Jsr Corporation

Tomohiro Kakizawa

Takakazu Kimoto

Hiroshi Ikeda

Junichi Takahashi

Tomoki Nagai

Tsutomu Shimokawa

Yusuke Asano

Mitsuo Sato

Takayoshi Abe

Norihiko Sugie

Yasuhiko Matsuda

Mitsuo Satou

A radiation-sensitive resin composition includes a polymer component, a radiation-sensitive acid generating agent, and a nitrogen-containing compound having a ring structure. The polymer component includes, in an identical polymer or different polymers, a first structural unit represented by a formula (1) and a second structural unit represented by a formula (2). Rrepresents a hydrogen atom or a methyl group. Z is a group which represents a divalent monocyclic alicyclic hydrocarbon group taken together with R. Rrepresents a carbon atom. Rrepresents a methyl group or an ethyl group. Rrepresents a hydrogen atom or a methyl group. X is a group which represents a divalent bridged alicyclic hydrocarbon group having no less than 10 carbon atoms taken together with R. Rrepresents a carbon atom. Rrepresents a branched alkyl group having 3 or 4 carbon atoms. 

Radiation-sensitive resin composition, polymer, and resist pattern-forming method

A radiation sensitive resin composition includes a first polymer having a group represented by a following formula (1), and a radiation sensitive acid generator. n is an integer of 2 to 4. X represents a single bond or a bivalent organic group. A represents a (n+1) valent linking group. Each Q independently represents a group that includes an alkali-dissociable group. 

Radiation sensitive resin composition, method for forming a pattern, polymer and compound

A radiation-sensitive resin composition includes a first polymer, a second polymer and a radiation-sensitive acid generator. The first polymer includes a repeating unit (I) shown by the following general formula (1), a fluorine atom in a molecule of the first polymer. The second a polymer includes an acid-labile group, and is insoluble or scarcely soluble in an alkali. Rrepresents a hydrogen atom or the like, each of Xand Rrepresents a single bond or the like, Rrepresents a hydrogen atom or the like, and Rrepresents an acid-labile group. 

Radiation-sensitive resin composition, resist pattern formation method, and polymer

A pattern forming method includes (1) selectively exposing a first resist layer, and developing the exposed first resist layer to form a first pattern, (2) applying a resin composition containing a hydroxyl group-containing resin and a solvent to the first pattern, baking the applied resin composition, and developing the baked resin composition to form a second pattern, the hydroxyl group-containing resin becoming insoluble or scarcely soluble in a developer when baked, and (3) totally or selectively exposing the second pattern to make the second pattern partly soluble in the developer, and developing the exposed second pattern to form a third pattern in which at least a hole or a groove is formed in the second pattern.

Method for pattern formation and resin composition for use in the method

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Tokyo, Japan

Tomohiro Kakizawa