Saginomiya Seisakusho, Inc.

Tomoharu Oba

Kazuya Takimoto

Tatsuya Tanaka

In a pressure sensor, a cap-shaped shielding member () to block an electric field undesirable for a signal processing electronic circuit unit of a sensor chip () is supported by an end surface of a disk conductive plate () between one end surface of the sensor chip () in a liquid sealing chamber () and a diaphragm (). The conductive plate () is electrically connected via a group of input-output terminals () and bonding wires (Wi), for example, and the sensor chip () is supported by one end portion of a chip mounting member () which is electrically connected via the group of input and output terminals () and the bonding wires (Wi).

Shield structure for pressure sensor, and pressure sensor provided with same

In a pressure sensor, an electric field acting on one end surface of a sensor chip () is blocked by a shielding member (), and an electric field acting on another end surface of the sensor chip () is removed through one end portion of a chip mounting member (), a group of input and output terminals (), and a bonding wire (Wi).

In a pressure sensor, a cap-shaped shielding member () to block an electric field undesirable for a signal processing electronic circuit unit of a sensor chip () is supported by an end surface of a disk conductive plate () between one end surface of the sensor chip () in a liquid sealing chamber () and a diaphragm (). The conductive plate () is electrically connected via a group of input-output terminals () and bonding wires (Wi), for example, and the sensor chipis supported by one end portion of a chip mounting member () which is electrically connected via the group of input and output terminals () and the bonding wires (Wi).

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Tokorozawa, Japan

Tomoharu Oba