portion is determined to be smaller than the predetermined width, the first method being to produce the writing pattern by dividing a composite pattern of the first and second patterns into a plurality of graphic forms which have widths not smaller than the predetermined width and do not overlap with one another, and the second method being to produce the writing pattern from the first and second patterns so that the overlapping portion is written repeatedly.

Writing pattern producing method, photomask manufacturing method, and semiconductor device manufacturing method

A mask forming method includes preparing design data of mask including pattern regions having identical repetition patterns respectively, generating mask pattern data of mask based on the design data, generating inspection control information for controlling inspection of defect on mask based on the mask pattern data, the information including positional information of the pattern regions and inspection sensitivity information of the repetition pattern, providing the inspection control information to mask pattern data, forming mask pattern of mask based on the mask pattern data, and inspecting the mask pattern based on the mask pattern data comprising inspecting portion in the mask pattern different from the pattern regions by Die-to-Database comparison method, the inspecting the portion including selecting portion corresponding to repetition pattern from the mask pattern based on the positional information, and inspecting the selected portion by Die-to-Die comparison method at an inspection sensitivity corresponding to inspection sensitivity information.

Semiconductor mask inspection using die-to-die and die-to-database comparisons

According to a mask defect inspection data generating method, a distance between inspection areas neighboring in a predetermined direction is calculated based on inspection area control information defined in photomask inspection data. It is determined whether or not the calculated distance between inspection areas is less than a predetermined distance. When it is determined that the distance between inspection areas is less than a predetermined distance, the inspection area is combined to produce an optimization inspection area. The produced optimization inspection area information is defined in inspection layout data for making a reference in die-to-database defect inspection.

Mask defect inspection data generating method, mask defect inspection method and mask production method

A method of creating photo mask data includes preparing design data of a photo mask, generating drawing data of the photo mask by using the design data, generating inspection control information configured to control inspection of defect on the photo mask by using the drawing data, and generating drawing and inspection data including the drawing data and the inspection control information by providing the drawing data with the inspection control information.

Method of creating photo mask data, method of photo mask manufacturing, and method of manufacturing semiconductor device

A photo mask includes a mask pattern formed by using a mask exposure pattern to exposure a mask substrate, the mask exposure pattern being formed by adding a proximity effect correction pattern to a design pattern that is a pattern image of design data, the design pattern having a first portion extending in a first direction and a second portion extending in a second direction that is oblique to the first direction, the correction pattern having a first correction portion added to the first portion and a second correction portion added to the second portion, and an edge portion of the second correction portion being shaped to incline to extend in the first direction or a direction orthogonal to the first direction.

Photo mask, method of manufacturing photo mask, and method of generating mask data

A method for forming conductor members includes a step of coating an organic solvent on a conductive film to form an organic solvent layer, a step of coating a resist material on the organic solvent layer to form a resist layer, a step of patterning the resist layer to form a patterned resist layer, and a step of plating a conductive material using the patterned resist layer to form the conductor members.

Growing community of inventors

Tokyo, Japan

Tomohiro Tsutsui