Sumitomo Bakelite Company Limited

Tomoe Yamashiro

Satoru Katsurayama

Takashi Hirano

Tetsuya Miyamoto

Hiroyuki Yamashita

Mitsuo Sugino

Toshio Komiyatani

Kenzou Maejima

The problem of the present invention is to provide a chip-on-chip type semiconductor electronic component and a semiconductor device which can meet the requirements for further density increase of semiconductor integrated circuits. The present invention provides: a chip-on-chip type semiconductor electronic component in which a circuit surface of a first semiconductor chip and a circuit surface of a second semiconductor chip are opposed to each other, wherein the distance X between the first semiconductor chip and the second semiconductor chip is 50 &#x3bc;m or less, and the shortest distance Y between the side surface of the second semiconductor chip and the first external electrode is 1 mm or less; and a semiconductor device comprising the same.

Semiconductor electronic component and semiconductor device using the same

The present invention provides an adhesive tape comprising a flux-active compound having a carboxyl group and/or a phenolic hydroxyl group, a thermosetting resin and a film-forming resin. In the adhesive tape of the present invention, the thermosetting resin may be an epoxy resin and may contain a curing agent. The curing agent may be an imidazole compound and/or a phosphorous compound. The adhesive tape of the present invention can be used as an interlayer material for a circuit board and a multilayered flexible printed circuit board.

Adhesive film

The present invention relates to an adhesive tape for electrically connecting semiconductor chips in a chip-on-chip type semiconductor device. The adhesive tape comprising: (A) 10 to 50 wt % of film forming resin; (B) 30 to 80 wt % of curable resin; and (C) 1 to 20 wt % of curing agent having flux activity.

Adhesive tape and semiconductor device using the same

An adhesive tapeelectrically connecting conductive components includes a resin layercontaining a thermosetting resin, a solder powderand a curing agent. The solder powderand the curing agent reside in the resin layer, the curing temperature Tof the resin layerand the melting point Tof the solder powdersatisfy T&#x2267;T+20&#xb0; C., wherein the resin layershows a melt viscosity of 50 Pa&#xb7;s or above and 5000 Pa&#xb7;s or below, at the melting point Tof the solder powder

Adhesive tape, connected structure and semiconductor package

A semiconductor device () comprises a first resin substrate () on which a first semiconductor chip () is mounted a surface thereof; a second resin substrate () on which a second semiconductor chip () is mounted on a surface thereof; and a resin base material (), joined to a front surface of the first resin substrate () and to a back surface of the second resin substrate (), so that these surfaces are electrically connected. The resin base material () is disposed in a circumference of the first resin substrate () in the surface of the first resin substrate (). Further, the first semiconductor chip () is disposed in a space section provided among the first resin substrate (), the second resin substrate () and the resin base material () in the surface of the first resin substrate ().

Growing community of inventors

Tokyo, Japan

Tomoe Yamashiro