Matsushita Electric Industrial Co., Ltd.

Panasonic Corporation

Tomohide Wada

Kenji Kuranuki

Yasuhiro Kobatake

Katsuyuki Nakamura

Hiroshi Shimada

In a fixing portion against which an end surface of a capacitor element abuts is provided on a portion of a cathode lead frame covered with a casing resin, the distance through which external oxygen moves to reach the capacitor element is increased by the distance of the fixing portion, whereby probability of oxidation is remarkably reduced, thus oxidation hardly occurs in the capacitor element. Further, since the capacitor element can be reliably positioned by bringing its end into abutment against the fixing portion, assembly accuracy is largely improved and the capacitor can be made compact with ease.

Solid electrolytic capacitor and method for manufacturing the same

The basic electric performance is same as or better than the prior art, and moreover occurrence of defective insulation due to the conductive high polymer layer reaching the anode lead-out part is prevented and occurrence of insulation breakdown is also prevented. Still more, the conventional productivity is not sacrificed. The solid electrolytic capacitor having such effects and its manufacturing method are obtained. It includes an anode electrode having a capacitor element part, forbidden band, and an anode lead-out part, a dielectric oxide layer disposed on the surface of the capacitor element part, a conductive high polymer layer disposed on the dielectric oxide layer, a conductor layer disposed on the conductive high polymer layer, an anode terminal electrically connected to the anode lead-out part, and a cathode terminal electrically connected to the conductor layer. The forbidden layer has a boundary portion disposed between the capacitor element part and the anode lead-out part in order to separate into the capacitor element part and anode lead-out part. The anode electrode has at least one undulated layer of roughened layer and porous layer.

Solid electrolytic capacitor, and method of manufacturing the same

A solid electrolytic capacitor of the present invention is produced by connecting a solid electrolytic capacitor element with a lead frame after plating the lead frame with copper and then roughening the surface thereof, and then by molding the solid electrolytic capacitor element and lead frame with an encapsulating resin possessing a thermal expansion coefficient that is near the thermal expansion coefficient of the lead frame. The solid electrolytic capacitor thus produced shows excellent solderability and can withstand a thermal shock encountered at the time of soldering when the solid electrolytic capacitor is mounted on a circuit board. Accordingly, a solid electrolytic capacitor that ensures excellent reliability after being mounted on a circuit board is obtained. In addition, by coating the terminals of the solid electrolytic capacitor with protective plating after resin molding, the solid electrolytic capacitor realizes long shelf life and also assures excellent reliability after being mounted on a circuit board.

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Kyoto, Japan

Tomohide Wada