Oki Data Corporation

Tomohiko Sagimori

Mitsuhiko Ogihara

Hiroyuki Fujiwara

Takahito Suzuki

Tomoki Igari

Yusuke Nakai

Hironori Furuta

Masataka Muto

Masaaki Sakuta

Akihiro Hashimoto

Satoru Tanaka

A method for manufacturing a semiconductor device, includes: a step of etching a Si () substrate along a () plane of the Si () substrate to separate a Si () thin-film device having a separated surface along the () plane.

Semiconductor device

The present invention supplied a display apparatus using plastic substrate instead of glass substrate, which can solve such problems that the plastic substrate has a low heat conductivity and its heat release performance becomes bad so that it is difficult to obtain stable performance and reliability. In the display apparatus being formed by bonding semiconductor thin film element on a plastic substrate, a thin film metal layer is formed on surface of the semiconductor thin film element for promoting heat release.

Display apparatus

A semiconductor device includes a diamond-like carbon film formed on the substrate. A thin film is formed on the diamond-like carbon film. The thin film has a thickness thinner than the diamond-like carbon. A semiconductor thin film having a semiconductor element is bonded onto the thin film.

Semiconductor device and optical print head

A light emitting panel includes a plurality of light emitting element arrays each of which has a plurality of light emitting elements arranged in a plane. The light emitting element arrays are configured so that an arrangement plane of the light emitting elements of one light emitting element array is overlapped with another arrangement plane of the light emitting elements of another light emitting element array in substantially parallel to each other, and so that the light emitting elements of one light emitting element array and the light emitting elements of another light emitting element array emit lights to the same side.

Light emitting panel having a plurality of light emitting element arrays arranged in descending order of wavelength

A method is used for releasing a graphene layer from a substrate. A graphene layer is first formed on a surface of a first substrate. A metal layer is then formed on a surface of the graphene layer. A pulling force is then applied to the metal layer to detach the graphene layer from the first substrate. The released graphene layer is bonded by intermolecular force onto a surface of a second substrate separate from the first substrate or onto a surface of a bonding layer formed on the surface of the second substrate. The metal layer is then removed, by for example, etching.

Graphene wafer, method for manufacturing the graphene wafer, method for releasing a graphene layer, and method for manufacturing a graphene device

A method for manufacturing a semiconductor device, includes: a step of etching a Si (111) substrate along a (111) plane of the Si (111) substrate to separate a Si (111) thin-film device having a separated surface along the (111) plane.

Method of manufacturing semiconductor device, semiconductor device and semiconductor composite device

In a separation method of a nitride semiconductor layer, a graphene layer in the form of a single layer or two or more layers is formed on a surface of a first substrate. A nitride semiconductor layer is formed on the graphene layer so that the nitride semiconductor layer is bonded to the graphene layer with a bonding force due to regularity of potential at atomic level at an interface therebetween without utilizing covalent bonding. The nitride semiconductor layer is separated from the first substrate with a force which is greater than the bonding force between the nitride semiconductor layer and the graphene layer, or greater than a bonding force between respective layers of the graphene layer.

Separation method of nitride semiconductor layer, semiconductor device, manufacturing method thereof, semiconductor wafer, and manufacturing method thereof

The present invention supplied a display apparatus using plastic substrate instead of glass substrate, which can solve such problems that the plastic substrate has a low heat conductivity and its heat release performance becomes bad so that it is difficult to obtain stable performance and reliability. In the display apparatus, inner surface electrode integrated with vertical wiring between plastic substrate and thin film LEDis accumulated, the inner surface electrode acts as a heat release layer for releasing heat produced inside the thin film LED

Provided is a technique of effectively extracting the beams of light excited in an LED light emitter other than the light beams emitted from a light-emitting region in the direction of a light-extraction surface. A pit with a tapered sidewall is formed in a substrate. A thin-film semiconductor element is attached to the pit. Light beams emitted from a side surface of the thin-film semiconductor element are reflected by the sidewall of the thin-film semiconductor element. Achieved thereby is effective extraction of light beams other than the light beams emitted from the light-emitting region in the direction of the light-extraction surface.

Efficient light emitting semiconductor device

A semiconductor device and an optical print head, an image forming apparatus that has the semiconductor device are supplied capable of reduce occurrence probability of defect. The semiconductor device is formed by using semiconductor thin film bonded on the substrate, and includes a covering layer that covers at least one part region of the semiconductor thin film and covers at least one part of electroconductive member connecting with the semiconductor thin film.

Semiconductor device, optical print head and image forming apparatus

A composite semiconductor device includes a plurality of semiconductor thin films and a substrate on which the semiconductor thin films are attached. Each semiconductor thin film includes a plurality of semiconductor elements. Each semiconductor element includes a first contact region and a second contact region. The first contact region is connected to a first electrode, and the second contact region is connected to a second electrode. The semiconductor thin film is attached to a substrate such that the plurality of semiconductor elements are aligned in a row, and such that the first contact region and the second contact region are in the row of light emitting elements.

Composite semiconductor device, LED print head that employs the composite semiconductor device, and image forming apparatus that employs the LED print head

A composite semiconductor device includes a semiconductor thin film, a substrate, connection pads, and a light blocking layer. The semiconductor thin film includes light emitting elements. The driver circuits are formed on the substrate and the semiconductor thin film is fixed on the substrate, the driver circuit driving the light emitting element. The connection pads are formed on the substrate, electrical connection being made through which the connection pads. The light blocking layer is formed in an area between the light emitting element and the connection pad, the light blocking layer. The light blocking layer prevents light emitted from the light emitting element from reaching wires connected to the connection pad.

Composite semiconductor device, LED head that employs the composite semiconductor device, and image forming apparatus that employs the LED head

An aspect of the invention provides a method of manufacturing a method of manufacturing a semiconductor element comprises the steps of: growing epitaxially a semiconductor layer on top of a semiconductor substrate; forming a patterned portion of the grown semiconductor layer by forming a pattern by a patterning process on top of the grown semiconductor layer; removing a portion of the semiconductor layer other than the patterned portion by a first etching method with a first etchant; and immersing a resultant from the first etching method in a second etchant that etches only the semiconductor substrate by a second etching method thereby removing the substrate from the semiconductor layer.

Method of manufacturing by etching a semiconductor substrate horizontally without creating a vertical face

A composite semiconductor device includes a substrate; a plurality of circuits formed on the substrate; one or more wiring layers each including a plurality of wiring patterns connected to circuits of the plurality of circuits, a plurality of dummy patterns electrically isolated from the plurality of circuits, and an interlayer dielectric film that is spin-coated directly onto the wiring patterns and onto the dummy patterns, and that is a spin-coated layer, the dummy patterns being formed in areas where the wiring patterns are absent and lying substantially in a plane in which the wiring patterns lie; and a semiconductor thin film layer including semiconductor device elements and disposed on an upper most surface of the one or more wiring layers. The spin-coated layer may be formed of an organic material or an oxide material.

Composite semiconductor device

A semiconductor device includes a plurality of light emitting elements formed of a thin layer of a compound semiconductor and arranged in a row in one direction with an equal interval therebetween. Each of the light emitting elements includes a light emitting area formed on a surface thereof; a first conductive type side electrode formed on the surface and electrically connected to one side of the light emitting element; and a second conductive type side electrode formed on the surface and electrically connected to the other side of the light emitting element. Further, the first conductive type side electrode is disposed at a position continuously surrounding at lease two sides of the light emitting area of the light emitting area with an insulating film inbetween. The second conductive type side electrode is disposed on the light emitting area.

Growing community of inventors

Tokyo, Japan

Tomohiko Sagimori