Fuji Electric Co., Ltd.

Tomofumi Oose

Hideaki Takahashi

Masahiro Taoka

Satoshi Sawayanagi

In a semiconductor device, when a printed circuit board is pressed against a bottom part of a case with an adhesive interposed therebetween, the back surface of the printed circuit board is supported by projections formed on the bottom part. Since the gap between the printed circuit board and the bottom part is maintained to have substantially the same height as the projections, the adhesive pressed by the printed circuit board does not spread excessively. At each edge of the printed circuit board in the long-side direction, the end of the adhesive is aligned with or extends slightly beyond the edge. In the short-side direction, the adhesive extends beyond each edge of the printed circuit board, but does not extend over the front surface of the printed circuit board, internal connection terminals, or the front surface of a ceramic circuit board.

Semiconductor device including a warped printed circuit board disposed in a case and method of manufacturing same

Semiconductor module

Aspects of the invention provide a semiconductor module that can be manufactured without using a bending jig for bearing the stress in bending process of the terminal and scarcely generates cracks in the resin parts of the semiconductor module. In some aspects of the invention, a semiconductor module can include a casing made of a resin material accommodating a semiconductor chip, a terminal one end of which is electrically connected to the semiconductor chip and the other end of which is projecting out of the casing and bent and a lid made of a resin material fitted on an opening of the casing, a part of end region of the lid being in contact with the terminal and being a thick part with a thickness thicker than a thickness of other parts of the lid.

Growing community of inventors

Matsumoto, Japan

Tomofumi Oose