Dow Corning Toray Company, Ltd.

Dow Toray Co., Ltd.

Dow Corning Corporation

Dow Silicones Corporation

Daikin Industries, Ltd.

Shiseido Company, Limited

Dow Corning Toray Silicone Company Limited

Dupont Toray Specialty Materials Kabushiki Kaisha

Dow Corning Europe Sa

Dow Conring Toray Co., Ltd.

Dow Corning Toray., Ltd.

Dow Tray Co., Ltd.

Tomohiro Iimura

Haruhiko Furukawa

Akito Hayashi

Michitaka Suto

Tadashi Okawa

Seiki Tamura

Tatsuo Souda

Kazuhiro Nishijima

Takashi Sagawa

Yoshitsugu Morita

Seiji Hori

Akihiko Kobayashi

Kasumi Takeuchi

Tetsuo Shimizu

Makoto Yoshitake

Steven Swier

John Bernard Horstman

Peter Cheshire Hupfield

Katsuhiko Imoto

Takuya Ogawa

Randall Gene Schmidt

Masaru Ozaki

Tatsuya Morikawa

Bethany Johnson

Masaaki Amako

Jon Vierling Degroot, Jr

Hidefumi Araki

Ryosuke Yamazaki

Kei Watanabe

Satoshi Onodera

Katsuyuki Kaneko

Tomoko Ikeda

Sawako Inagaki

Yusuke Miyamoto

Nohno Toda

Sayuri Sawayama

Masayuki Hayashi

Maki Itoh

Hiroaki Yoshida

Manabu Sutoh

Yasunari Nakama

Eiji Kitaura

Fumito Nishida

Shin Yoshida

Stanton James Dent

Eric E Joffre

Eun Sil Jang

Jacob William Steinbrecher

Atsushi Sugie

Tomohiko Kimura

Adam C Tomasik

Teruhiko Hineno

Shuji Nishihama

Emil Radkov

Takakazu Hino

Yutaka Oka

Hidetoshi Kondo

Shinya Oguri

Giada Tonet

Mayumi Mizukami

Anne-Marie Vincent

This disclosure relates to a curable silicone composition that contains little to no solvent, has excellent transparency and adhesion to a substrate, and has a low overall haze value, and also relates to a cured product thereof. The curable silicone composition comprises: 100 mass parts of (A) a chain organopolysiloxane having an aliphatic unsaturated carbon-carbon bond-containing group and a degree of siloxane polymerization (DP) within a range of 10 to 1000; 1 to 100 mass parts of (B) a chain organopolysiloxane having an aliphatic unsaturated carbon-carbon bond-containing group and having a DP within a range of 1001 to 10,000; 0 to 100 mass parts of (C) an organopolysiloxane resin; (D) a polyorganohydrogen siloxane; and (E) a catalytic amount of a hydrosilylation reaction catalyst. Optionally, the composition further comprises: 0 to 60 mass parts of (F) an organic solvent, for 100 mass parts of the sum of components (A) to (D).

Curable silicone composition and cured product of same

Provided is a silicone adhesive composition and an application thereof, that has a viscosity that enables coating even with a small amount of solvent content, has excellent curability due to hydrosilylation reaction, cures, has sufficient adhesive strength for practical use, and has excellent mechanical strength and elongation of the adhesive layer after curing, and can form a pressure-sensitive adhesive layer having sufficient adhesive strength for practical use. The adhesive composition comprises: (A) a chain-like organopolysiloxane having at least two aliphatic unsaturated carbon-carbon bond-containing groups only at the terminals of the molecular chain; (B) a straight-chain organohydrogenpolysiloxane having silicon-bonded hydrogen atoms only at both terminals of the molecular chain; (C) a resinous organopolysiloxane; and (D) an organopolysiloxane having at least one or more aliphatic unsaturated carbon-carbon bond-containing groups at locations other than the ends of the molecular chain, and having three or more aliphatic unsaturated carbon-carbon bond groups in the molecule.

Silicone adhesive composition and use thereof

A curable silicone composition is disclosed. The curable silicone composition comprises: (A) a linear organopolysiloxane having at least two silicon atom-bonded alkenyl groups per molecule, wherein at least 5 mole % of all silicon atom-bonded organic groups are aryl groups; (B) an organopolysiloxane containing siloxane units represented by the general formula RSiOwhere each Rrepresents an independently selected monovalent hydrocarbon group, and siloxane units represented by the general formula SiO, wherein the amount of alkenyl groups is at least 6% by weight; (C) an organopolysiloxane having at least two silicon atom-bonded hydrogen atoms per molecule; and (D) a hydrosilylation reaction catalyst. The curable silicone composition forms a cured product with little weight reduction, little change in hardness, and little crack generation after thermal aging.

Curable silicone composition, cured product thereof, and optical semiconductor device

A photocurable liquid silicone composition is disclosed. The photocurable liquid silicone composition comprises: (A) a straight chain organopolysiloxane having at least two alkenyl groups with 2 to 12 carbon atoms in a molecule, and not containing a mercaptoalkyl group; (B) an organopolysiloxane having at least two mercaptoalkyl groups in a molecule; (C) a branched chain organopolysiloxane, wherein alkenyl groups and mercaptoalkyl groups are not included; (D) a photo radical initiator containing a phosphorus atom; and (E) a hindered phenol compound. The photocurable liquid silicone composition is rapidly cured by irradiating with long wavelength light while providing excellent storage stability and coatability at room temperature and at low temperatures (e.g. approximately 0&#xb0; C.), and provides a cured product that maintains transparency even when left under high temperature and high humidity conditions, with minimal clouding or discoloration.

Photocurable liquid silicone composition and cured product thereof

Provided is a resin-linear organopolysiloxane block copolymer which has a high degree of freedom in formulation due to excellent compatibility with other materials, in addition to exhibiting excellent film forming properties and followability of a film, while the stickiness of a film is suppressed. The resin-linear organopolysiloxane block copolymer has: a resin structure (A1) block that has siloxane units represented by RSiO(wherein Rrepresents a monovalent organic group, a hydroxyl group, or an alkoxy group having 1 to 6 carbon atoms) and SiO; and a linear structure (A2) block represented by (RSiO)(wherein n represents a number of 5 or more while R represents an alkyl group, a fluoroalkyl group, or an aryl group) in each molecule. The resin structure (A1) and the linear structure (A2) are linked to each other by an Si&#x2014;O&#x2014;Si bond, and an Si atom bonded to the resin structure (A1) constitutes an RSiOunit.

Resin-linear organopolysiloxane block copolymer, use of same, and method for producing same

The present invention pertains to a curable organopolysiloxane composition comprising at least (A) an organopolysiloxane having at least two alkenyl groups per module, (B) an organopolysiloxane resin represented by average unit formula: (RSiO)(RSiO)(RSiO)(SiO). In the formula, R's are the same or different from each other, and represent a hydrogen atom or a monovalent hydrocarbon group not having an aliphatic unsaturated carbon bond but at least two of the R's per molecule represent hydrogen atoms, Rrepresents a monovalent hydrocarbon group not having an aliphatic unsaturated bond, and a, b, and c are numbers satisfying 0&#x3c;a&#x3c;1, 0&#x3c;b&#x3c;1, and 0&#x2264;c&#x2264;0.2, and 0&#x3c;d&#x3c;1, respectively, but are also numbers satisfying 0.6&#x2264;a/d 1.5, 1.5&#x2264;b/d&#x2264;3, and a+b+c+d=1, and (C) a catalyst for hydrosilylation reaction. This composition has excellent adhesiveness to a semiconductor element, and can form a cured product in which only a small number of bubbles are produced.

Curable organopolysiloxane composition and semiconductor device

A cosmetic composition and a topical composition containing a resin-linear organopolysiloxane block copolymer are provided, which are excellent in compatibility with other cosmetic raw materials, so as to have a high degree of freedom in formulation design, excellent film forming properties and film following properties, and suppressed tackiness of the film. The resin-linear organopolysiloxane block copolymer contains a resin-linear organopolysiloxane block copolymer (A) having a structure in which a resin structure (A1) block having a siloxane unit represented by RSiO(where Ris a monovalent organic group, a hydroxyl group, or an alkoxy group having 1 to 6 carbon atoms) or by SiOand a linear structure (A2) block represented by (RSiO)(where n is a number of 5 or more, R is an alkyl group, a fluoroalkyl group, or an aryl group) are connected by a Si&#x2014;O&#x2014;Si bond and has an RSiOunit.

Cosmetic composition or external composition, and cosmetic raw material composition

The present invention relates to a curable silicone composition comprising: (A) a diorganopolysiloxane having at least two alkenyl groups in a molecule, (B) at least two types of resinous organopolysiloxanes having different mass average molecular weights, (C) an organopolysiloxane having at least two silicon-bonded hydrogen atoms in a molecule, and (D) a hydrosilylation reaction catalyst. The curable silicone composition enables the production of an optical semiconductor device in which the marked viscosity elevation of the resulting composition can be inhibited, in which the fluidity and packing properties are outstanding and that has outstanding gas barrier properties when used as a sealant, and in which the device has outstanding initial optical output efficiency even when organopolysiloxane resin is blended in order to form cured product with moderate hardness and strength.

A copolymer in which from 45 to 60% by mass of all monomer units are unsaturated monomers having a specific carbosiloxane dendrimer structure is disclosed, along with a composition, a cosmetic raw material, and a cosmetic containing the copolymer. The copolymer has excellent physical properties, including compatibility with other cosmetic raw materials, e.g. hardly soluble ultraviolet absorbers, and is capable of improving the compounding stability of cosmetics. The copolymer imparts cosmetics with good water resistance, sebum resistance, luster, tactile sensation, and adhesiveness to the hair or skin.

Copolymer having carbosiloxane dendrimer structure and composition and cosmetic containing the same

An organosilicon compound represented by the general formula, a hydrosilylation-curable silicone composition containing the compound as an adhesion promoter, and a semiconductor device having a semiconductor element sealed with a cured product of the composition. To provide a novel organosilicon compound, a curable silicone composition that contains the organosilicon compound as an adhesion promoter, has excellent initial adhesion and adhesion durability to a base material such as an organic resin, and forms a cured product having high light transmittance, and a highly reliable semiconductor device produced using this composition.

Organosilicon compound, curable silicone composition, and semiconductor device

The present invention relates to a copolymer having a specified carbosiloxane dendrimer structure and a long-chain alkyl group with 14 to 22 carbon atoms in a specified ratio, and a cosmetic comprising the copolymer as a cosmetic raw material. The cosmetic raw material has good miscibility with other cosmetic raw materials, and therefore, can improve stability of the formulation in a cosmetic, as well as can provide good water resistance, sebum resistance, glossiness, tactile sensation and/or adhesive properties to the hair and/or skin to a cosmetic, and also provide a cosmetic formed by blending the aforementioned cosmetic raw material, which exhibits superior surface protective properties, outer appearance and/or sensation during use.

Copolymer having carbosiloxane dendrimer structure, and composition and cosmetic containing the same

A curable silicone composition comprising: (A) an organopolysiloxane having at least two alkenyl groups in a molecule; (B) an organohydrogenpolysiloxane having at least two silicon-bonded hydrogen atoms in a molecule; (C) an adhesion promoter represented by the average unit formula; and (D) a hydrosilylation reaction catalyst. Provided is a curable silicone composition for forming a transparent cured product having high adhesion to a substrate, and an optical semiconductor device having excellent reliability made using the composition.

Curable silicone composition, and optical semiconductor device

A co-modified organopolysiloxane having a viscosity at 25&#xb0; C. of not more than 1,500 mPa&#xb7;s, a group that has a siloxane dendron structure, a hydrophilic group, and expressed by the following general formula (1): RRLQSiO(1). The invention also relates to a powder treatment agent, a powder in oil dispersion, an external use preparation (particularly a cosmetic composition) composition comprising the co-modified organopolysiloxane. In said general formula (1), Ris a monovalent hydrocarbon group or a hydrogen atom; Ris a monovalent hydrocarbon group having from 6 to 30 carbons; Lis a silylalkyl group having a siloxane dendron structure; and Q is a hydrophilic segment.

Co-modified organopolysiloxane, and treatment agent and external use preparation comprising the same

A liquid organopolysiloxane having fluidity at least 100&#xb0; C., a silicon-bonded glycerin derivative group, and a crosslinked structure comprising a carbon-silicon bond at the crosslinking portion.

Liquid organopolysiloxane and uses thereof

A curable silicone composition comprising: (A) an organopolysiloxane represented by the average unit formula: (RSiO)(RSiO)(RSiO)(Rare alkyl groups, alkenyl groups, aryl groups, or aralkyl groups; Rare alkyl groups or alkenyl groups; Ris an alkyl group, aryl group, or an aralkyl group, provided that, in a molecule, at least 0.5 mol % of Rto Rare the alkenyl groups, at least one of Ris the aryl group or the aralkyl group; and x, y and z are numbers satisfying: 0.01&#x2264;x&#x2264;0.5, 0.01&#x2264;y&#x2264;0.4, 0.1&#x2264;z&#x2264;0.9, and x+y+z=1); (B) a straight-chain organopolysiloxane having at least two alkenyl groups in a molecule; (C) an organopolysiloxane having at least two silicon atom-bonded hydrogen atoms in a molecule; and (D) a hydrosilylation reaction catalyst. A cured product exhibiting excellent dispersibility of phosphor and having crack resistance is formed.

Curable silicone composition, cured product therefrom, and optical semiconductor device

Growing community of inventors

Ichihara, Japan

Tomohiro Iimura