Hitachi-Kokusai Electric Inc.

Kokusai Electric Co., Ltd.

Tomohiko Takeda

Teruo Yoshino

Tokunobu Akao

Nobuo Ishimaru

Yukio Akita

Katsuyoshi Hamano

Kazunori Suzuki

Satohiro Okayama

Motoichi Kanazawa

Takeshige Ishida

Yasunobu Nakayama

Ken Sugihara

Satoru Ichimura

To effectively prevent a micro arc causing damage to an apparatus and a substrate, by detecting a generation of the micro arc. A substrate processing apparatus is constituted so as to generate a plasma P, by applying a high frequency power to an electrodeprovided in a processing chamberfrom a high frequency power supply partthrough a matching unit. A directional coupleris provided between a high frequency power sourceand the matching unit, so that a reflected wave reflected from the electrodeand a traveling wave advancing toward the electrodeare coupled to a detector. The detectoroutputs a detection signal, when a level of a reflected wave Pr and a differential level thereof exceed each set value. In order to place an initial period of discharge out of a detection period, a delay traveling wave, which is a delayed traveling wave, is also outputted. A controllerdetermines the generation of a harmful micro arc, when coincidence of three detection signals outputted from the detectoris obtained, supplies an RF cut signal to a CPU, and temporarily stops or temporarily decreases a high frequency power from the high frequency power source

Substrate processing apparatus and substrate processing method

An unprocessed substrate is conveyed to a film-processing chamber at the same time a processed substrate is conveyed to a substrate preparation chamber, reducing the substrate processing cycle, thereby increasing the yield per unit time. The substrate preparation chamber has a two-tiered structure for receiving processed substrates and unprocessed substrates. A two-tiered transfer robot allows the substrates to be removed or placed into the preparation and process chambers at the same time, thus decreasing the cycle time for processing a substrate.

Substrate processing device, substrate conveying device, and substrate processing method

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Tokyo, Japan

Tomohiko Takeda