Mitsubishi Denki Kabushiki Kaisha

Spiral Inc.

Hitachi, Ltd.

Tomohiro Ishikawa

Masashi Ueno

Masafumi Kimata

Yoshiyuki Nakaki

Hisatoshi Hata

Kazuhiko Tsutsumi

Takanori Sone

Osamu Kaneda

Satoshi Hishida

Hirofumi Yagi

Fumiaki Ukaji

A control systemfor a flying object includes at least one marker, which corresponds to control information related to the control of the flying object, a reading unitfor reading the control information, and a flight information transmitting unitfor transmitting flight information to the flying object based on the control information read by the reading unit.

Control system for a flying object, control device therefor, and marker thereof

A thermal infrared detector includes a substrate; a temperature sensor having electrical characteristics changed in accordance with changes in temperature caused by infrared absorption; heat-insulating supporting legs supporting and thermally insulating the temperature sensor and serving as signal lines for reading out electrical signals from the temperature sensor; and an infrared absorption layer in thermal contact the temperature sensor. Each of the temperature sensor, the heat-insulating supporting legs, and the infrared absorption layer is in a different plane and the planes are spatially separated from each other.

Thermal infrared detector and infrared focal plane array

An infrared detector includes a semiconductor substrate having a hollow, a single crystal silicon thin film opposite the hollow at a distance from the semiconductor substrate, thermoelectric converters embedded in the single crystal silicon thin film and converting heat energy generated by infrared light irradiating the single crystal silicon thin film into an electric signal, a first connecting layer embedded in the single crystal silicon thin film and electrically connecting the thermoelectric converters to each other and a second connecting layer for transmitting the electric signal output by the thermoelectric converters to a wire in the semiconductor substrate. In the infrared detector, at least one of the first and second connecting layers is a silicon compound.

Infrared detector

An infrared detector includes an optical cavity structure with an infrared reflection film on a semiconductor substrate. The infrared reflection film and an infrared absorption film provide high efficiency infrared detection.

Infrared detector and method of making the infrared detector

A thermal infrared-detector array has semiconductor-junction elements as detectors. It has high sensitivity and low noise and is fabricated in semiconductor-fabrication process. The semiconductor-junction elements are located in a monocrystalline silicon layer overlying a silicon-oxide layer on a monocrystalline silicon substrate. A signal-output circuit reading out signals from the detector elements includes transistors located on the monocrystalline silicon substrate.

Thermal infrared-detector array and method of fabrication thereof

An infrared sensor includes a first infrared sensing element separated by a dielectric layer from on a silicon substrate and thermally isolated from the substrate by a void in the dielectric layer. The sensor has a second temperature sensing element which detects the temperature of the whole sensor. The output difference between the first and second sensor elements is used as gate/source voltage of a MOSFET. The current variation of the MOSFET is read out as a discharge from a capacitor connected to the MOSFET. The noise in the sensor is suppressed, and performance is improved. An infrared sensor array includes the sensors arranged in an array.

Infrared sensor and infrared sensor array using the same

A two-dimensional infrared focal plane array of temperature detecting units is provided with the temperature detecting units being arranged for every pixel in a two-dimensional arrangement on a semiconductor substrate. Each temperature detecting unit is formed integrally with readout circuitry. Each temperature detecting unit further has a temperature detecting portion which is supported by support legs made of a high thermal resistance material to reduce heat flow to the semiconductor substrate. Each temperature detecting unit also has a temperature detecting element with an infrared ray absorbing portion which is spliced by at least one splicing pillar with the temperature detecting element.

Infrared focal plane array

A sensor element provided with a silicon substrate having a semiconductor circuit, a sensing-element portion formed on the silicon substrate and connected to the semiconductor circuit, and a cavity portion formed by removing a silicon substrate portion below the sensing-element portion, in which a removal resistance region having resistance against substrate removal is provided in the silicon substrate between the semiconductor circuit and the cavity portion.

Sensor element with removal resistance region

In a IR detector and a fabrication method thereof, the IR detector has a insulating thin film (3) made up of insulating material, many semiconductor layers (1) each having an island shape formed on the insulating thin film (3), a forward bias connection section (5) and a backward bias connection section (6) formed for each semiconductor layer (1) to be forward and backward biases to an external bias voltage, and a metal thin film (2) for electrically connecting the semiconductor layers (1) to each other through both the forward bias connection section and the backward bias connection section (5 and 6).

Infrared detector and fabrication method thereof

An infrared sensor includes a substrate, an insulator layer formed on the substrate, and a heat-sensitive semiconductor layer having a temperature dependent electrical resistance with a relatively large temperature coefficient of resistance. In order to improve sensitivity of the heat-sensitive semiconductor layer for detecting infrared rays, high concentration impurity semiconductor regions are positioned on either side of the semiconductor layer to form a semiconductor section. The high concentration impurity semiconductor sections have a higher absorption coefficient of infrared rays than the semiconductor layer. Thus, the semiconductor section itself both detects and absorbs infrared rays with or without providing any heat-absorbing layer. Further, electrodes are connected to each high-concentration impurity layer, which form an ohmic contact therewith.

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Tokyo, Japan

Tomohiro Ishikawa