Shin-etsu Handotai Co., Ltd.

Tomofumi Takano

Takahiro Kida

Susumu Sarashina

Yuki Miyazawa

A method for cleaning a semiconductor wafer by using a chemical tank containing an SC-2 solution including, a plurality of the chemical tanks are used, and among SC-2 solutions contained in the plurality of chemical tanks, an HCl concentration in an SC-2 solution contained in a chemical tank to be finally used is lowered to the lowest to clean the semiconductor wafer. The method for cleaning a semiconductor wafer thus provided can improve the particle level in SC-2 cleaning for a semiconductor wafer without degrading the metal impurity level on the semiconductor wafer surface.

Method for cleaning semiconductor wafer

Method for processing a semiconductor-wafer having a front surface, back surface, and chamfered-portion composed of a chamfered surface on the front surface side, a chamfered surface on the back surface side, and an end face at a peripheral end, including: mirror-polishing of each portion of the chamfered surface on the front surface side, the chamfered surface on the back surface side, the end face, and an outermost peripheral-portion on the front or back surface adjacent to the chamfered surface; wherein the end face mirror-polishing and mirror-polishing of the outermost peripheral-portion on the front or back surface are performed in one step, after step of mirror-polishing the chamfered surface on the front surface side and step of mirror-polishing the chamfered surface on the back surface side; roll-off amount of the outermost peripheral-portion on the front or back surface is adjusted by one step-performed mirror-polishing of the end face and outermost peripheral-portion.

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Nagano, Japan

Tomofumi Takano