Mitsubishi Denki Kabushiki Kaisha

Mitsubishi Heavy Industries Limited

Mitsubishi Power, Ltd.

Thine Electronics, Inc.

The Furukawa Electric Co., Ltd.

Tomohiro Ishida

Koji Kato

Hikaru Kurosaki

Toshifumi Kanno

Megumi Matsuura

Hiroyuki Sakamoto

Takashi Yamashita

Hiroshi Hayashi

Shigeru Harada

Makoto Kondo

Kenichi Nakamura

Eisaku Ito

Takashi Shigematsu

Takemi Endoh

Katsuhisa Hamada

Tomoyuki Onishi

Takumi Matsumura

Tomohisa Higuchi

Shigeyuki Furuta

Hiroshi Katsuura

Ryota Fujisawa

Kenji Taniguchi

A rotor blade is a rotor blade to be attached to a rotor shaft rotatable about an axis, and includes a blade body extending in a radial direction with respect to the axis and having a blade-shaped cross-section orthogonal to the radial direction; a fillet portion provided on a radial outer side of the blade body and having a hollow portion formed therein; a shroud provided on a radial outer side of the fillet portion and extending in a circumferential direction; and a seal fin projecting from the shroud to an outer circumferential side and extending in a direction intersecting the blade body when viewed from the radial direction. A wall thickness on a suction side of the fillet portion is greater than a wall thickness on a pressure side of the fillet portion on a leading edge side of the blade body as demarcated by an intersection portion between the blade body and the seal fin serving as a boundary.

Rotor blade

A transmitterB always transmits a signal (data in which a dock is embedded) generated by the serializerto the communication link. The receiverB includes a recovery circuita deserializera selectorand a training signal generatorThe training signal generatorgenerates and outputs a training signal for frequency synchronization of the recovering operation of the recovery circuitThe selectorreceives the signal from the transmitterB via the communication link and receives the training signal output from the training signal generatorThe selectorselects and outputs either the received signal or the training signal according to the level of the lock signal output from the recovery circuit

Reception device and transmission and reception system

A sealing mechanism including a first seal member, a second seal member arranged so as to face the first seal member, and a deformed nucleus member arranged in a space formed at least partially between the first seal member and the second seal member, and becoming a nucleus of deformation in the sealing mechanism. The deformed nucleus member is configured by a combination of rod-like members and plate-like members respectively formed from a plurality of materials having different linear expansion coefficients, and is fixed to each of the first seal member and the seal member. The deformed nucleus member contracts in at least one direction on a cross-section of the seal groove, along with an increase in temperature of the deformed nucleus member. The first seal member and the second seal member respectively have abutment surfaces abutting on an inner surface of the seal groove or the facing surfaces.

Sealing mechanism

A rotor blade attached to a rotor shaft rotatable around an axis includes: a blade body extending in a radial direction with respect to the axis and having a blade-shaped cross section orthogonal to the radial direction; a shroud provided at an end of the blade body on a radial outer side, and a seal fin protruding from the shroud toward an outer circumferential side, and the seal fin includes: a seal fin body extending in a plate shape in a circumferential direction; and a reinforcing portion provided on at least one plate surface of the seal fin body to increase a thickness of the seal fin, the reinforcing portion gradually increasing in dimension in the radial direction toward the center in the circumferential direction.

Rotor blade and axial-flow rotary machine

A rotor blade includes a blade body which has an airfoil shape and a shroudwhich is formed in an end portion of the blade body. The shroud includes a shroud cover and a seal fin which protrudes from the shroud cover toward a radial outside and extends in a direction having a direction component in a circumferential direction. A front end of the seal fin extends in the circumferential direction and a base end of the seal fin extends in a direction having a direction component in the circumferential direction. A part of the seal fin in the circumferential direction forms a shift portion. An axial center position of a base end of the shift portion is different from an axial center position of a front end of the shift portion in the axial direction.

Rotor blade and axial flow rotating machine with the same

In a rotary machine that includes rotating body including a rotating-body main body and a pair of rotor shaft ends fixed to the both outer sides in the shaft direction of the rotating-body main body; a casing accommodating the rotating-body main body and being penetrated by the rotor shaft ends; a bearing rotatably supporting the rotor shaft ends and having a bearing face being provided with lubricant fluid from a lubricant line; and the support part supporting the casing, the support part is cooled through heat exchanging between the lubricant fluid the support part.

Cooling device for casing support part of rotary machine, rotary machine, and cooling method for casing support part of rotary machine

A first polycide lead, which is formed on a silicon substrate, consists of a first doped polysilicon layer and a first tungsten silicide layer that is formed on the first doped polysilicon layer. An interlayer insulating film, which is formed on the silicon substrate, has an opening that reaches the first doped polysilicon layer. A second polycide lead, which is formed on the interlayer insulating film, consists of a second doped polysilicon layer that is connected to the first polycide lead in the opening and a second tungsten silicide layer that is formed on the second doped polysilicon layer. In the opening, the first and second doped polysilicon layers are in contact with each other at the side surfaces of the first polycide lead.

Semiconductor device having an improved lead connection structure and

A semiconductor device has a conductive interconnection layer formed on a semiconductor substrate covered with a protection insulation film. A pad electrode opening is provided in the protection insulation film so that the surface of the conductive interconnection layer is exposed in the region which becomes the pad electrode. The conductive interconnection layer is electrically connected to an external terminal by a bonding wire. At least the surface of the protection insulation film in the proximity of the pad electrode opening and the inner peripheral side face of the pad electrode opening are covered with an elastic insulation film. The pad electrode opening is covered with the bonding wire. Since the conductive interconnection layer is not exposed at the pad electrode opening according to this structure, the phenomenon of moisture intruding into the pad electrode opening to corrode the conductive interconnection layer is prevented to improve reliability. The semiconductor device of this structure is formed by covering the inner surface and its proximity of the pad electrode opening with an elastic insulation film, forming an opening in the elastic insulation film at the bottom of the pad electrode opening, and connecting the pad electrode to an external terminal by wire bonding.

Semiconductor device and method of manufacturing thereof

Semiconductor device with bonding pad electrode

In a multi-layer aluminum interconnection structure, improved reliability as well as a stable via-hole resistance are achieved by promoting mixing at an interface between aluminum interconnection layers and improving coverage of an upper aluminum interconnection layer at a connection hole. A first aluminum interconnection layer is electrically connected to a second aluminum interconnection layer through a connection hole. The second aluminum interconnection layer is provided with a titanium film, a titanium nitride film and aluminum alloy film. A connection hole is filled with a tungsten film. A tungsten film is formed on a surface of the first aluminum interconnection layer. The titanium film is in contact with the tungsten film through the connection hole.

Manufacturing method of interconnection structure of semiconductor device

In a multi-layer aluminum interconnection structure, improved reliability as well as a stable via-hole resistance are achieved by promoting mixing at an interface between aluminum-containing interconnection layers and improving coverage of an upper aluminum interconnection layer at a connection hole. A first interconnection layer is electrically connected to a second interconnection layer through a connection hole. The second interconnection layer is provided with a titanium film, a titanium nitride film and aluminum alloy film. A connection hole is filled with a tungsten film. A tungsten film is formed on a surface of the first interconnection layer. The titanium film is in contact with the tungsten film through the connection hole.

Growing community of inventors

Tokyo, Japan

Tomohiro Ishida