Anelva Corporation

Tomoaki Osada

Yasuyuki Shirai

Supika Mashiro

A mechanism for completely separating a substrate, such as a semiconductor substrate, from at base in such a way that the substrate is in a horizontal position and can be easily removed from an electrostatic chuck. The substrate is mounted on a pedestal which is placed on a base such as an electrode. Pins are mounted within the base beneath a central portion of the substrate. The pins can be moved vertically through the circular pedestal to lift the substrate from the pedestal. A ring is mounted around the pedestal and underneath the outer edge of the substrate. When the pins are protrude beyond the top surface of the circular pedestal the substrate is lifted and caused to tilt. The ring then is lifted to act on the outer edge of the rear surface of the substrate, thus separating the substrate from the circular pedestal and returning the substrate to a horizontal position.

Mechanism and method for mechanically removing a substrate

A method for rapidly, reliably, and safely removing a substrate from an electrostatic clamping electrode and a mechanism for effecting the method. The method comprises forming a gap between an electrode and a substrate which had been made to hold onto the electrode by electrostatic clamping to increase the electrostatic potential between the substrate and the electrode, generating a DC-glow-discharge in the vicinity of the substrate according to Paschen's law, and removing the substrate from the electrode after eliminating the static charge from the substrate using gas molecules charged by the DC-glow-discharge. A mechanism for effecting the method comprises a means for introducing a gas, a protruding means, a means for controlling the pressure, a sequencer for sequentially activating them, and a lifting mechanism for adjusting the height of the protruding means to the gap distance necessary for generating a DC-glow-discharge between the substrate and the electrode.

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Tokyo, Japan

Tomoaki Osada