Sony Corporation

Tomohiko Sada

Yoshio Fujiwara

Keiichi Naito

Yoshinobu Fujimoto

Tooru Odashima

A thermosetting resin composition having improved properties as an electrical insulating material and being particularly suited for use in printed circuit boards, consists essentially of an acryloyloxyl- or methacryloyloxyl- terminated butadiene homopolymer or copolymer, for example, with acrylonitrile or styrene, an ethylenically unsaturated monomer capable of copolymerizing with the terminating acryloyloxyl or methacryloyloxyl groups of the butadiene homopolymer or copolymer, and an acid anhydride containing at least one ethylenically unsaturated group in its molecule. In preferred compositions of the invention, there are from 1.5 to 3.0 terminating acryloyloxyl or methacryloyloxyl groups per molecule of the butadiene homopolymer or copolymer, and the amounts of the ethylenically unsaturated monomer and of the acid anhydride are from 50 to 200 weight percent and from 5 to 20 weight percent, respectively, based on the weight of the terminated butadiene homopolymer or copolymer. A particularly desirable composition is obtained when the acryloyloxyl- or methacryloyloxyl-terminated polymer or copolymer is at least 70 weight percent 1,2-polybutadiene.

Thermosetting acryloyloxy-terminate butadiene polymers

A flame retardant thermosetting resin composition having improved properties as an electrical insulating material and being particularly suited for use in printed circuit boards composed essentially of acryloyloxy- or methacryloyloxy-terminated butadiene homopolymer or butadiene copolymer with, for example, acrylonitrile or styrene, ethylenically unsaturated monomer capable of copolymerizing with the terminating acryloyloxy- or methacryloyloxy- groups of the butadiene homopolymer or copolymer, which monomer has a substantial amount of haloaryl, and acid anhydride having at least one ethylenically unsaturated group. In preferred compositions of the invention, there are from 1.5 to 3.0 terminating acryloyloxy- or methacryloyloxy- groups per molecule of the butadiene homopolymer of copolymer, the amounts of ethylenically unsaturated monomer and of acid anhydride are from 150 to 500 weight percent and from 5 to 20 weight percent, respectively, based on the weight of terminated butadiene homopolymer or copolymer, and the amount by weight of halogen is 25 to 70 percent of the weight of the composition. A particularly desirable composition is obtained when the acryloyloxy- or methacryloyloxy-terminated polymer or copolymer is at least 70 weight percent 1,2-polybutadiene; chlorine and bromine are the halogens, bromine being preferred.

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Tokyo, Japan

Tomohiko Sada