Hitachi Chemical Company, Ltd.

Resonac Corporation

Showa Denko Materials Co., Ltd.

Tomohiko Kotake

Masato Miyatake

Hikari Murai

Hiroyuki Izumi

Tatsuya Makino

Satoshi Takayasu

Shin Takanezawa

Shinji Tsuchikawa

Shunsuke Nagai

Chisato Kikkawa

Shintaro Hashimoto

Kaito Kogure

Yasuo Inoue

Kouta Iwanaga

Naoyoshi Sato

Masanori Akiyama

Daisuke Fujimoto

Yuta Akasu

Akira Shimizu

Shinichiro Abe

Aya Kasahara

Yasuo Kamigata

Yoshihiro Takahashi

Tetsurou Irino

Masahiro Aoshima

Kouichi Aoyagi

Mari Shimizu

Harumi Negishi

Sayaka Kikuchi

Ai Yokokura

This coating liquid contains: aerogel particles; a water-soluble polymer having a hydrophobic group; a binder resin; and a liquid medium, wherein the water-soluble polymer comprises a cellulose based resin having an alkyl group having 6 to 26 carbon atoms. The coating liquid is capable of forming a coating film having a high filling rate of aerogel particles and an excellent film strength and is excellent in terms of the dispersibility of aerogel particles.

Coating liquid, composite material, and coating film

The present invention relates to a coating liquid comprising an aerogel particle, a liquid medium, a first binder resin, and a second binder resin having lower solubility in the liquid medium than the first binder resin.

Coating liquid, production method for coating film, and coating film

The present invention relates to a maleimide resin composition including (A) at least one selected from the group consisting of a maleimide compound having two or more N-substituted maleimide groups and a derivative thereof; and (B) a modified conjugated diene polymer, the component (B) being one resulting from modification of (b1) a conjugated diene polymer having a vinyl group in the side chain with (b2) a maleimide compound having two or more N-substituted maleimide groups and also to a prepreg, a laminate, a resin film, a multilayer printed wiring board, and a semiconductor package, each using the foregoing maleimide resin composition.

Maleimide resin composition, prepreg, laminated board, resin film, multilayer printed wiring board, and semiconductor package

Provided is a prepreg capable of attaining thermal expansion coefficient reduction and elastic modulus increase without increasing the filling ratio of an inorganic filler therein and/or without using a resin having a low thermal expansion coefficient, and thereby capable of reducing warpage thereof. Specifically, provided is a prepreg containing glass fibers and a thermosetting resin composition, and containing a layer of plural glass fiber filaments aligned to run nearly parallel to each other in one direction. Also provided are a production method for the prepreg, a laminate containing the prepreg and its production method, a printed circuit board containing the laminate, and a semiconductor package having a semiconductor device mounted on the printed circuit board.

Prepreg, laminate, and production methods therefor, as well as printed circuit board and semiconductor package

The present invention relates to a treatment agent for treating particles, the treatment agent comprising a condensation product of a liquid composition comprising at least one selected from the group consisting of a polysiloxane compound having a hydrolyzable functional group or a condensable functional group and a hydrolyzate of the polysiloxane compound having a hydrolyzable functional group.

Treatment agent for treating particles, water- repellent particles and production method therefor, water-repellent layer, and penetration preventing structure

A method for suppressing corrosion under insulation includes a step of applying a paste containing aerogel particles and a liquid medium to a target surface to form a coating film. A paste for suppressing corrosion under insulation contains aerogel particles and a liquid medium.

Method for suppressing corrosion under heat-insulating material, and paste for suppressing corrosion under heat-insulating material

The present invention relates to a coating liquid comprising an aerogel particle and a liquid medium.

Coating solution, method for producing coating film, and coating film

The present invention relates to a treatment agent for treating fibers, the treatment agent comprising a condensation product of a liquid composition comprising at least one selected from the group consisting of a polysiloxane compound having a hydrolyzable functional group or a condensable functional group and a hydrolyzate of the polysiloxane compound having a hydrolyzable functional group.

Treatment agent for treating fibers, fibers and production method therefor, and fiber sheet and production method therefor

The present invention relates to a coating liquid comprising an aerogel particle, a binder resin, a fibrous substance having a fiber length of 1.5 mm or more, and a liquid medium.

A method for producing an aerogel composite includes drying a wet gel generated from a sol comprising a silica particles, and at least one selected from the group consisting of a silicon compound having a hydrolyzable functional group in a molecule, and a hydrolysis product of the silicon compound.

Aerogel composite, and supporting member and heat insulation material provided with aerogel composite

The present invention provides a barrier material formation composition comprising a silane oligomer, at least a part of the silane oligomer being modified with a metal alkoxide.

Barrier material formation composition, barrier material, production method for barrier material, product, and production method for product

The present invention provides a method for producing an aerogel, comprising a sol generating step of generating, by hydrolyzing a silane oligomer, a sol containing a hydrolysis product of the silane oligomer; a wet gel generating step of obtaining a wet gel by gelation of the sol; and a drying step of drying the wet gel to obtain an aerogel, wherein a proportion of silicon atoms each bonded to three oxygen atoms in a total number of silicon atoms contained in the silane oligomer is 50% or more.

Aerogel and method for producing same

There are provided a modified silicone compound prepared by reacting: (A) a siloxane diamine represented by the general formula (1); (B) a maleimide compound with at least two N-substituted maleimide groups in the molecular structure; and (C) an amine compound with an acidic substituent; and also provided a thermosetting resin composition, a prepreg, a laminated plate, and a printed wiring board that are formed by using this compound. The multi-layered printed wiring board produced by using the laminated plate formed by using the prepreg obtained from the modified silicone compound and the thermosetting resin composition of the present invention through laminate molding has an excellent glass transition temperature, coefficient of thermal expansion, copper foil adhesion, hygroscopicity, hygroscopic solder heat resistance, and copper-stuck solder heat resistance. Therefore, the multi-layered printed wiring board is useful as a highly integrated semiconductor package and a printed wiring board for an electronic device. 

Modified silicone compound, and thermosetting resin composition, prepreg, laminate plate and printed wiring board using same

A production method for an aerogel laminate includes a step of preparing a sol of producing a sol for forming an aerogel, an applying step of applying the sol obtained in the step of preparing a sol to a support having a heat ray reflective function or a heat ray absorbing function, and drying the sol to form an aerogel layer, an aging step of aging the aerogel layer obtained in the applying step, a washing step of washing the aged aerogel layer and performing solvent exchange, and a drying step of drying the aerogel layer washed in the washing step.

Aerogel laminate and thermal insulation material

The present invention relates to an aerogel composite powder superior in thermal insulation and flexibility, the aerogel composite powder comprising an aerogel component and a silica particle.

Growing community of inventors

Tokyo, Japan

Tomohiko Kotake