Idemitsu Kosan Company, Limited

Idemitsu Petrochemical Co., Ltd.

Tomoaki Takebe

Yutaka Minami

Yutaka Obata

Masanori Sera

Yohei Koori

Masao Inoue

Masami Kanamaru

Tsuyoshi Ota

Hideo Teshima

Takenori Fujimura

Takeshi Iwasaki

Toyozo Fujioka

Kazuhiro Hashima

Toshitaka Kanai

Kenji Kobayashi

Keisuke Funaki

Komei Yamasaki

Yasunari Okada

Hiroyuki Higuchi

Takaaki Uchida

Daichi Ogawa

Kanako Samejima

Shinichi Yukimasa

Hiroki Fujinami

Rikki Homma

Harumi Nakashima

Takumi Sugiuchi

Takeharu Tajima

Tsutomu Onodera

Motoki Yamada

Mari Yabe

A thermosetting composition comprising the following component (A) and component (B), and having a viscosity of 0.1 Pa·s or higher and 100 Pa·s or lower at a shear rate of 10 sat 25° C. measured in accordance with JIS K7117-2.

Method of manufacturing a molded article

A nonwoven fabric formed of an olefin-based resin composition (I) containing an olefin-based polymer (i) satisfying specific requirements; a spunbond nonwoven fabric obtained by melt-extruding and molding the olefin-based resin composition (I) at a resin temperature of 220&#xb0; C. or lower, and a method for producing it; a multilayer nonwoven fabric containing the spunbond nonwoven fabric; a nonwoven fabric and a multilayer nonwoven fabric including composite fibers containing an olefin-based resin composition (II) containing an olefin-based polymer (ii) satisfying specific requirements; and a fiber product using the spunbond nonwoven fabric, the nonwoven fabric of composite fibers, or the multilayer nonwoven fabric.

Spunbonded non-woven fabric and method for manufacturing same

Provided is a (meth)acrylate composition containing: (A) at least one (meth)acrylate compound selected from the group consisting of a (meth)acrylate-modified silicone oil, a (meth)acrylate having a long-chain aliphatic hydrocarbon group, and a polyalkylene glycol (meth)acrylate having number-average molecular weight of not less than 400; (B) a (meth)acrylate compound to which an alicyclic hydrocarbon group having 6 or more carbon atoms is ester-linked; (C) (meth)acrylic acid or a (meth)acrylate compound having a polar group; (D) a radical polymerization initiator; and (E) a white pigment.

(Meth)acrylate composition

A base polymer for hot-melt adhesive, containing a propylenic polymer (A) having a tensile modulus of elasticity of 60 MPa or more, and an olefinic polymer (B) having a tensile modulus of elasticity of less than 60 MPa, wherein, relative to 100 parts by mass of the total amount of the propylenic polymer (A) and the olefinic polymer (B), the content of the propylenic polymer (A) is 1 part by mass or more and less than 50 parts by mass, and the content of the olefinic polymer (B) is more than 50 parts by mass and 99 parts by mass or less; and a hot-melt adhesive containing the base polymer, and further containing at least one of (C) a tackifier resin and (D) an oil.

Base polymer for hot melt adhesive

Provided is a hot-melt adhesive which satisfies both solidification rate and adhesiveness. A base polymer for a hot-melt adhesive which satisfies the following (1) and (2): (1) a modulus of elasticity in tension at 23&#xb0; C. is 400 MPa or less; and (2) a semi-crystallization time at 23&#xb0; C. is 20 minutes or less.

Base polymer for hot-melt adhesive agent, and hot-melt adhesive agent

The method of producing a spunbond nonwoven fabric promotes the bleed out of the additive, which has pleasant texture such as tactile feel and excellent flexibility. The spunbond nonwoven fabric is obtained by this method. Specifically, (1) the method of producing a spunbond nonwoven fabric includes annealing a spunbond nonwoven fabric formed by using a crystalline resin composition (I) containing a low crystalline olefin polymer (a) with an elastic modulus of 10 to 450 MPa in a content of 1 to 50% by mass, a high crystalline olefin polymer (b) with an elastic modulus of 500 to 2,000 MPa, the content of the component (b) being the rest, and an additive (c) in a content of 1 to 20,000 ppm by mass. Furthermore, (2) the method of producing a spunbond nonwoven fabric includes annealing a spunbond nonwoven fabric formed by using a core-sheath composite fiber containing a crystalline resin composition (I) as the sheath component; and a crystalline resin composition (II) as the core component containing a high crystalline olefin polymer (b') with an elastic modulus of 500 to 2,000 MPa.

Method for producing spun-bonded nonwoven fabric

Provided are a propylene-based polymer which enhances heat creep resistance and a hot-melt adhesive having excellent heat creep resistance. A propylene-based polymer which satisfies the following (1) and (2): (1) 125&#x2266;a modulus of elasticity in tension (MPa) at 23&#xb0; C.&#x2266;400; and (2) 100&#x2266;an elongation at break (%) at 23&#xb0; C.&#x2266;1,000, and a hot-melt adhesive containing the propylene-based polymer in an amount of 1 to 50% by mass.

Propylene-type polymer and hot-melt adhesive agent

Provided is a non-woven fabric produced by using a polypropylene-based resin composition containing a specific low-crystalline polypropylene. The non-woven fabric is a non-woven fabric obtained by achieving reductions in denier values of fibers, the non-woven fabric being excellent in dispersibility of the fibers.

Non-woven polypropylene fabric

(1) An elastic nonwoven fabric and a fiber product using the elastic nonwoven fabric, the elastic nonwoven fabric containing a crystalline resin composition containing low crystalline polypropylene and high crystalline polypropylene, the low crystalline polypropylene satisfying items (a) and (b) below, and a crystallization temperature (Tc) of the crystalline resin composition measured with a differential scanning calorimeter (DSC) being from 20 to 100&#xb0; C.: (a) a melting point (Tm-D) being from 0 to 120&#xb0; C., which is defined as a peak top of a peak observed on the most high temperature side of a melt endothermic curve obtained by maintaining at &#x2212;10&#xb0; C. for 5 minutes and increasing in temperature at 10&#xb0; C. per minute in a nitrogen atmosphere with a differential scanning calorimeter (DSC); and (b) a stereoregularity index ([mm]) being from 50 to 90% by mol; (2) an elastic nonwoven fabric and a fiber product using the elastic nonwoven fabric, the elastic nonwoven fabric being produced by using a crystalline resin composition containing low crystalline polypropylene satisfying items (c) to (h) below, and a releasing agent: (c) [mmmm]=20 to 60% by mol; (d) [rrrr]/(1&#x2212;[mmmm])&#x2266;0.1; (e) [rmrm]&#x3e;2.5% by mol; (f) [mm]&#xd7;[rr]/[mr]&#x2266;2.0; (g) mass average molecular weight (Mw)=10,000 to 200,000; and (h) molecular weight distribution (Mw/Mn)&#x3c;4; and (3) an elastic nonwoven fabric and a fiber product using the elastic nonwoven fabric, the elastic nonwoven fabric containing core/shell type composite fibers containing low crystalline polypropylene satisfying the items (c) to (h) have excellent elastic recovery property and pleasant texture without stickiness.

Elastic nonwoven fabric, process for producing the same, and textile product comprising the elastic nonwoven fabric

The present invention provides an optical semiconductor sealing material comprising a radically polymerized polymer of a methacrylate ester having an alicyclic hydrocarbon group containing 7 or more carbon atoms, e.g. an adamantyl group, a norbornyl group, or a dicyclopentanyl group; and an optical semiconductor sealing material comprising a radically polymerized polymer of 50 to 97 mass % of the methacrylate ester and 3 to 50 mass % of acrylate ester having a hydroxyl group. The optical semiconductor sealing material of the present invention is highly transparent and stable to UV light and thus does not undergo yellowing. In addition, the material exhibits excellent compatibility between heat resistance and refractive index, does not undergo deformation or cracking during heating processes such as reflow soldering, and shows high processability. The material can be preferably used as a sealing material for light-emitting elements and light-receiving elements of optical semiconductor devices (semiconductor light-emitting devices).

Optical semiconductor sealing material

A polypropylene resin having: (1) a melt flow rate (MFR) of 6 to 100 g/10 minutes, (2) a molecular weight distribution (Mw/Mn), measured by gel permeation chromatography, of 3 to 6, and (3) a 116&#xb0; C. non-eluted component content (100-W116(%)) of 50% or more and a content of components eluted at 90&#xb0; C. or less (W90) of 10 to 30%, measured by temperature-rising fractional chromatography (TREF).

Polypropylene resin, fiber, and nonwoven fabric

The present invention provides a copolymer for syrup, characterized by being formed from (A) 1 to 60 mass % of at least one (meth)acrylate compound selected from among a (meth)acrylate-modified silicone oil, an alkyl(meth)acrylate, a monoalkylene glycol(meth)acrylate, and a polyalkylene glycol(meth)acrylate, and (B) 99 to 40 mass % of a (meth)acrylate compound having a C&#x2267;6 alicyclic hydrocarbon group bonded thereto via an ester bond; a (meth)acrylate composition containing a (meth)acrylate monomer and 1 to 60 mass % of the (meth)acrylate copolymer for syrup; and a cured product of the composition. The (meth)acrylate copolymer for syrup of the present invention has excellent solubility, particularly in a (meth)acrylate compound having an alicyclic ester substituent, and a (meth)acrylate resin composition containing the copolymer provides a stable cured product having high transparency and high resistance to UV rays and heat. Thus, the cured product is suitably used as a material for lenses, illumination devices, automobiles, displays, optical-semiconductors, etc.

(Meth)acrylate copolymer for syrup and resin composition thereof

Provided are a resin for an optical component, which has heat resistance, does not suffer from yellowing because of its stability against heat, and is excellent in transparency and workability; a raw material composition used for the resin for an optical component; and an optical component. Specifically, provided is a resin for an optical component containing a (meth)acrylate compound unit (A1), in which a hydrocarbon group containing an adamantane structure is ester-bonded, and a (meth)acrylate compound unit (B1) having a polyfunctional group, which is other than the unit (A1). Also, provided is a raw material composition used for a resin for an optical component, which contains a (meth)acrylate compound (A2) in which a hydrocarbon group containing an adamantane structure is ester-bonded, and a (meth)acrylate compound (B2) having a polyfunctional group, which is other than the compound (A2). Further, provided is an optical component which is obtained by polymerizing and molding the raw material composition.

Resin for optical component, raw material composition used for resin for optical component, and optical component

A 1-butene polymer satisfying the following (1), (2) and either (3) or (3'): a process for producing the polymer; a resin modifier comprising the polymer; and a hot-melt adhesive containing the polymer. (1) The intrinsic viscosity [&#x3b7;] as measured in tetralin solvent at 135&#xb0; C. is 0.01 to 0.5 dL/g. (2) The polymer is a crystalline resin having a melting point (Tm-D) of 0 to 100&#xb0; C., the melting point being defined as the top of the peak observed on the highest-temperature side in a melting endothermic curve obtained with a differential scanning calorimeter (DSC) in a test in which a sample is held in a nitrogen atmosphere at &#x2212;10&#xb0; C. for 5 min and then heated at a rate of 10&#xb0; C./min. (3) The stereoregularity index {(mmmm)/(mmrr+rmmr)} is 30 or lower. (3&#x2032;) The mesopentad content (mmmm) determined from a nuclear magnetic resonance (NMR) spectrum is 68 to 73%.

Highly flowable 1-butene polymer and process for producing the same

The present invention pertains to a master batch composition which contains 10 to 95% by mass of an additive for plastics, 1 to 50% by mass of an olefin polymer having specific physical properties, and 1 to 89% by mass of a polyolefin resin as a carrier, which is useful for producing a polyolefin resin, particularly an injection molded product of a polypropylene resin, which can improve dispersibility of additives in the polyolefin molded product, which permits high density filling of various additives in the master batch composition, and which is free of blocking. The present invention is also directed to a polyolefin resin composition in which the master batch composition is compounded in a polyolefin resin, and to a polyolefin molded product using the resin composition.

Growing community of inventors

Chiba, Japan

Tomoaki Takebe