Matsushita Electric Industrial Co., Ltd.

Other

Panasonic Corporation

Panasonic Intellectual Property Management Co., Ltd.

Nuvoton Technology Corporation Japan

Tomohiko Kanemitsu

Hiroshi Miyaguchi

Akihiko Watanabe

Haruka Takano

Naoya Tokunaga

Kenta Sokawa

Takuya Asano

Takeru Yamashita

Masanori Hirofuji

Yasuyuki Shimizu

Satoshi Kishimoto

Seiji Matsui

Wataru Itoh

Seigo Suguta

Naoya Tomoda

Fumihito Nakajima

Norihiro Imanaka

Syoma Takahashi

Satoru Kamano

A monitoring system includes an arithmetic processor. The arithmetic processor receives captured image information representing a captured image obtained by capturing an image of a subject and generates notification information representing a particular notification content depending on a condition of the subject. The arithmetic processor includes a first arithmetic processor and a second arithmetic processor. The first arithmetic processor obtains a condition quantity by quantifying the condition of the subject by reference to the captured image information and based on a parameter about a human activity status. The second arithmetic processor selects, according to the condition quantity, the particular notification content from contents of notification classified into N stages, where N is an integer equal to or greater than three.

Monitoring system and non-transitory storage medium

A distance measuring device using a TOF (Time of Flight) scheme includes a controller, a light receiver, and a calculator. The controller generates a first exposure signal, a second exposure signal, a third exposure signal, and one particular exposure signal selected from the first, the second, and the third exposure signals. The light receiver performs a first exposing process, a second exposing process, a third exposing process, and a particular exposing process corresponding to the particular exposure signal out of the first, the second, and the third exposing processes. The calculator determines, based on a difference between an exposure amount obtained from the particular exposing process and an exposure amount obtained from an exposing process according to one of the first, second, and the third exposure signals corresponding to the particular exposure signal, whether or not the light emitted from the distance measuring device interferes with light emitted from other distance measuring device.

Distance measuring device and solid-state image sensor used therein

A semiconductor testing circuit of the present invention includes a signal line which is connected to a terminal not to be tested and a plurality of terminals to be tested of a semiconductor device; switch circuits for controlling electrical connection/disconnection between the signal line and the terminals to be tested; and a resistor connected to one end of the signal line. With this configuration, in a test on the AC characteristics of an input signal, a test signal generated by an LSI tester can be inputted to the terminals to be tested through the terminal not to be tested and the signal line by turning on the switch circuits.

Semiconductor testing circuit and semiconductor testing method

An assembly for an LSI test supplies a test signal output from an LSI tester to a target LSI to be tested and outputs, to the LSI tester, a test result signal generated by processing of the target LSI performed in accordance with the test signal. The assembly for an LSI test includes: a peripheral circuit coupled to the target LSI and allowing the target LSI to operate in the same manner as in the application environment; and a printed circuit board on which the peripheral circuit is mounted.

Assembly for LSI test and method for the test

An ancillary equipment is provided for testing a semiconductor integrated circuit, by which a plurality of BOST boards serving as measuring units can be set near a device to be measured and tests can be conducted with high accuracy on a number of circuits embedded on a semiconductor integrated circuit such as a system LSI. To achieve an object of performing a go/no go test or a functional/performance characterization in the manufacturing process of the semiconductor integrated circuit, the ancillary equipment includes: a device measuring unit having a measuring section for exchanging a signal with a device or a semiconductor integrated circuit, and an analyzing section for analyzing information from the measuring section using a programmable device; and a control/communication card constituted of a board different from that of the device measuring unit and connected to the device measuring unit to control it, and being capable of performing communication with a general-purpose computer.

Ancillary equipment for testing semiconductor integrated circuit

Decrypting device

Growing community of inventors

Osaka, Japan

Tomohiko Kanemitsu