Toshiba Lighting & Technology Corporation

Kabushiki Kaisha Toshiba

Tomohiro Sanpei

Masahiro Izumi

Erika Takenaka

Yumiko Hayashida

Kiyoshi Otani

Kazuto Morikawa

Shinji Nogi

Yutaka Honda

Akiko Saito

Kiyoshi Nishimura

Makoto Sakai

Takeshi Hisayasu

Yusuke Shibahara

Shuhei Matsuda

Shigeru Osawa

Junya Murata

Takeo Idezuki

A light emitting apparatus comprising a light reflecting surface made of a metal, a light emitting element which has an electrode and is mounted on the light reflecting surface, and a sealing member which covers the light reflecting surface and the light emitting element. The sealing member has translucency and oxygen gas permeability of 40000 cc/m&#xb7;day or below.

Light emitting apparatus and illumination apparatus

A light emitting module () comprises a module substrate (), a light emitting diode string (), and a sealing member (). The light emitting diode string () includes light emitting diode elements () and bonding wires () which connect the light emitting diode elements (). The light emitting diode element () has a pair of element electrodes () and has a rectangular shape extending in a direction along which the element electrodes () are aligned. The sealing member () is laminated on the module substrate () to seal the light emitting diode string (). The light emitting diode elements () are arranged at intervals in a direction crossing the direction along which the element electrodes () are aligned, and the element electrodes () with the same polarity are aligned to be adjacent to each other in an arrangement direction of the light emitting diode elements () between the light emitting diode elements () adjacent to each other. Each bonding wire () is obliquely wired with respect to the arrangement direction of the light emitting diode elements () to connect the element electrodes () with different polarities of the light emitting diode elements () adjacent to each other.

Light emitting module and illumination apparatus

A lighting device and a lighting fixture of the embodiment of the present invention comprises a thermally conductive main body having a substrate support portion in one end portion, and having a through-hole and a groove portion formed in the substrate support portion, the through-hole penetrating from the one end portion to the other end portion of the main body, the groove portion extending continuously from the through-hole, a substrate mounted with a semiconductor light-emitting device, and disposed on the substrate support portion, an electrical connector connected to the semiconductor light-emitting device, a power supply device housed in the main body and configured to light the semiconductor light-emitting device, a wire connected to the power supply device and to the electrical connector while being inserted through the through-hole and the groove portion, and a base member provided in the other end portion of the main body and connected to the power supply device. Therefore, a lighting device and a lighting fixture of this embodiment of the present invention reduced in size, is configured to be suitable for mass production and is capable of producing a certain luminous flux.

Lighting device having a through-hole and a groove portion formed in the thermally conductive main body

An illumination apparatus includes a plurality of semiconductor light-emitting devices, a reflective layer, a plurality of conductor parts and a translucent adhesive layer. Each of the semiconductor light-emitting devices has a translucent substrate, and a semiconductor light-emitting layer formed on the substrate. The reflective layer has a size on which semiconductor light-emitting devices are arranged at intervals. The conductor parts are provided on the reflective layer, and electrically connected to the semiconductor light-emitting devices. The adhesive layer bonds the substrates of the semiconductor light-emitting devices onto the reflective layer, and thereby holds the semiconductor light-emitting devices on the reflective layer.

Illumination apparatus having a plurality of semiconductor light-emitting devices

According to one embodiment, a light-emitting device includes a substrate, a light reflection layer, a plurality of light-emitting elements, and a sealing member. The substrate includes an insulating layer constituted of epoxy resin using an acid anhydride as a hardening agent or one of a polyimide resin, a polyethylene terephthalate resin, and a fluororesin. The light reflection layer is formed on the insulating layer. The light reflection layer includes a metallic light-reflecting surface higher in optical reflectance than the insulating layer. The light-emitting elements are mounted on the light-reflecting surface. The sealing member is constituted of a material having gas permeability and translucency, and is formed on the insulating layer to seal the light reflection layer and the light-emitting elements.

Light-emitting device and illumination device

An illumination device includes a base board, an insulator, a conductor, a plurality of semiconductor light-emitting elements and a light-transmissive sealing member. The base board includes a surface and projection portions. The projection portion is formed to become gradually thicker from its end toward the surface of the base board. The insulator is formed on the surface. The conductor is formed on the insulator. The semiconductor light-emitting elements are mounted on the projection portions. The semiconductor light-emitting elements are electrically connected to the conductor via connection members. The sealing member covers the insulator, the projection portions, the semiconductor light-emitting elements and the connection members.

Illumination device with semiconductor light-emitting elements

According to one embodiment, a light emitting device includes a ceramics substrate, a metallic thermally-conductive layer formed on the substrate in which the substrate involves no electric connection, a light emitting element mounted on the metallic thermally-conductive layer, and a metallic bonding layer interposed between the metallic thermally-conductive layer and the light emitting element to bond the light emitting element to the metallic thermally-conductive layer.

Light emitting device and lighting apparatus

According to one embodiment, a light-emitting device includes a substrate including power-supply conductors, a frame member, and a sealing member. The power-supply conductors are formed on the substrate. A plurality of light-emitting elements including electrodes are mounted on the substrate. The electrodes of the light-emitting elements adjacent to the power-supply conductors are electrically connected to the power-supply conductors by a plurality of bonding wires. The frame member is made of resin which is coated on the substrate so as to surround the light-emitting elements and the bonding wires. The sealing member is filled in an area surrounded by the frame member and seals the light-emitting elements and the bonding wires.

Light-emitting device.having a frame member surrounding light-emitting elements and illumination device utilizing light-emitting device

A base body having a base body portion and a plurality of heat radiating fins disposed on the circumference of the base body portion is provided. On one end side of the base body, a light-emitting module having semiconductor light-emitting elements, and a globe that covers the light-emitting module are provided. A cap is provided on the other end side of the base boy. A lighting circuit is housed between the base body and the cap. The lamp total length from the globe to the cap is 70 to 120 mm, and the area of a surface of the base body which is exposed to the outside per 1 W of power charged to the light-emitting module is 20.5 to 24.4 cm/W.

Self-ballasted lamp and lighting equipment

According to one embodiment, a light-emitting module includes a module substrate, a reflective layer, conductive layers, a light-emitting element, and a sealing member. A reflective layer is provided on a surface of an insulating layer of the module substrate, and the conductive layers are provided in the vicinity of the reflective layer. Further, the light-emitting element is provided on the reflective layer. Moreover, the translucent sealing member has translucency and bury the reflective layer, the conductive layers, and the light-emitting element. The ratio of the area occupied by the reflective layer and the conductive layers to the sealed region sealed by the sealing member is equal to or greater than 80%.

Growing community of inventors

Yokosuka, Japan

Tomohiro Sanpei