Kabushiki Kaisha Toyota Jidoshokki

Mie Prefecture

Tomohei Sugiyama

Kyoichi Kinoshita

Eiji Kono

Katsufumi Tanaka

Takashi Yoshida

Hidehiro Kudo

Manabu Miyoshi

Manabu Ishikawa

Naohisa Nishino

Takuya Arayama

Mamoru Kojima

Masato Noguchi

Yasuo Kotetsu

Hiroyuki Isomura

Naoki Yamamoto

A vehicle compressor component includes an aluminum alloy material made by hot-extruding. The aluminum alloy material has a chemical composition consisting of Fe: 5.0% to 9.0% by mass, Mg: 0.7% to 3.0% by mass, V: 0.1% to 3.0% by mass, Mo: 0.1% to 3.0% by mass, Zr: 0.1% to 2.0% by mass, Ti: 0.02% to 2.0% by mass, and balance Al and unavoidable impurities. The aluminum alloy material has a density of 2.96 g/cmor more. A method for manufacturing the vehicle compressor component includes: compacting aluminum alloy powders having the chemical composition to prepare a compact; hot-extruding the compact to make an aluminum alloy material; and forming the aluminum alloy material into a desired shape.

Vehicle compressor component and method for manufacturing the same

An austenitic cast iron including basic elements of C, Si, Cr, Ni, Mn and Cu; and the balance including Fe, inevitable impurities and/or a trace-amount modifier element, which is effective in improving a characteristic of the cast iron, in a trace amount; and structured by a base comprising an Fe alloy in which an austenite phase makes a major phase in ordinary-temperature region; wherein the basic elements fall within compositional ranges that satisfy the following conditions when the entirety of the cast iron is taken as 100% by mass: C: from 2.0 to 3.0%; Si: from 4.0 to 5.4%; Cr: from 0.8 to 2.0%; Mn: from 3.9 to 5.6%; Ni: from 17 to 22%; and Cu: from 0.9 to 1.6%.

Austenitic cast iron, austenitic-cast-iron cast product and manufacturing process for the same

The present invention is a process for producing a radiator member for electronic appliances, and is characterized in that, in a process for producing a radiator member for electronic appliances, the radiator member comprising a composite material in which SiC particles are dispersed in a matrix metal whose major component is Al, it comprises a filling step of filling an SiC powder into a mold, a pre-heating step of pre-heating the mold after the filling step to a pre-heating temperature which falls in a range of from a melting point or more of said matrix metal to less than a reaction initiation temperature at which a molten metal of the matrix metal and SiC particles in the SiC powder start to react, and a pouring step of pouring the molten matrix metal whose molten-metal temperature falls in a range of from the melting point or more of the matrix metal to less than the reaction initiation temperature, into the mold after the pre-heating step, and impregnating the SiC powder with the molten metal by pressurizing. When the molten-metal temperature and the pre-heating temperature are from the melting point or more of the matrix metal to less than the reaction initiator temperature, it is possible to inhibit the generation of low thermal conductive materials while securing the impregnation of the molten metal into the SiC powder.

Radiator member for electronic appliances and processes for producing the same

First, a melt of Al or a melt of an Al alloy containing Si is injected in a die filled with SiC powder and cast to form a plate member made of an Al/SiC composite. Next, an Al foil member made of an Al&#x2014;Mg-based alloy is joined with the surface of the plate member through hot pressing. As a result, part of the Al foil member enters casting blowholes on the surface of the plate member to fill the casting blowholes. In addition, an Al&#x2014;Mg-based alloy layer is formed on the surface of the plate member. Thus, a base plate having a nearly flat surface is produced.

Method of producing base plate circuit board, base plate for circuit board, and circuit board using the base plate

A mold is filled with unsintered SiC particles and a melt of Al or of an Al alloy containing Si is poured into the mold for high pressure casting. Owing to the SiC particles and Si precipitated upon casting, a low expansion material having a low thermal expansion coefficient is produced. A heat transmission path is formed by Al infiltrating spaces between the SiC particles and therefore high heat conductivity is obtained.

Method of manufacturing a low expansion material and semiconductor device using the low expansion material

A plate-shaped composite material has a first member and a second member. The first member is an expanded metal formed of a metal plate. The coefficient of linear expansion of the metal plate is less than or equal to 8&#xd7;10/degrees Celsius. The first member suppresses thermal expansion of the composite material. The coefficient of thermal conductivity of the second member is greater than or equal to 200 W/(m&#xd7;K). The second member maintains the coefficient of thermal conductivity of the composite material. This structure provides a reliable coefficient of thermal conductivity and high strength. The structure is suitable for a cooling substrate on which electronic elements such as semiconductors are mounted.

Composite structural material, and method of producing the same

A low-expansion unit includes a plate member and an iron-nickel layer. Upper and lower surface layers of the plate member each have the iron-nickel layer thereon and/or therein. While the plate member has a relatively large thermal expansion coefficient, the iron-nickel layers, which are formed on and/or in the upper and lower surface layers of the plate member, have a relatively small thermal expansion coefficient. Therefore, thermal expansion coefficient of the low-expansion unit is as a whole restrained to a relatively small value. Also, the plate member includes pure iron whose thermal conductivity is relatively high. Meanwhile, the iron-nickel layers, which are formed on the plate member, are relatively thin. Therefore, the low-expansion unit has a relatively large thermal conductivity in a direction of thickness thereof.

Low-expansion unit, method of manufacturing the same and semiconductor provided with the same

A plate of an expanded metal and two metal plates are overlaid on one another. The expanded metal plate has a plurality of meshes. The linear expansion coefficient of the expanded metal is equal to or less than 8&#xd7;10/&#xb0; C., and the thermal conductivity of the metal plates is equal to or more than 200 W/(m&#xb7;K). Then, the metal plates and the expanded metal plate are subjected to hot rolling to be rolled and joined. The rolling and joining are performed in two stages. In the first stage, the meshes of the expanded metal plate are filled with the material of the metal plates. In the second stage, the rolling and joining are performed such that the composite material has a predetermined thickness. The volumetric ratio of the expanded metal plate to the composite material is in a range between 20% and 70%, inclusive. The composite material, which has an improved thermal conductivity and strength and is suitable for heat dissipating substrate, is manufactured at a reduced cost.

Composite material and method for manufacturing the same

A heat spreader includes an electromagnetic soft iron sheet and a plating layer formed on the surface of the sheet. The plate is made of a rustproof metal. An electronic component is mounted on an aluminum base with an HITT substrate and the heat spreader in between. The heat spreader is manufactured at low cost and has a favorable property as a heat dissipating material.

Heat dissipating material and manufacturing method thereof

A process for filling a powder includes the steps of charging a powder into a cavity of a container and, after the charging step, vibrating a swinging body on the powder which is held in the cavity, thereby filling the powder with a high density. Since the swinging body swings in the cavity, it is possible to fill the powder in the container with a high apparent density being improved much more than conventional processes for filling powders. The process is applicable to an apparatus for filling a powder and a process for producing a composite material.

Growing community of inventors

Kariya, Japan

Tomohei Sugiyama