Renesas Electronics Corporation

Jgc Corporation

Tomoharu Inoue

Kou Sasaki

Yoshinori Yamada

Tomohiro Kamimura

Masahito Seiwa

Kaoru Sawayanagi

Yuichi Yoshizawa

Ken Ichimura

A natural gas liquefying apparatus includes: a precooling unit, which is a treatment unit configured to precool natural gas; a liquefying unit, which is a treatment unit configured to liquefy the natural gas; a refrigerant cooling unit, which is a treatment unit configured to cool a liquefying refrigerant; a compression unit configured to compress vaporized refrigerants; and a pipe rack including air-cooled coolers arrayed and arranged on an upper surface. The treatment units and the compression unit are separately arranged in a first arrangement region and a second arrangement region arranged opposed to each other across a long side of the pipe rack. The pipe rack interposed between the first and second arrangement regions has a region in which no air-cooled cooler is arranged in order to arrange a plurality of pipes, through which refrigerants are allowed to flow, in a direction of a short side of the pipe rack.

Natural gas liquefying apparatus

A wafer fabrication method includes a first step of forming a plurality of first channel regions in a first region on a surface of a water, a second step of forming a plurality of second channel regions having an impurity concentration different from an impurity concentration of the first channel regions, a third step of forming a plurality of third channel regions in a third region on the surface of the water, and a fourth step of forming a plurality of fourth channel regions having an impurity concentration different from an impurity concentration of the third channel regions in a fourth region, wherein the first region and the second region are divided by a first line segment on the wafer, and the third and fourth regions are divided by a second line segment intersecting with the first line segment on the wafer.

Sample wafer fabrication method

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Kanagawa, Japan

Tomoharu Inoue