Toyoda Gosei Co., Ltd.

Toyota Gosei Co., Ltd.

Tomohiro Miwa

Shota Shimonishi

Shigeo Takeda

Daisuke Kato

Hiroyuki Tajima

Hideaki Kato

Satomi Seki

Yosuke Tsuchiya

Kazuhiro Sakai

Yoshinori Masatsugu

Shota Yamamori

Yukihiro Demukai

Ikuhiro Oya

A light emitting device includes a light emitting element that emits a light having a peak emission wavelength in a wavelength range of not less than 410 nm and not more than 425 nm, and a phosphor emitting a fluorescence having a peak at a longer wavelength side than the peak emission wavelength of light emitted from the light emitting element. A general color rendering index Ra of fluorescence emitted from the phosphor is not less than 95. A general color rendering index Ra of mixed light of light emitted from the light emitting element and fluorescence emitted from the phosphor is higher than a general color rendering index Ra of fluorescence emitted from the phosphor. A color rendering index Rf of the mixed light is not less than 96.

Light emitting device

A light emitting device includes a plurality of LED strings connected in parallel, wherein: each of the LED strings includes a plurality of LED chips connected in series to each other; in the LED string, ultraviolet light LED chips and blue LED chips or violet LED chips and blue LED chips are connected in series to each other; and the number of the ultraviolet light LED chips or the number of the violet LED chips is the same as the number of the blue LED chips in each of the plurality of LED strings.

A light emitting device includes a substrate, a plurality of light emitting elements disposed on the substrate, a transparent resin embedded in a space between the plurality of light emitting elements, and a phosphor containing resin layer formed on the plurality of light emitting elements and the transparent resin. The transparent resin includes no phosphor.

Light emitting device and method of manufacturing the same

A light emitting device includes a light emitting element that emits a light having a peak wavelength of not less than 411 nm and not more than 421 nm, and a phosphor that emits a fluorescence having a longer peak wavelength than the peak wavelength of the light emitted from the light emitting element. An emission spectrum of only the light emitting element and an emission spectrum of only the phosphor overlap each other while having an overlap width of not less than 71 nm and not more than 81 nm. The overlap width is defined as a wavelength difference between a long wavelength side point at a 0.1% height of a peak height of the emission spectrum of only the light emitting element and a short wavelength side point at a 0.1% height of a highest peak of the emission spectrum of only the phosphor.

A light emitting device includes a wiring substrate, a light emitting element disposed on a front surface of the wiring substrate, and a conductor pattern formed on a rear surface of the wiring substrate. The conductor pattern includes a slit or a hole that fails to separate the conductor pattern into two parts.

Light emitting device and electronic component

A light emitting device includes a first phosphor emitting a fluorescence having a peak emission wavelength of not less than 445 nm and not more than 490 nm, a second phosphor emitting a fluorescence having a peak emission wavelength of not less than 491 nm and not more than 600 nm, a third phosphor emitting a fluorescence having a peak emission wavelength of not less than 601 nm and not more than 670 nm, and a light emitting element that emits a light having a peak emission wavelength at a shorter wavelength side than the peak emission wavelength of the first phosphor. 0.586&#x2264;x&#x2264;0.734, 0.017&#x2264;y&#x2264;0.081, 0.239&#x2264;z&#x2264;0.384 and x+y+z=1 are satisfied, where x, y, z are defined as mass ratios of the first, second and third phosphors, respectively, to a total mass of the first, second and third phosphors.

Light emitting device excellent in color rendering property for emitting light closer to sunlight

A light emitting device includes a first light emitting element that outputs a first emitted light having a first peak wavelength, a second light emitting element that outputs a second emitted light having a second peak wavelength, and a phosphor layer including a plurality of phosphors, which is disposed on the first and second light emitting elements. The phosphor layer receives the first and second emitted light and outputs a plurality of emitted light based on the plurality of phosphors so as to form a first synthesized emission spectrum. The second light emitting element includes an emission spectrum to reduce a depth of a deepest dip of at least one dip in a second synthesized emission spectrum that is formed by removing an emission spectrum of the second emitted light from the first synthesized emission spectrum.

A light-emitting device includes a plurality of light-emitting elements mounted on a wiring board, and a plurality of wirings that are provided on the wiring board and each connect predetermined ones of the plurality of light-emitting elements in series. A central element-connection wiring has a longest wiring length among the plurality of wirings, and a voltage applied to a central element is a lowest one of voltages applied to the plurality of light-emitting elements. A closest one of the plurality of light-emitting elements to a center of an element mounting region of the wiring board is defined as the central element, and a wiring that connects in series the central element is defined as the central element-connection wiring.

Light-emitting device

The present invention provides a LED package in which deterioration in heat radiation performance is suppressed. The LED package comprises a substrate, a light-emitting device mounted on the substrate, sealing resin sealing the light-emitting device and mixed with phosphor, a heat sink provided on a rear surface of the substrate, and a rear electrode provided on the rear surface of the substrate and electrically connected to the light-emitting device. The heat sink is provided at a distance from the rear electrode in a region except for the rear electrode. The heat sink is divided into eighteen small heat sinks by grooves formed in a rectangular lattice pattern. When the LED package is mounted on a mounting substrate, the gas generated from solder is efficiently discharged through the grooves to the outside, thereby suppressing the generation of air bubbles between the heat sink and the solder.

LED package

A light-emitting device includes a substrate, a first light-emitting element mounted on the substrate, an annular transparent dam formed on the substrate so as to surround the first light-emitting element, a second light-emitting element that is mounted on the substrate so as to be embedded in an interior of the dam and that has a shorter peak emission wavelength than that of the first light-emitting element, and a sealing material filled inside the dam so as to seal the first light-emitting element.

A light emitting device includes: a heat dissipative board; a wiring board which adheres and is fixed to the heat dissipative board and in which a through-hole is formed; a light-emitting element which is mounted on a front surface of the heat dissipative board which is exposed through the through-hole of the wiring board; a bonding wire which connects the light-emitting element and the wiring board; and a light-reflecting member which covers a surface of an inner peripheral wall of the through-hole excluding disposition places of the light-emitting element and the bonding wire.

A light-emitting device includes a first light-emitting element, a second light-emitting element, a third light-emitting element placed between the first and second light-emitting elements, and a bonding wire passing directly over the third light-emitting element and connecting the first light-emitting element with the second light-emitting element.

Light-emitting device and method of manufacturing the same

A method for manufacturing a light emitting device includes providing a wafer including a substrate, a light emitting structure layer and a plurality of electrodes, forming a phosphor layer so as to cover a surface of the wafer on a side of the substrate, dividing the wafer and the phosphor layer so as to form a plurality of light emitting elements, measuring a luminescent chromaticity of the plurality of light emitting elements so as to classify into a first light emitting element having a luminescent chromaticity within a required chromaticity range and a second light emitting element having a luminescent chromaticity outside the required chromaticity range, and forming a second light emitting device that includes the plurality ones of the second light emitting element and the luminescent chromaticity within the required chromaticity range by using the second light emitting element.

Method for manufacturing light emitting device

A wiring substrate includes a wiring pattern that is formed on a surface of a conductive board via an insulation layer and an extension part that is extended from the wiring pattern. The extension part is disposed in a portion located immediately below a detachable connector. The detachable connector is connected to a fixed connector mounted on the wiring substrate and connected and fixed to the wiring pattern.

Wiring substrate and substrate module

A light emitting device includes a heat dissipation board, a wiring board that is bonded and fixed to the heat dissipation board and formed with a through-hole, a semiconductor light emitting element that is mounted on a face of the heat dissipation board, the face being exposed through the through-hole of the wiring board, and a light reflecting member that covers a portion of an inner peripheral wall surface of the through-hole of the wiring board, the portion being squarely opposed to a side surface of the semiconductor light emitting element.

Light emitting member having a wiring board with through hole exposing a light emitting semiconductor element with a light reflecting member covering a peripheral wall portion of the through hole

Growing community of inventors

Kiyosu, Japan

Tomohiro Miwa