Kyocera Corporation

Tomohide Hasegawa

Masanobu Ishida

Noriaki Hamada

Takuji Okamura

Toshihiro Iwaida

Yasuhiro Sasaki

Teruhisa Makino

Hirosi Okayama

Minako Izumi

Koichi Motomura

A wiring board for a light-emitting element includes a ceramic insulating substrate, and a conductor layer formed on the surface or in the inside of the insulating substrate, the conductor layer having a mounting region mounting a light-emitting element on one surface of the insulating substrate. The insulating substrate includes a heat-conducting pole-like conductor having a thermal conductivity higher than that of the insulating substrate. The heat-conducting pole-like conductor extends through the insulating substrate in the direction of thickness thereof from the light-emitting element mounting region of the insulating substrate, and is formed by the co-firing with the insulating substrate.

Wiring board for light-emitting element

A wiring board of the present invention is equipped with an insulating board formed of a sintered product of silicon nitride containing a silicon nitride crystal phase, and a metal circuit formed on said insulating board, wherein said sintered product of silicon nitride contains a rare earth element (RE) and magnesium in a total amount of from 4 to 30 mol % calculated as oxides and at a molar ratio (RE,O,/MgO) calculated as oxides of from 0.1 to 15, and has a relative density of not smaller than 90% and a heat conductivity of not smaller than 50 W/m&middot;K. The wiring board is equipped with the insulating board having very excellent heat-radiating property and a large strength, and is very useful as a wiring board for, for example, power modules.

Wiring board having excellent heat-radiating property

Growing community of inventors

Kokubu, Japan

Tomohide Hasegawa