Canon Kabushiki Kaisha

Tomohiko Nakano

Keiji Matsumoto

Seiichiro Yaginuma

Jun Yamamuro

Koji Sasaki

Kunihito Uohashi

Kenji Fujii

Ryotaro Murakami

Kazuhiro Asai

Masahisa Watanabe

Keiji Edamatsu

Haruka Nakada

Shingo Nagata

Teruo Ozaki

Masaki Ohsumi

Masataka Nagai

In a method of manufacturing a liquid ejection head including transferring a dry film for forming a partial structure of a liquid ejection head from a support to a substrate, the dry film with the support is bonded on a processing surface of the substrate with forming a projection part in which peripheral edges of the dry film and the support protrude further outside than a peripheral edge of the processing surface; the projection part is cut at a cutting position between an outer edge of the projection part and the peripheral edge of the processing surface to form a remaining projection part, and the support is peeled from the substrate with the remaining projection part as a start position to leave the dry film on the processing surface which forms the partial structure of the liquid ejection head.

Method of manufacturing substrate with resin layer and method of manufacturing liquid ejection head

A member transfer method includes sticking a member supported at a support to an object, thinning the support after the sticking of the member to the object, and removing the support from the member after the thinning of the support.

Member transfer method and manufacturing method for liquid ejection head

To manufacture a liquid ejection head, a film having a lower surface free energy than a surface free energy of a substrate is first formed on an inner face of a liquid supply port. Next, a dry film to be a flow path forming member is attached to cover the surface of the substrate, and then a member to be an ejection orifice forming member is provided on the surface of the dry film.

Method of manufacturing liquid ejection head and method of manufacturing structure

A method for manufacturing a liquid ejection head including providing a negative first photosensitive resin layer on the substrate, forming a pattern of the flow path by selectively exposing the first photosensitive resin layer, providing a negative second photosensitive resin layer on the first photosensitive resin layer, providing a negative third photosensitive resin layer on the second photosensitive resin layer, forming a pattern of the ejection port by selectively exposing the second and third photosensitive resin layers, developing the first, second, and third photosensitive resin layers, irradiating an activation energy line on at least the third photosensitive resin layer after the developing, and heat curing the first, second, and third photosensitive resin layers after the irradiating of the activation energy line.

Method for manufacturing liquid ejection head

A liquid ejection head has an ejection port forming region which includes liquid ejection energy generating elements arranged on a substrate, liquid supply ports each running through the substrate and having an opening at a surface of the substrate, a liquid path formed on the surface as a space containing the liquid ejection energy generating elements and the liquid supply ports therein, and ejection ports corresponding to the respective liquid ejection energy generating elements. The liquid ejection head is manufactured by forming a liquid path forming layer on the substrate using a dry film resist, forming an ejection port forming layer on the liquid path forming layer, forming a liquid path in the liquid path forming layer and ejection ports in the ejection port forming layer. The substrate has dummy holes each having an opening at a surface of the substrate outside the ejection port forming region.

Liquid ejection head manufacturing method

A method for manufacturing a liquid ejection head including the steps of preparing a substrate including, on a surface of the substrate, a layer having a plurality of openings in which opening portions of supply portions are located and which are arrayed in an array direction and another opening which is different from the plurality of openings and is located beyond the array end portion in the array direction, and attaching a dry film for forming flow passages to the substrate and the layer.

A liquid ejection head includes a liquid ejection board and a liquid ejection head component disposed on the liquid ejection board. The liquid ejection board includes a substrate, an energy generating device on the substrate, a channel defining member defining a liquid channel and having a liquid ejection opening in communication with the liquid channel, a liquid supply passage in communication with the liquid channel, a liquid supply opening in communication with the liquid supply passage and having a smaller opening cross-sectional area taken in a direction perpendicular to a flow direction of a liquid than the liquid supply passage, and an opening in communication with the liquid channel. The liquid channel allows a liquid to be in contact with the energy generating device. The liquid ejection opening allows a liquid to be ejected therethrough. The liquid ejection head component closes at least a portion of the opening.

Liquid ejection head and method of producing the same

A liquid ejection head includes a substrate having an energy generating element arranged therein and an ejection port forming member laid as superposed above the substrate. At least one ejection port is formed so as to run through the ejection port forming member. The ejection port forming member has a concave portion including the ejection port formed therein on the surface thereof opposite to the surface thereof facing the substrate, and has a convex portion on the surface of the ejection port forming member facing the substrate so as to correspond to the concave portion.

Liquid ejection head and method of manufacturing the same

A method for manufacturing a liquid ejection head includes the steps of: preparing a substrate including an energy-generating element disposed on a first surface of the substrate and a supply path for liquid; disposing a dry film on the first surface of the substrate in such a manner that the dry film partially enters the supply path; etching the dry film from a side of the dry film facing the first surface of the substrate so that the dry film has an etched surface substantially in parallel with the first surface and covers the supply path; forming a resin layer to be a flow path member on the dry film covering the supply path; and removing the dry film covering the supply path.

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Kawasaki, Japan

Tomohiko Nakano