Nikon Corporation

Dmg Mori Company Limited

Canon Kabushiki Kaisha

Tokyo Institute of Technology

Sophia School Corporation

Soliton Systems K.k.

Tomoaki Yamada

Makoto Kubota

Hiroshi Uchida

Hideaki Takahashi

Jumpei Hayashi

Takayuki Watanabe

Hisato Yabuta

Hiroshi Funakubo

Kaoru Miura

Shizuo Nishikawa

Tatsuo Fukui

Hirofumi Arima

Satoshi Miyamoto

Yuwa Ishii

Shintaro Yasui

Keisuke Yazawa

Jun-ichi Nagata

Sumiko Takahagi

Jyunichi Nagata

Junichi Morishita

A processing system includes a machine tool including a measuring unit which outputs measurement information for calculating a shape of a processing object, a control unit which generates position information related to a position of the measuring unit at the time of measuring the processing object and outputs the generated position information and a generation time signal indicating a time at which the position information is generated, an acquisition unit which acquires the output position information and the generation time signal, an estimation unit which estimates the time at which the position information is generated on the basis of a time at which the acquisition unit acquires the generation time signal, and a shape calculation unit which calculates a shape of the processing object on the basis of the measurement information, the position information, and the time estimated by the estimation unit.

Processing system, measuring probe, shape measuring device, and program

A processing system includes a control unit that generates positional information related to a position of a measuring unit at a time of measuring a processing object and outputs the generated positional information and a generation period signal indicating a period during which the positional information is generated, an acquisition unit that acquires the positional information and the generation period signal which have been output, an acquisition interval calculation unit that calculates a statistical value indicating an interval between acquisition periods regarding a plurality of generation period signals acquired by the acquisition unit, an estimation unit that estimates the period during which the positional information is generated on the basis of the statistical value calculated by the acquisition interval calculation unit, and a shape calculation unit that calculates a shape of the processing object based on measurement information, the positional information, and the period estimated by the estimation unit.

Provided is a machine tool including: an image acquiring unit that acquires an image of an imaging target; a movement mechanism that relatively moves the imaging target and the image acquiring unit; and a control unit, wherein the movement mechanism relatively moves the imaging target and the image acquiring unit by a known distance in an imaging direction of the image acquiring unit or in a direction substantially perpendicular to the imaging direction, and the image acquiring unit acquires images of the imaging target before and after the movement, and the control unit calculates a distance between the image acquiring unit and the imaging target in the imaging direction based on a movement distance or a length measured in the two acquired images. This enables distance measurement to be performed in a short time without making contact with an object to be measured.

Distance measuring device

A first aspect of the present invention includes: a monitored process management unit configured to register identification information of a monitored process, which is an execution entity of an application program and which is to be monitored, in a monitored process list and, when there is an inquiry as to whether or not an arbitrary process is a monitored process from an inquiry source, configured to inquire the monitored process list for identification information of the arbitrary process, and moreover configured to return information on whether or not the arbitrary process is a monitored process to the inquiry source; and a notification receiving unit configured to receive, when a distributed object creation management apparatus configured to create a distributed object server and retain identification information of the distributed object server receives a usage request of a distributed object server from a monitored process, a prescribed notification from the distributed object creation management apparatus.

Program behavior monitoring control apparatus, distributed object creation management apparatus, recording medium, and program behavior monitoring system

A measurement apparatus includes a measuring probe, a power supply provided to the measuring probe, a first communication circuit supplied power from the power supply and configured to perform communication of a type-1 signal via a first communication, the type-1 signal containing information regarding measurement performed in the measuring probe, and a second communication circuit supplied power from the power supply and configured to perform communication of a type-2 signal via a second communication, the type-2 signal containing information regarding power supply performed in the power supply, the second communication being more reliable than the first communication.

Measurement apparatus and measurement system

An object is to measure the shape of an object to be measured under a more appropriate condition. A shape measuring device includes a projection unit configured to project a pattern onto a measurement target by light, an image capturing unit configured to capture a picture image of the measurement target onto which the pattern is projected by the projection unit, a movement unit capable of moving a projected position of the pattern on the measurement target by relatively moving the projection unit and the measurement target, and a region-of-interest setting unit configured to set a region of interest for acquiring information used to measure the measurement target to be in at least part of a region captured by the image capturing unit, so as to include an image of the pattern.

Shape measuring device, structured object manufacturing system, shape measuring method, structured object manufacturing method, shape measuring program, and recording medium

A profile measuring apparatus includes: a light source device from which a projection light is irradiated, the projection light having a light amount changing with lapse of time in a first period and a predetermined spatial distribution; an imaging element; a second period setting section which sets a second period including at least a part of the first period; and a profile information obtaining section which obtains an information of the profile of the object based on an image data taken by the imaging element in the second period. The second period setting section sets the second period based on a light amount of a light which comes into the imaging element at the time of an imaging performed before one imaging performed in the second period; and a light amount change pattern of the projection light changing with lapse of time in the first period.

Profile measuring apparatus, structure manufacturing system, method for measuring profile, method for manufacturing structure, and non-transitory computer readable medium

Provided is a Bi-based piezoelectric material having good piezoelectric properties. The piezoelectric material includes a perovskite-type metal oxide represented by the following general formula (1):A(ZnTi)(MgTi)MO&#x2003;&#x2003;General formula (1)where: A represents a Bi element, or one or more kinds of elements selected from the group consisting of trivalent metal elements and containing at least a Bi element; M represents at least one kind of an element selected from the group consisting of Fe, Al, Sc, Mn, Y, Ga, and Yb; and 0.9&#x2266;x&#x2266;1.25, 0.4&#x2266;j&#x2266;0.6, 0.4&#x2266;k&#x2266;0.6, 0.09&#x2266;l&#x2266;0.49, 0.19&#x2266;m&#x2266;0.64, 0.13&#x2266;n&#x2266;0.48, and l+m+n=1 are satisfied.

Piezoelectric material and devices using the same

There is provided a profile measuring apparatus which measures a profile of an object, including an imaging element; an image formation optical system including an objective lens; a measuring direction changing unit which is configured to change inclination of a surface of the object with respect to the objective lens based on information of the inclination of the surface of the object so that a light flux enters the objective lens with an aperture angle not less than a predetermined degree; and a measuring unit which is configured to measure the profile of the object based on the image, of the object on which the pattern is projected, obtained by the imaging element.

Profile measuring apparatus, method for measuring profile, and method for manufacturing product

The present invention relates to a shape measuring device that can improve measurement accuracy. A liquid crystal elementprojects striped projection patterns whose intensities are changed according to the position in three sinusoidal states with initial phases of 0, 120, and 240 degrees onto an objectto be measured, each of a CCD sensorand a CCD sensorpicks up an image obtained by forming reflection light from the objectto be measured by the projected projection pattern, and a controllerevaluates reliability of a measurement result at a position where a position conjugated with an image pickup surface of image pickup means is different along an optical path direction on the basis of each received light amount of each pixel of a plurality of images picked up when at least two projection patterns are projected. As a result, measurement accuracy can be improved. The present invention can be applied to a shape measuring device that measures the shape of an object to be measured.

Shape measuring device

A shape measuring device includes: a slit pattern projection unit () for projecting a slit light onto a test object (); an imaging lens () and a plane parallel plate () for forming a plurality of slit images, which is generated when the slit light is reflected by the object (), separated in a direction perpendicular to a slit base line direction; an imaging unit () for picking up the plurality of slit images and generating a plurality of slit picture images; an XYZ stage drive unit () for relatively moving the slit light and the test object () in a direction different from the slit base line direction of the slit light; a slit picture image selection unit () for comparing the brightness of each pixel of slit picture image on the slit base line direction, and selecting a slit picture image having an optimum brightness to determine the shape of the test object () on the slit base line direction, and acquiring image data to determine the shape of the test object (); and a shape computing unit () for computing a shape of the test object () using a relative position of the slit light with respect to the test object () and the slit picture image data.

Shape measuring device and shape measuring method

A mark position detection apparatus includes: an illumination unit that illuminates a substrate having a mark formed thereupon; an image-capturing unit that captures an image of the substrate by using reflected light from the substrate and outputs image signals; a storage unit at which information related to fixed pattern noise contained in the image signals output by the image-capturing unit is stored in memory; and a control unit that calculates a position of the mark on the substrate based upon the information related to the fixed pattern noise stored in memory at the storage unit and the image signals output from the image-capturing unit.

Mark position detecting apparatus and mark position detecting method

An optical pickup apparatus comprises two photodetectors disposed on one and the same substrate. The light beam from the recording medium is divided into two light components by an optical member and the two light components are guided to the two photodetector positioned on the same substrate.

Growing community of inventors

Yokohama, Japan

Tomoaki Yamada