Mitsubishi Electric Corporation

Tomohiro Kyoto

Tomotaka Katsura

Daisuke Morita

Daiji Morita

Hiroyuki Takeuchi

Junichi Nishimae

Yumi Genda

Hiroshi Kikuchi

Takeshi Morimoto

Satoshi Nishida

Naoki Miyamoto

Kimio Shigihara

Masato Kawasaki

Hiroaki Kurokawa

Nobutaka Kobayashi

Kenji Kumamoto

Kyohei Ishikawa

Keisuke Furuta

Kouji Funaoka

Taira Ogita

Hideyasu Machii

Mototoshi Kumaoka

Takayuki Nakayama

A laser beam machine includes: a laser oscillator that outputs laser light; a transmission fiber through which the laser light output from the laser oscillator propagates; a first adjuster that is disposed between the laser oscillator and an incidence end of the transmission fiber and changes an incidence numerical aperture of the laser light incident to the incidence end of the transmission fiber; a second adjuster that converges the laser light and changes a zoom magnification of the laser light between an emission end of the transmission fiber and a workpiece; and a controller that performs adjustment of a beam diameter of the laser light at an image forming position of the laser light and adjustment of an emission numerical aperture of the laser light emitted from the emission end of the transmission fiber independently of each other, by changing the incidence numerical aperture.

Laser beam machine and method for controlling laser beam machine

A semiconductor laser machine includes a semiconductor laser element including a first end face that emits a laser beam and a second end face that is opposite the first end face; a heat sink; and a sub-mount securing the semiconductor laser element to the heat sink. The sub-mount includes a substrate that serves as a thermal stress reliever, a solder layer joined to the semiconductor laser element, and a junction layer formed between the substrate and the solder layer. Compared with the semiconductor laser element, the substrate is extended in a rearward direction that is from the first end face toward the second end face. As for the solder layer and the junction layer, a portion of at least the solder layer is removed behind the second end face.

Semiconductor laser machine

A laser device includes: a plurality of laser diodes that emit laser beams having different wavelengths; a partial reflection mirror that resonates the plurality of laser beams emitted by the plurality of laser diodes; and a wavelength dispersion element that causes the plurality of laser beams incident from the plurality of laser diodes in different orientations of optical axes of the laser beams to travel to the mirror with the optical axes aligned. Each of the plurality of laser diodes is integrally formed with an adjustment component that is rotatable around an emission end of the laser diode.

Laser device and laser processing machine

An optical path cover is located on an optical path through which beam light travels. The optical path cover includes a cylindrical portion through which the beam light is capable of passing. A plurality of protruding portions are formed on inner walls of the cylindrical portion, the inner walls facing toward a side of an optical axis of the beam light. The protruding portions, each of which has a convex shape in cross-section taken perpendicularly to the optical axis, are arranged next to each other with the convex shape facing toward the side of the optical axis. Each of the protruding portions has an elongated shape extending along the optical axis.

Laser device

A wavelength combining laser apparatus includes: a semiconductor laser emitting laser beams in an optical-axial direction perpendicular to a laser beam combining direction; a wavelength combining element combining the laser beams in the laser beam combining direction into a single laser beam; a cross-coupling reduction optical system having positive power in the laser beam combining direction perpendicular to an optical axis of the single laser beam output from the wavelength combining element; and a partially-reflective mirror reflecting the single laser beam having passed through the cross-coupling reduction optical system and also allowing the single laser beam to transmit through and exit the partially-reflective mirror. The cross-coupling reduction optical system is disposed to image the light emitting end face on the partially-reflective mirror by causing the light emitting end face to be conjugate to the partially-reflective mirror in a plane formed by the optical axis and the laser beam combining direction.

Wavelength combining laser apparatus

A laser oscillation device includes a laser oscillation unit, which is a laser oscillation part that generates multiple first laser beams having different wavelengths from one another, multiple sensors having different sensitivity characteristics from one another each representing light-receiving sensitivity for the wavelengths of the multiple first laser beams, to each output first voltages dependent on outputs of the multiple first laser beams. The laser oscillation device includes a computing unit that corrects the multiple first voltages using the sensitivity characteristics of the multiple sensors, and controls the laser oscillation unit based on multiple second voltages which correspond to multiple first voltages obtained after the correction.

Laser oscillation device

A laser device, including multiple laser modules, includes a plurality of drive power units that drive the laser modules, a plurality of output detection units that detect laser outputs from the laser modules, and output detected values as first output signals, a coupled output detection unit that detects a total laser output after coupling of a plurality of the laser outputs, and outputs a detected value as a second output signal, a computing unit that sets multiple output correction factors for correspondingly controlling the laser modules using the plurality of first output signals and the second output signal, and a control unit that controls the plurality of drive power units using the multiple output correction factors. The multiple output correction factors are each set to allow the total laser output to be maintained at a constant value.

Laser device, laser machining apparatus, and method for controlling output of laser device

A laser device includes a plurality of laser diodes that generate laser light beams having different wavelengths from each other, a partial reflective mirror constituting a resonator along with the laser diodes, a wavelength dispersive element set in the resonator, which combines parts of the laser light beams outputted by the laser diodes to each other, emits the combined parts of the laser light beams as a first laser light beam toward the partial reflective mirror, and emits other parts of the laser light beams as second laser light beams in directions different from the direction toward the partial reflective mirror, and an output detecting unit detecting intensities of the second laser light beams.

A laser device causes, with a plurality of laser media that generate laser beams having wavelengths different from one another, a convergent lens to cause laser beams each emitted from the plurality of laser media to overlap one another on a dispersive element to form a single combined beam. The dispersive element is positioned where the plurality of laser beams are caused to overlap one another by the convergent lens to form a single beam, causes a portion of the plurality of laser beams to return back toward the laser media as a first laser beam flux, and outputs another portion of the plurality of laser beams as a second laser beam flux having a single optical axis.

A laser beam machine includes a number of laser modules that each generate a laser beam and a combiner that collects a plurality of laser beams generated from the laser modules to output one laser beam. The laser beam machine further includes a plurality of driving power supplies that supply power to the laser modules, respectively, a calculation device that calculates a driving condition for each of the laser modules according to a received machining condition, and a power-supply control apparatus that causes the driving power supplies to supply power to the laser modules in accordance with the driving condition. The calculation device controls the power-supply control apparatus to reduce differences in integrated laser-output times of the laser beams generated by the laser modules.

Laser beam machine and calculation device for laser beam machine

A laser oscillation apparatus includes a wave plate and a diffraction grating disposed between a laser beam source and a partial reflection mirror. The wave plate changes polarization directions of laser beams emitted from semiconductor lasers to a second direction perpendicular to a first direction. The diffraction grating is disposed at a position where laser beams polarized in the first direction are superposed into one beam and laser beams whose polarization directions are changed to the second direction are superposed into one beam, superposes laser beams polarized in the first direction to have one optical axis, superposes laser beams polarized in the second direction to have one optical axis, and outputs superposed laser beams toward the partial reflection mirror. The laser oscillation apparatus includes a birefringent element to combine laser beams having mutually different optical axes output from the partial reflection mirror into one laser beams having one optical axis.

Laser oscillation apparatus

In a laser processing machineincluding a plurality of element units containing at least a laser blower unit, an optical-path purge unit, and a temperature controlling unit, a measurement unit and a control unitare provided. The measurement unit measures an elapsed time from a final trigger at which a laser processing operation of the laser processing machine has stopped and no user operation is applied with respect to the laser processing machine. The control unitstops the element units based on the elapsed time after the final trigger, when a condition specified for each of the element units is satisfied.

Control device and control method for laser processing machine

Provided is a laser machining device that includes a laser oscillator that oscillates a laser beam; a machining head that irradiates the laser beam emitted from the laser oscillator onto a workpiece; and an optical path duct that includes an optical system that guides the laser beam from the laser oscillator to the machining head. A plurality of operation modes, in each of which a parameter is varied when being used when the workpiece is being machined, are provided for the laser machining device; and an energy saving mode, in which the output range of the laser beam is set to be less than that in other operation modes, is included in the operation modes.

Laser machining device

A blower apparatus includes a blower casing; an elastic member for mounting a mounting portion that projects on an outer circumferential portion of the blower casing, to a blower support member disposed on the inlet side of the mounting portion; and a flange portion provided on the inlet side of the mounting portion. At least three elastic members are disposed in the same plane that is almost orthogonal to a rotation shaft, and adhesion surfaces are provided on both ends, in the rotation shaft direction, of each elastic member. The mounting portion is fixed to one of the adhesion surfaces, and the blower support member is fixed to the other of the adhesion surfaces. The flange portion is provided so as to oppose the blower support member through a gap having a thickness less than a thickness, in the rotation shaft direction, of the elastic member.

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Tokyo, Japan

Tomohiro Kyoto