Tdk Corporation

The Penn State Research Foundation

Tomohiro Sogabe

Takashi Aoki

Akitoshi Yoshii

Takeo Tsukada

Taisuke Ahiko

Yasushi Enokido

Thomas R Shrout

Minoru Takaya

Hisashi Kobuke

Clive A Randall

Michael T Lanagan

Hitoshi Masumura

Shoichi Iwaya

Junichi Yamazaki

Masaru Nanao

Yoshiaki Akachi

Munemitsu Hamada

Haruo Taguchi

Shigeo Okamoto

Naruki Kataoka

Norimasa Sakamoto

Akira Goshima

Kumiko Iezumi

Shenglei Che

Shigeya Takahashi

Hiroyuki Satoh

Ikuka Chiba

Hyuk-Joon Youn

A method for mounting a chip component includes the steps of: flattening a solder deposit adhering onto a land terminal of a circuit board; forming grooves on the solder deposit simultaneously with or after flattening the solder deposit; coating the solder deposit with a flux; and placing a chip component on the solder deposit with the flux interposed therebetween.

Method for mounting chip component and circuit board

A method for manufacturing spherical ceramic powder is provided. The method includes essentially a spray drying step and a sintering step. In the spray drying step, a spray nozzle is used to spray slurry containing powdered raw material consisting essentially of ceramic ingredients to form liquid droplets, and liquid contents in the liquid droplets are heated and removed to obtain ceramic granular powder. In the sintering step, the ceramic granular powder is sintered to form spherical ceramic powder. The method provides ceramic powder having a mean particle size of about 1-50 &#x3bc;m and a sphericity of about 0.8 or higher, which is suited for mixing with resin material to form a compound. The ceramic powder has high dispersant and filling properties against the resin material.

Method for manufacturing spherical ceramic powder

The present invention provides a production method of spherical oxide powder which includes a feeding step in which a granular powder composed of an oxide composition is fed into a combustion flame together with a carrier gas; a melting step in which said fed granular powder is melted in said combustion flame to obtain a melt; and a solidifying step in which said melt is solidified by being moved and placed outside said combustion flame.

Method of producing spherical oxide powder

The disclosed invention relates to Bi O &mdash;ZnO&mdash;Ta O dielectric compounds and compositions, and to their manufacture. The compounds of the invention have outstanding K, Q, TCF, and TCC. Examples of these properties include a K of between 58 and 80, a low dielectric loss (tan &dgr;<0.003), and a TCC<30 ppm/&deg; C. Ceramic compositions produced include those represented by Bi (ZnTa ) O where 0.57&lE;x&lE;1.0, Bi (ZnTa ) O where 1.0&lE;y&lE;3.0, as well as by Bi (ZnTa ) O where 1.0&lE;y&lE;3.0 with the proviso that y is not&equals;2.0. Solid solutions of compounds defined by the formula r(Bi (Zn Ta ) O )-(1&minus;r)(Bi Zn )(Zn Ta )O )) where 0<r<1 also are produced.

Bismuth pyrochlore microwave dielectric materials

In a multi-functional multilayer device including a body (10) having a varistor section (2) and a capacitor section (3) stacked and integrated therewith, the adhesion between a varistor layer and a dielectric layer is improved when the varistor layer (22) contains zinc oxide as a main component and at least one lanthanide oxide as an auxiliary component, and the dielectric layer (32) contains titanium oxide or lanthanum/titanium oxide as a main component. The device experiences little warpage upon firing when glass is added to the dielectric layer. A high resistivity intermediate layer (5) disposed between the varistor and capacitor sections (2 and 3) prevents the deterioration or loss of varistor and capacitor properties by interdiffusion of elements between the varistor and capacitor sections.

Multi-functional multilayer device and method for making

A semiconductive ceramic composition capable of permitting its resistance-temperature characteristics and resistance to be controlled as desired and a firing temperature of the composition to be lowered to a degree sufficient to facilitate the mass-production at a low cost. The composition contains a main component consisting of SrO, PbO and TiO.sub.2 and is subjected to firing in an oxidizing atmosphere. The composition may contain at least one of SiO.sub.2 and M as a minor component. A variation in amount of the main and minor components permits characteristics and properties of the composition to be varied as desired.

Semiconductive ceramic composition

Growing community of inventors

Tokyo, Japan

Tomohiro Sogabe