Nitto-Denko Corporation

Tomohiro Taruno

Takayuki Yamamoto

Mitsuhiro Kanada

Amane Mochizuki

Takahiro Fukuoka

Yoshihiro Minamizaki

Tomohide Bamba

Atsushi Takashima

Yoshio Toyoda

Hiroyuki Asao

Shinichi Kanai

Takeshi Matsumura

Masayuki Hodono

Takami Hikita

Shunsuke Shuto

Tomohide Banba

Hidenori Onishi

Akihito Matsutomi

Hiromitsu Morishita

Keisuke Watanabe

Hirofumi Ohno

Shoichi Kimura

Syoichi Kimura

Yoshinori Kouno

A threadlike adhesive sticking apparatus of the present invention includes, a nozzle comprising a pressing unit configured to press a threadlike adhesive against an object, a nozzle displacement unit that is attached to the nozzle and is configured to displace the nozzle by being displaced in a pressing direction, and an absorption mechanism configured to absorb a displacement of the nozzle with respect to a displacement of the nozzle displacement unit in the pressing direction.

Threadlike adhesive sticking apparatus and method for sticking threadlike adhesive

A threadlike adhesive sticking apparatus of the present invention is an adhesive sticking apparatus that presses a threadlike adhesive wound around a winding body against an object while feeding out the threadlike adhesive, and includes an assist mechanism configured to apply an external force in a feeding direction to the threadlike adhesive fed out from the winding body, and a pressing unit configured to press the threadlike adhesive fed out from the winding body against the object.

Threadlike adhesive sticking apparatus and method of sticking threadlike adhesive

A porous liquid crystal polymer sheet and a wiring circuit board have excellent handleability and excellent low repulsive properties. The porous liquid crystal polymer sheethas a porosity P of 20% or more and 90% or less. The porous liquid crystal polymer sheethas a thickness T of 1 &#x3bc;m or more and 240 &#x3bc;m or less.

Porous liquid crystal polymer sheet and wiring circuit board

The present photosensitive resin compositioncomprises a polyamic acid resin, a photosensitive agent, a dispersible compounddispersible in the polyamic acid resin, and a solvent. The porous resin is obtained by removing the solvent from the photosensitive resin compositionto form a composition in which the dispersible compoundis dispersed in the polyamic acid resin, removing the dispersible compound to make the composition porous, and curing the porous photosensitive resin composition. The porous resin enables forming a fine circuit pattern and has a low dielectric constant and, when used as an insulating layer of a circuit board, brings about improved high frequency characteristics.

Photosensitive resin composition, porous resin, circuit board, and wireless suspension board

A removable pressure-sensitive adhesive sheet is disclosed which, when used for fixing adherends thereto in work processing or the like, has such a degree of tackiness as not to peel off the adherends and which, after the work processing or the like, can be easily removed from the adherends without fouling them. The removable pressure-sensitive adhesive sheet comprises a pressure-sensitive adhesive layer constituted of a pressure-sensitive adhesive comprising a polymer in which the content of low-molecular components having a molecular weight of 10or lower is 10% by weight or lower. The polymer constituting the pressure-sensitive adhesive may be an acrylic polymer obtained by polymerizing one or more monomers in liquid or supercritical carbon dioxide. The removable pressure-sensitive adhesive sheet can be used, e.g., as a pressure-sensitive adhesive sheet for semiconductor wafer processing.

Removable pressure-sensitive adhesive sheet

The present photosensitive resin composition comprises a polyamic acid resin , a photosensitive agent, a dispersible compound dispersible in the polyamic acid resin , and a solvent. The porous resin is obtained by removing the solvent from the photosensitive resin composition to form a composition in which the dispersible compound is dispersed in the polyamic acid resin , removing the dispersible compound to make the composition porous, and curing the porous photosensitive resin composition. The porous resin enables forming a fine circuit pattern and has a low dielectric constant and, when used as an insulating layer of a circuit board, brings about improved high frequency characteristics.

A heat-resistant polymer foam is disclosed which has excellent heat resistance, a fine cellular structure, and a low apparent density. The heat-resistant polymer foam comprises a heat-resistant polymer having a glass transition point of 120&deg; C. or higher, e.g., a polyimide or polyether imide, and has an average cell diameter of from 0.01 &mgr;m to less than 10 &mgr;m. This heat-resistant polymer foam can be produced by, for example, impregnating a heat-resistant polymer under pressure with an non-reactive gas such as carbon dioxide, which is in, e.g., a supercritical state, reducing the pressure, and then heating the polymer at a temperature exceeding 120&deg; C. to foam the polymer.

Heat-resistant polymer foam, process for producing the same, and foam substrate

A finely foamed pressure-sensitive adhesive tape or sheet possessing a pressure-sensitive adhesive layer having a fine cell size and cell wall thickness is disclosed. The tape or sheet is obtained by impregnating the pressure-sensitive adhesive tape or sheet with carbon dioxide in a liquid state or a supercritical state, and reducing the pressure to foam the pressure-sensitive adhesive layer. The main component of the pressure-sensitive adhesive layer is, for example, an acrylic resin or a rubber-based resin. The method provides a finely foamed pressure-sensitive adhesive tape or resin possessing a pressure-sensitive adhesive layer having a fine cell structure such that an average cell size d is from 0.01 to 1000 &mgr;m, an average cell wall thickness t is from 0.01 to 2000 &mgr;m, and the ratio t/d is in the range of from 0.5 to 3.5.

Finely foamed pressure-sensitive adhesive tape or sheet and method for producing the same

A porous article having excellent heat resistance, a finely cellular structure, and a low dielectric constant; and a process for producing the porous article which comprises subjecting a polymer composition having a micro-domain structure comprising a continuous polymer phase and dispersed therein a discontinuous phase having an average diameter smaller than 10 &mgr;m to a treatment for removing the ingredient constituting the discontinuous phase by at least one operation selected from vaporization and decomposition and by an extraction operation to thereby make the polymer porous. The ingredient constituting the discontinuous phase has a weight average molecular weight of, e.g., 10,000 or lower. Liquefied carbon dioxide, supercritical carbon dioxide, or the like can be used as an extraction solvent for the ingredient constituting the discontinuous phase.

Porous article and process for producing porous article

Acrylic pressure-sensitive adhesive composition and process for producing the same

Method for producing foamed pressure-sensitive adhesive tape or sheet

A resin tablet for sealing a semiconductor formed by solidifying a molten thermosetting resin composition by cooling, wherein the content of volatile matters in the tablet is 0.05% by weight or less, and the content of gelled particles in the tablet is 0 for the particles of 60 mesh on and is 10 ppm or less for the particles of 100 mesh on.

Resin tablet for sealing semiconductor

A resin tablet for sealing by transfer molding a semiconductor, which is obtained by cooling and solidifying a molten resin composition, is disclosed. The tablet has a compressibility of not less than 98% and a metallic impurity content of less than 50 ppm, preferably with the amount of fine powders of 250 mesh or smaller adhered thereto being controlled below 0.05% by weight based on the tablet and a water content being controlled below 0.1% by weight.

Growing community of inventors

Osaka, Japan

Tomohiro Taruno