Rohm Co., Ltd.

Tomohiro Murayama

Yasuo Kanetake

An encapsulated electronic part has a resin body and a projecting holding member removably attached to the resin body which may be made of the same resin and formed at the same time as the resin body. The encapsulated electronic part may be conveyed to a test device or to a circuit board and mounted thereon by gripping the holding member with a holding device. The holding member may have a shape conforming to the shape of the holding device and may be separated from the resin body by moving the holding device while holding the resin body stationary.

Encapsulated electronic component containing a holding member

A process for manufacturing an encapsulated electronic part having a resin body and a projecting holding member removably attached to the resin body which may be made of the same resin and formed at the same time as the resin body. The encapsulated electronic part may be conveyed to a test device or to a circuit board and mounted thereon by gripping the holding member with a holding device. The holding member may have a shape conforming to the shape of the holding device and may be separated from the resin body by moving the holding device while holding the resin body stationary.

Process for forming an encapsulated electronic component having an

A process for manufacturing an encapsulated electronic part having a resin body and an inwardly tapered projecting holding member removably attached to the resin body which may be made of the same resin and formed at the same time as the resin body, The encapsulated electronic part may be conveyed to a test device or to a circuit board and mounted thereon by gripping the holding member with a holding device. The holding member may have a shape conforming to the shape of the holding device and may be separated from the resin body by moving the holding device while holding the resin body stationary.

Process of conveying an encapsulated electronic component by engaging an

A solid electrolytic capacitor is constructed by a capacitor element body, a metal rod extended through the central part of the element body, an anode member, and an insulating layer placed between the flange part of the anode member and the element body. The capacitor element body consists of a chip-like porous solid formed by shaping and sintering rectifying metal particles, the porous solid having a dielectric layer and a solid electrolytic layer both being formed thereon. The anode member includes a protruded part and a flange part, the end face of the protruded part being brought into contact and connected with one of the end faces of the metal rod. A method of manufacturing solid electrolytic capacitors thus constructed is also disclosed.

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Fukuoka, Japan

Tomohiro Murayama