Seiko Epson Corporation

Tomohiro Hayashi

Yasuhide Matsuo

Kenji Otsuka

Kei Tadachi

Hiroyuki Tsuchiya

Minehiro Imamura

A joining method includes a process of applying a joining material including a thermosetting resin to a member. The joining material includes an addition-type silicone resin. The joining material includes one or more kinds selected from the group consisting of a methyl-based straight silicone resin, a phenyl-based silicone resin, and a modified silicone resin.

Joining method, apparatus of manufacturing joined body, joined body, ink jet head unit, and ink jet type recording apparatus

A heat dissipation member is disposed opposing a reflective light modulation element, and includes: a heat receiving surface that receives heat from the element; a heat dissipation surface; and heat dissipation fins that protrude from the heat dissipation surface. The fins are formed so that the density at which the fins are disposed is greater at the center area of the heat dissipation surface than at the end areas of the heat dissipation surface, or are formed so that the cross-sectional surface area of the fins is greater at the center area of the heat dissipation surface than at the end areas of the heat dissipation surface.

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Matsumoto, Japan

Tomohiro Hayashi