Panasonic Intellectual Property Management Co., Ltd.

Skyworks Filter Solutions Japan Co., Ltd.

Skyworks Panasonic Filter Solutions Japan Co., Ltd.

Tomohiro Fujita

Ichiro Kameyama

Tetsuya Furihata

Yuji Yasuoka

Hidenori Uematsu

Fuyuki Abe

Kenichi Matsushima

Kazunori Nishimura

Kenji Ueno

Yoshiko Higashi

Toru Inoue

Kazuhiro Okuda

Ryohei Harada

Tsutomu Inuduka

Chikara Nara

Makoto Itou

Takeyuki Fujii

An object of the present disclosure is to provide a common mode choke coil with high impedance and small variation. A common mode choke coil includes magnetic core having winding core part and a pair of flange parts provided on opposite ends of winding core part, external electrodes formed on each of flange parts, a pair of windings wound on winding core part, with each of the ends being drawn out and joined to one of external electrodes, and magnetic plate joined to the pair of flange parts with adhesive. Magnetic plate has joining parts joined to flange parts and opposing part opposing winding core part, and surface roughness of joining parts is smaller than surface roughness of opposing part.

Common mode choke coil and manufacturing method therefor

A magnetic core includes a winding core and first and second flanges connected to the winding core. First and second terminal electrodes are connected to a lead frame. The first flange is bonded to the first and second terminal electrodes. Third and fourth terminal electrodes are bonded to the second flange. First and second insulation-coated conductive wires are wound about the winding core. The first and second insulation-coated conductive wires are connected to the first and second terminal electrodes and the third and fourth terminal electrodes. The lead frame is bent so as to rotate the magnetic core by 90 degrees with respect to the lead frame. A magnetic plate is bonded to the magnetic core. The magnetic core is removed from the lead frame by removing the first and second terminal electrodes from the lead frame, thereby providing a common-mode choke coil. The common-mode choke coil having stable electrical performance is produced efficiently by the above method.

Method for manufacturing common-mode choke coil

An electronic component includes a substrate a functional section provided on the substrate, and a sealing body which is provided on the substrate and seals the functional section. In a temperature region having a lowest temperature that is at least as high as the glass transition temperature of the sealing body, the coefficient of linear expansion of the sealing body is greater than the coefficient of linear expansion of the substrate. In a temperature region having a highest temperature that is lower than the glass transition temperature of the sealing body, the coefficient of linear expansion of the sealing body is less than the coefficient of linear expansion of the substrate. The electronic component exhibits superior reliability even upon prolonged use.

Electronic component

An elastic wave device includes a piezoelectric substrate, a comb-shaped electrode above an upper surface of the piezoelectric substrate, a wiring connected to the comb-shaped electrode, an element cover above the upper surface of the piezoelectric substrate for covering the comb-shaped electrode across a space, a first electrode above an upper surface of the element cover, a sealing resin above the upper surface of the piezoelectric substrate for covering the element cover and the first electrode, a terminal electrode above an upper surface of the sealing resin, and a second electrode passing through the sealing resin for electrically connecting the first electrode with the terminal electrode. The first and second electrodes are made of films produced by electro-plating. The diameter of plating particles of the first electrode may be larger than that of plating particles of the second electrode.

Elastic wave device and method of manufacturing the device

An acoustic wave device includes a piezoelectric substrate, comb-shaped electrodes, wires, a sealing body, terminal electrodes, and connection electrodes. The comb-shaped electrodes are disposed on the piezoelectric substrate and are connected to the wires. The sealing body is disposed on the piezoelectric substrate in such a manner that the comb-shaped electrodes are sealed between the piezoelectric substrate and the sealing body. The terminal electrodes are disposed on the sealing body. The connection electrodes penetrate the sealing body so as to electrically connect the wires and the terminal electrodes, respectively. A first linear expansion coefficient in a first temperature range below a first glass transition temperature of the sealing body is larger than a second linear expansion coefficient in a second temperature range above the first glass transition temperature.

Acoustic wave device and sealing body contained therein

A semiconductor device according to the present invention has an n-type MIS transistor. The n-type MIS transistor has a first active region surrounded by a device isolation region in a semiconductor substrate, a first gate insulating film having a first high-dielectric-constant insulating film containing a first metal for adjustment, and a first electrode formed on the first gate insulating film. A protrusion amount of one end of the first high-dielectric-constant insulating film on the first device isolation part is smaller than a protrusion amount of an end of the first gate electrode above the first device isolation part.

Semiconductor device and manufacturing method therefor

Growing community of inventors

Osaka, Japan

Tomohiro Fujita