Nippon Mining & Metals Co., Ltd.

Tomoharu Mimura

Akihiro Aiba

The present invention provides a surface-treating agent which improves heat resistance, adhesiveness to resin and solder wettability. The surface-treating agent for metal contains a tetrazole derivative represented by the following formula and/or a salt thereof, wherein Rand Reach independently represent a hydrogen atom, a halogen atom, or an alkyl group or an aryl group, etc., which each have a carbon number of not more than 10, and a group having a halogen atom, a hydroxyl group, a carboxyl group, an amino group or a mercapto group added thereto, or represent an amino group, a mercapto group, a hydroxyl group or a carboxyl group; and Rrepresents a bond or an alkylene group, etc., which each have a carbon number of not more than 10, and a group having a halogen atom, a hydroxyl group, a carboxyl group, an amino group, a mercapto group, an azo group (&#x2014;N&#x2550;N&#x2014;), a sulfide group (&#x2014;S&#x2014;), or a disulfide group (&#x2014;S&#x2014;S&#x2014;) added thereto, or represents an azo group, a sulfide group, or disulfide group, and may contain a metal or metal compound.

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Kitaibaraki, Japan

Tomoharu Mimura