Canon Kabushiki Kaisha

Tomohiro Hoshina

Kota Nishibe

Takamasa Ishii

Shinichi Takeda

Masato Inoue

Kosuke Terui

Akiya Nakayama

Tomoaki Ichimura

Yoshito Sasaki

A radiation detector manufacturing method is provided. The method includes: preparing a structure including a support base, a flexible base member arranged on the support base and having a principal surface including a pixel region in which a plurality of pixels are arranged, a scintillator arranged so as to cover the pixel region, and a protective layer arranged so as to cover the scintillator; and removing the support base from the flexible base member. The principal surface includes a peripheral region not covered with the protective layer. The method further includes, before the removing, arranging a reinforcing member in contact with the peripheral region, in a position overlapping the peripheral region and not overlapping the scintillator, in orthogonal projection to the principal surface.

Radiation detector manufacturing method, radiation detector, radiation imaging apparatus, and radiation imaging system

A radiation imaging apparatus including: a first scintillator layer configured to convert a radiation (R) which has entered the first scintillator layer into light; a second scintillator layer configured to convert a radiation transmitted through the first scintillator layer into light; a fiber optic plate (FOP) provided between the first scintillator layer and the second scintillator layer; and an imaging portion configured to convert the light generated in the first scintillator layer and the light generated in the second scintillator layer into an electric signal.

Radiation imaging apparatus comprising a first scintillator plate, a second scintillator plate, and an imaging portion, and radiation imaging system

A scintillator panel including a scintillator layer that converts incident radiation into light and a scintillator base that supports the scintillator layer, a sensor panel including a sensor substrate that is disposed on a side of the scintillator layer that is opposite to the scintillator base and has a photoelectric conversion portion that converts the light into an electric signal, and a sensor base that is disposed on the side of the sensor substrate that is opposite to the scintillator layer and supports the sensor substrate, and a sealing member that seals a gap between the scintillator panel and the sensor panel at an edge of the scintillator panel are comprised. The sensor panel is provided with a convex member for narrowing the gap at a position in a vertical direction to a surface of the sensor panel from the edge of the scintillator panel.

Radiation imaging apparatus and radiation imaging system

A radiation imaging apparatus includes a sensor base, a sensor array that includes a plurality of sensor chips arranged in an array, and in which three or more sensor chips out of the plurality of sensor chips are arranged in one row of the sensor array, a scintillator positioned on a side opposite to the sensor base with respect to the sensor array, a bonding member that bonds the sensor array and the scintillator, and a plurality of bonding sheets that are separated from each other and bond the sensor base and the plurality of sensor chips. Two adjacent sensor chips out of the three or more sensor chips are bonded to the sensor base using separate bonding sheets out of the plurality of bonding sheets.

Radiation imaging apparatus, manufacturing method thereof, and radiation imaging system

An imaging table includes: a bucky apparatus to which a radiation imaging apparatus capable of being installed; a top plate connected to the bucky apparatus and allowing a subject to get on the top plate; and a rotation mechanism arranged to connect the bucky apparatus and the top plate in a relatively rotatable manner. The imaging table of the present invention can easily correspond to a plurality of imaging techniques.

Imaging table and radiation imaging system

A radiation detection apparatus includes a plurality of detection substrates on which photoelectrical conversion elements are arranged, a plate configured to support the plurality of detection substrates, a scintillator, and a plurality of bonding material members configured to bond the plurality of detection substrates and the scintillator. The plurality of bonding material members bond one-side surfaces of the plurality of detection substrates and a one-side surface of the scintillator, and the plurality of bonding material members are separated from each other and arranged so that outer edges of the plurality of bonding material members are not positioned between the plurality of detection substrates.

Growing community of inventors

Kawasaki, Japan

Tomohiro Hoshina