Taiyo Yuden Co., Ltd.

Tomohiko Zaima

Takashi Sasaki

Fukio Kinoshita

Kunihiro Matsushita

Shin Nakayasu

Akira Furusawa

Toshiya Kuji

Shota Yajima

Atsuhiro Kogure

A multi-layer ceramic electronic component includes: a ceramic body having a substantially rectangular parallelepiped shape, the ceramic body including a first corner connecting a first main surface, a first side surface, and an end surface, a second corner connecting a second main surface, the first side surface, and the end surface, a third corner connecting the first main surface, a second side surface, and the end surface, a fourth corner connecting the second main surface, the second side surface, and the end surface, and a plurality of internal electrodes; and a pair of external electrodes each including a base layer and a first conductive resin layer including a first side surface resin portion disposed on the first side surface to cover the first corner and extending from the first corner to first and second axis directions, and covers at least a part of the base layer.

Multi-layer ceramic electronic component and circuit board

A multi-layer ceramic electronic component includes: a ceramic body including a main surface, an end surface, and a side surface respectively perpendicular to a first axis, a second axis, and a third axis orthogonal to one another, a top portion that connects the main surface, the end surface, and the side surface to one another, and a plurality of internal electrodes laminated in a direction of the first axis; and an end external electrode including a corner portion located on the top portion, a base portion that covers the end surface and extends from the end surface to the main surface and the side surface, and a protrusion that protrudes from the base portion in a thickness direction, the protrusion including an L-shaped main surface protrusion located on the main surface and extending in directions of the second axis and the third axis from the corner portion.

A ceramic electronic device includes: a multilayer chip in which dielectric layers are stacked, the multilayer chip having two end faces, an upper face, a lower face and two side faces; a plurality of internal electrode layers that are provided inside of the multilayer chip; and a pair of external electrodes that are provided on the two end faces and are connected to the plurality of internal electrode layers, wherein each of the pair of external electrodes has a smaller thickness in a region not connected to the plurality of internal electrode layers, has an inwardly inflected point as viewed toward the plurality of internal electrode layers, and has a larger thickness in a region connected to the plurality of internal electrode layers, as measured in a direction perpendicular to the corresponding end face.

Ceramic electronic device with inflected external electrodes

A multilayer ceramic capacitor includes a ceramic main including first internal electrodes each drawn out to and reaching a pair of end surfaces and second internal electrodes each drawn out to and reaching a pair of side surfaces. A pair of end-surface external electrodes are respectively provided on the pair of end surfaces to be connected to the first internal electrodes, and a pair of side-surface external electrodes are respectively provided on the pair of side surfaces to be connected to the second internal electrodes. Each of the second internal electrodes has drawn-out parts that extend from an electrode main part and reach the pair of side surfaces, and with respect to each of the pair of side surfaces, two or more of the drawn-out parts are provided to extend from the electrode main part and reach the side surface.

Multilayer ceramic capacitor, circuit substrate and manufacture method therefor

Disclosed is a ceramic electronic component having external electrodes on each of opposed end portions of a rectangular parallelepiped component body. A first direction dimension, a second direction dimension and a third direction dimension of the component body satisfy a condition of second direction dimension&#x3e;first direction dimension&#x3e;third direction dimension. The external electrodes are of a five-face type having a first face portion, a second face portion, a third face portion, a fourth face portion and a fifth face portion. At least one edge of the fourth face portion and the fifth face portion of the external electrode has a recess portion recessed from the edge toward the first face portion. Both side portions in the third direction of the recess portion are covering portions which cover ridge portions of the two faces in the second direction of the component body.

Ceramic electronic component, ceramic electronic component manufacturing method, and ceramic electronic component-mounting circuit board

A ceramic electronic device includes: a multilayer chip in which dielectric layers are stacked, the multilayer chip having two end faces, an upper face, a lower face and two side faces; a plurality of first internal electrode layers that are provided inside of the multilayer chip, each of the plurality of first internal electrode layers having projection portions extracted to the two side faces; and external electrodes that are provided on the two side faces between the two end faces and are connected to the projection portions, wherein each of the external electrodes has a smaller thickness in a region not connected to the projection portions, has an inflection point toward the projection portions, and has a larger thickness in a region connected to the projection portions, in a direction connecting the two end faces.

Ceramic electronic device with inflected external electrodes and manufacturing method of ceramic electronic device with reverse pattern slurry

There is provided a multi-layer ceramic electronic component includes a ceramic body, an end external electrode unit, a side face external electrode unit. The ceramic body includes a pair of end faces, a pair of first side faces, and a pair of second side faces all of which are faced each other, respectively. The ceramic body includes a plurality of ceramic layers and an internal electrode unit. A plurality of the ceramic layers extend along a pair of the first side faces, and are laminated along a pair of the second side faces. The internal electrode unit includes first and second internal electrodes disposed alternately between a plurality of the ceramic layers, the first internal electrodes are drawn to both ends of a pair of the end faces, and the second internal electrodes are dawn to both ends of a pair of the second side faces. The end external electrode unit is connected to the first internal electrodes. The side face external electrode unit goes around from one of a pair of the first and second side faces to the other and are connected directly or indirectly each other at the other. There is also provided a method of producing the same.

Multi-layer ceramic electronic component having side face external electrode and method of producing the same

In an embodiment, a through-type multilayer ceramic capacitor-has a first external electrodeprovided on one end of the capacitor bodyin the length direction, and a second external electrodeprovided on the other end of the capacitor bodyin the length direction, and it also has a third external electrodeof quadrangular cylinder shape provided at the center of the capacitor bodyin a manner continuously covering parts of both sides in the height direction, and parts of both sides in the width direction, of the capacitor body, in a state not contacting the first external electrodeand second external electrode. The through-type multilayer ceramic capacitor can offer improved strength at the time of installation on a circuit board.

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Tokyo, Japan

Tomohiko Zaima