Hitachi, Ltd.

Tomohiko Shida

Ryoichi Kajiwara

Takao Funamoto

Hiroshi Wachi

Tomio Umino

Kazuya Takahashi

Munenobu Suzuki

Takeshi Matsuzaka

Masahisa Inagaki

Masatoshi Watanabe

Katuo Sugawara

Minoru Yamada

Keiichirou Nakanishi

Tomio Iizuka

Ryutarou Jimbou

Mituo Kato

Mituo Katou

Ryutarou Jinbou

Shoji Isobe

Mitsuo Katoo

Tomio Unino

A number of LSI chips (9) are mounted on a wiring substrate (12). A cooling element (68) comprises a housing (1), a bellows (2) and a cooling plate (6) for introducing a cooling medium. The cooling element is connected to the LSI chip by low melting solder, at the same time, the cooling plate is connected to the wiring substrate through a skirt (5) which is connected to the cooling plate and also connected to the wiring substrate by a low melting solder.

Semiconductor module and cooling device of the same

An integrated circuit device comprising a wiring substrate on one surface of which integrated circuit chips are mounted, a power source substrate of a laminated structure provided in contact with the other surface of the wiring substrate and formed by alternately laminating a plurality of feeding conductor layers of a heat conductive metal and a plurality of electrically insulating layers of an electrically insulating material, and bonding together the laminated layers, a means for electrically connecting the wiring substrate and the power source substrate to each other, and a heat radiating means inserted in at least either the feeding conductor layers or the electrically insulating layers and adapted to radiate the heat, which occurs in the power source substrate, to the outside thereof. This integrated circuit device has a power source substrate of a remarkably high heat radiating efficiency, and is suitably used as an integrated circuit device having integrated circuit chips mounted with a high density on a wiring substrate therein.

Integrated circuit device

A semiconductor module cooling structure comprises a housing having a passage through which a cooling fluid flows; a cooling block to which the cooling fluid is supplied from the housing and which has an electrical insulating layer at the bottom portion and is combined with a semiconductor chip through the electrical insulating layer; and a bellows which is connected between the housing and the cooling block. The cooling fluid is supplied to the cooling block through the bellows. The bellows is formed in a manner such that a plurality of substantially plane ring-like metal plates are laminated, pressed, diffused, joined, and thereafter stretched and molded.

Sealed-type liquid cooling device with expandable bellow for

A laser beam reflection system for applying a laser beam to an area to be treated. The laser beam reflection system has a hollow head housing, first reflecting mirror means disposed in the rotary head housing and adapted to deflect the laser beam introduced into the rotary head housing away from the axis, second reflecting mirror means disposed in the rotary head housing and adapted to reflect the laser beam coming from the first reflecting mirror means to such a direction as to traverse the axis, and third reflecting mirror means disposed in the head housing movably in the direction traversing the axis and adapted to reflect and focus onto the area the laser beam coming from the second reflecting mirror means. The laser beam reflection system of the invention can be used for welding, surface treatment, heat treatment, cutting of various materials, and a light source of laser communication systems.

Laser beam reflection system

There are disclosed a laser treatment method and an apparatus therefor in which a laser beam is irradiated on an object to be treated. The laser beam emitted from a laser apparatus is divided into a plurality of fractional beams, and the fractional laser beams are reflected toward and irradiated on an area to be irradiated of the object being treated after being compounded such that energy density distribution on the irradiated area is made substantially uniform in at least one direction.

Method of treating object by laser beam and apparatus therefor

In a process for fusion-welding a binary combination of an iron alloy containing 50 % by weight or less of nickel and cobalt combined and copper; or a ternary combination of said iron alloy, copper, and iron, including the steps of bringing members of said binary combination or ternary combination into gapless contact with one another and subjecting the contact zone to a treatment including at least one of electron beam welding, laser beam welding, plasma welding, and TIG welding without use of a filler metal, an improvement which is characterized by supplying welding energy necessary to form in the welding zone molten weld metal having such a width and depth that have been determined from the composition and thickness of said base metals so that the composition of the weld metal may fall within the specified area in a diagram, shown in FIG. 1, representing composition of a three component system, said specified area being enclosed with straight lines connecting successively the point X (97 wt-% Cu, 2 wt-% Fe, 1 wt-% Ni + Co), the point Y (2 wt-% Cu, 49 wt-% Fe, 49 wt-% Ni + Co), the point Z (2 wt-% Cu, 97 wt-% Fe, 1 wt-% Ni + Co), and the point X except for the area enclosed with straight lines connecting successively the point a (35 wt-% Cu, 32.5 wt-% Fe, 32.5 wt-% Ni + Co), the point b (10 wt-% Cu, 45 wt-% Fe, 45 wt-% Ni + Co), the point c (8 wt-% Cu, 91 wt-% Fe, 1 wt-% Ni + Co), the point d (45 wt-% Cu, 54 wt-% Fe, 1 wt-% Ni + Co), and the point a. According to this improved process, development of weld cracking can be prevented.

Process for fusion-welding iron-nickle-cobalt alloy and copper or said

A method for welding copper or a copper base alloy and iron or an iron base alloy characterized in that an element for enhancing the mutual miscibility of copper and iron and an element for refining the crystal grains of the weld metal is added to weld metal in a total amount of 1 to 25 percent by weight based on the weld metal, thereby preventing the welded portion from crack formation and segregation.

Welding of copper and iron

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Hitachi, Japan

Tomohiko Shida