Senju Metal Industry Co., Ltd.

Nippondenso Co., Ltd.

Tomohiko Iino

Ryoichi Suzuki

Yuuji Kawamata

Noriyuki Haga

Toshihiko Taguchi

Masaki Sanji

Kouichi Ootuka

A water-soluble soldering flux having good solderability, removability with water, and insulation resistance comprises, as activators, a combination of tartaric acid and a hydrohalide salt of mono-, di-, or tri-ethanolamine.

Water-soluble soldering flux

A method and device of performing plating of an item having a row of fine parts, e.g. a flatpack IC are disclosed. The method comprises immersing said item in a bath of molten solder, removing said item from said bath while maintaining said item in an attitude such that said row of fine parts is sloped with respect to the surface of said molten solder, and causing flux to exert a fluxing action on said molten solder which adheres to said fine parts, thereby decreasing the surface tension of the solder adhering to said fine parts and preventing bridges of solder from forming between said fine parts.

Support device for plating an item having fine parts

Method of performing plating of an item having fine parts and a support

Growing community of inventors

Souka, Japan

Tomohiko Iino