Nichia Corporation

Dai Nippon Printing Co., Ltd.

Nichsa Corporation

Tomohiro Ikeda

Yohei Inayoshi

Masaaki Katsumata

Motokazu Yamada

Yasuo Fujikawa

Takuya Wasa

Yumiko Kameshima

Yosuke Nakayama

Daisuke Matsuura

Naoto Yamanaka

Takayuki Komai

Satoshi Shibasaki

Kazuhito Fukui

A method of manufacturing a light-emitting device includes: providing a second base with a plurality of light-emitting elements, the second base having an upper surface on which a pattern of second metal films is formed, the plurality of light-emitting elements being provided on the pattern of second metal films; cutting the second base to singulate the second base into a plurality of connection boards on each of which respective one of the plurality of light-emitting elements is mounted; providing a support board including a first base, the first base being flexible, the first base including a pattern of first metal films; placing the plurality of connection boards on the support board; and forming, for each of the plurality of connection boards, a conductive member so as to be in contact with the pattern of second metal films on the connection board and with the pattern of first metal films.

Method for manufacturing light-emitting device

A metal-base substrate includes a metal plate, an adhesive layer; and a film substrate. The adhesive layer is interposed between the metal plate and the film substrate. The film substrate has a wiring layer on a first surface opposite to a second surface on which the adhesive layer is arranged, with a through hole piercing through the film substrate in a thickness direction of the film substrate.

Metal-base substrate and semiconductor device

A light-emitting device includes a support board including a first base with flexibility and having a region where a first metal film is formed, a connection board disposed on an upper surface of the support board and including a second base on which a second metal film is formed, a light-emitting element mounted on the connection board, and a conductive member in contact with the first metal film and with the second metal film.

Light-emitting device and method for manufacturing same

A light emitting device includes a plurality of oblong flexible substrates, each flexible substrate comprising a sheet-shaped base body and a wiring pattern formed on one face of the base body, and each flexible substrate having a plurality of light emitting sections disposed thereon; a plurality of a reflective layers, each reflective layer being disposed at a periphery of a respective light emitting section above a respective flexible substrate; an insulating reflective sheet made of a light reflecting resin, the reflective sheet having a plurality of through holes located such that the light emitting sections and at least a portion of the reflective layers are exposed via the through holes; and a plurality of adhesive members, each adhesive member adhering a respective flexible substrate to the reflective sheet in regions where the reflective layer is not formed.

Light emitting device

A method for manufacturing a metal-base substrate includes: preparing a film substrate by forming a wiring layer on a first surface of the film substrate; and sticking a metal plate on a second surface of the film substrate opposite from the first surface, with an adhesive layer being interposed between the metal plate and the film substrate.

Metal-base substrate, semiconductor device and method for manufacturing the same

A substrate for a light emitting element including a resin substrate exhibiting flexibility and a metal wiring portion being formed on at least one surface side of the resin substrate via an adhesive layer, in which a reflective layer composed of a thermosetting resin is disposed between the resin substrate and the adhesive layer, in which the reflective layer contains a light reflective filler at 10% by mass or more and 85% by mass or less and has a reflectance to light at a wavelength of 450 nm of 80% or more.

Substrate for light emitting element and module

A light emitting device is provided that can restrain deterioration of a mount substrate made of resin, the light emitting device including: a support member that is made of resin; a pair of wirings that are arranged on the support member; a light emitting element that is arranged to cross the pair of wirings and that has a pair of electrodes on one side running in parallel to the pair of wirings so as to be electrically connected; and a vaporproof member in a film shape that seamlessly covers an upper face of the support member, at least, in a region where the light emitting element is arranged between the pair of wirings in a plan view, wherein the vaporproof member has a higher vaporproof property than that of the support member.

Growing community of inventors

Komatsushima, Japan

Tomohiro Ikeda