Matsushita Electric Works, Ltd.

Panasonic Corporation

Panasonic Electric Works Co., Ltd.

Yamaju Ceramics Co., Ltd.

Tomoaki Matsushima

Hiroyuki Yagyu

Shinji Hashimoto

Hideo Nakanishi

Motoo Ikari

Takaaki Yoshihara

Yoshiki Hayasaki

Ryo Taniguchi

Takeo Shirai

Tomoaki Nemoto

Tooru Nakashiba

Yuuki Kasai

Yukio Matsushita

Kouhei Kotera

Norihiro Yamauchi

Kenichiro Tanaka

Yuji Takada

Makoto Nishimura

Hiroshi Kawada

Koichi Aizawa

Masao Kubo

Sadayuki Sumi

Toshiyuki Suzuki

Atsushi Suwa

Nobuyuki Miyagawa

Masato Kawashima

Kyosuke Iribe

Yoshihiro Matsumura

Yousuke Hagihara

Junya Ogawa

Kazuhiro Horiuchi

Hideki Ohashi

Ryoichi Terauchi

Koji Sasabe

Futoshi Nishimura

Sibei Xiong

A seed layer having a predetermined pattern is formed on a side of one surface of a second substrate, and a ferroelectric layer is formed on the side of the one surface of the second substrate. A lower electrode is formed on the ferroelectric layer, and the lower electrode and a first substrate are bonded via a bonding layer. A laser beam with a predetermined wavelength is irradiated from a side of other surface of the second substrate to transfer a ferroelectric film, which overlaps with the seed layer, of the ferroelectric layer and the seed layer onto the side of said one surface of the first substrate. The laser beam passes through the second substrate, is reflected by the seed layer, and is absorbed by a second portion of the ferroelectric layer. The second portion does not overlap with the seed layer.

Method for manufacturing ferroelectric device

The MEMS switch comprises a substrate with signal-lines having fixed-contacts, a movable-plate with a movable-contact, a flexible support-member supporting the movable-plate, a static-actuator and a piezoelectric-actuator configured to contact the movable-contact with the fixed-contact. The movable-contact is provided at its longitudinal center with the movable-contact, and its both the longitudinal ends with static-movable-electrode-plate. The support-member is four strips disposed on portions outside of the both width ends of the movable plate. The strip extends along the longitudinal direction of the movable plate, provided with a first end fixed to the movable plate, and provided with a second end fixed to the substrate. The piezoelectric-element is disposed on an upper surface of the strip to be located at a portion outside of the width ends of the movable-plate. The piezoelectric-actuator is configured to develop the stress applied to the coupling-portion which is created between each the strip and the movable-plate.

MEMS switch and method of manufacturing the MEMS switch

A bandpass filter includes a combination of a BAW filter and a patterned planar filter with stubs. The BAW filter is composed of a plurality of piezoelectric resonators to give a specific frequency bandpass, while the planer filter is configured to attenuate frequencies near and outside the bandpass. The resonators are connected in a ladder configuration between a first signal transmission path and a ground. The planar filter includes a strip line formed on a dielectric layer to define a second signal transmission path. The BAW filter and the planar filter are formed on a common substrate with the first and second transmission paths connected to each other. The BAW filter, in combination with the patterned planar filter added with the stub, can improve a deep near-band rejection inherent to the BAW filter, exhibiting an excellent out-of-band rejection over certain adjacent frequency ranges outside of the bandpass, and therefore give a sharp and wide bandpass.

Bandpass filter and process of fabricating the same

A material for an optical circuit-electrical circuit mixedly mounting substrate comprises a light permeable resin layer, and an optical circuit forming layer that is made of a light permeable resin of which refractive index increases (or decreases) when irradiated with an activating energy beam and is disposed adjacent to the light permeable resin layer, wherein a refractive index of a portion of the optical circuit forming layer is higher (or lower) than that of the light permeable resin layer when the material for the optical circuit-electrical circuit mixedly mounting substrate is irradiated with an activating energy beam so that said portion is irradiated.

Material for substrate mounting optical circuit-electrical circuit mixedly and substrate mounting optical circuit-electrical circuit mixedly

A material for an optical circuit-electrical circuit mixedly mounting substrate comprises a light permeable resin layer, and an optical circuit forming layer that is made of a light permeable resin of which refractive index increases (or decreases) when irradiated with an activating energy beam and is disposed adjacent to the light permeable resin layer,

Material for substrate mounting optical circuit-electric circuit mixedly and substrate mounting optical circuit-electric circuit mixedly

A semiconductor light emitting device gives a large radiation surface with an enhanced light radiating capability. A N-type GaN layer and a P-type GaN layer are stacked to define therebetween an interface where a light is generated upon application of voltage across the interface. A light guide on which the GaN layers are developed is utilized to give a wide radiation surface from which the light is given off. The radiation surface is formed with a refractor layer composed of an array of a first medium and a second medium which have individual refraction indexes different from each other and are arranged alternately across the radiation surface. Thus, the light guide can be best utilized to give a large radiation surface, yet formed with the refractor layer which reduces multiple reflections inside of the light guide for effectively passing or radiating the light transmitted through the light guide.

Light emitting device

An infrared ray receiving element includes a substrate made of a pyroelectric material and having at least one cantilever portion surrounded by a slit, in which at least a part of the cantilever portion in the substrate is uniformly polarized in the same direction and the remainder in the substrate includes a portion polarized at random. At least a pair of electrodes are respectively provided on a top surface and a bottom surface of the cantilever portion.

Infrared ray receiving element and infrared ray sensor using the same

A pyroelectric-type IR receiving element comprises a pyroelectric substrate which is fixed to a supporting body at its support ends and at least one rectangular patch formed in the substrate. The patch is formed on its opposite surfaces with first and second electrodes which are overlapped to each other. The substrate has a U-shaped slit composed of a pair of side slits and a base slit connecting the side slits. The U-shaped slit surrounds continuously three sides of the patch, so that the patch is supported by the substrate in a cantilever fashion at a cantilever end which is opposed to one of the support ends of the substrate. Since a thermal stress applied to the substrate when the substrate is exposed to a temperature change is absorbed by the U-shaped slit, a stress concentration to be considered is not developed in the patch. As a result, it is possible to reduce the occurrence of popcorn noise, while maintaining good IR sensitivity.

Pyroelectric-type IR receiving element and IR sensor using the same

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Osaka, Japan

Tomoaki Matsushima