Daicel Corporation

National University Corporation Kumamoto University

Tomoaki Mahiko

Yoshinori Funaki

Kiyoharu Tsutsumi

Naoko Araki

Ming Liu

Masahiro Nishikawa

Yuto Makino

Akihiko Tsurui

Daisuke Ishimoto

Shigeru Tanaka

Kazuyuki Hokamoto

Tomohide Ina

The present invention is to provide a method for producing nanodiamonds doped with a Group 14 element, the method comprising: detonating by exploding an explosive composition containing at least one explosive and at least one Group 14 element compound in a sealed container to obtain nanodiamonds doped with at least one Group 14 element selected from the group consisting of Si, Ge, Sn, and Pb, and removing the Group 14 element and/or oxide thereof by subjecting the nanodiamonds doped with a Group 14 element to an alkali treatment.

Method for producing nanodiamonds doped with group 14 element, and method for purifying same

The present invention is to provide a heteroatom-doped nanodiamond, the heteroatom-doped nanodiamond being doped with at least one heteroatom, the heteroatom-doped nanodiamond satisfying criteria (i) and/or (ii) below: (i) a BET specific surface area being from 20 to 900 m/g, and (ii) an average size of primary particles being from 2 to 70 nm.

Heteroatom-doped nanodiamond

Provided is a cationically polymerizable resin which is rapidly cured upon irradiation with light and forms a cured product excellent in flexibility and thermal stability. The cationically polymerizable resin is obtained through radical polymerization of an oxetane-ring-containing (meth)acryloyl compound represented by following Formula (1) alone or in combination with another radically polymerizable compound. In the formula, Rrepresents hydrogen atom or methyl group; Rrepresents hydrogen atom or an alkyl group; and 'A' represents a linear or branched chain alkylene group having 2 to 20 carbon atoms. 

Cationically polymerizable resin, cationically polymerizable resin composition, and cured products thereof

Disclosed is a cationically polymerizable resin composition which includes an oxetane-ring-containing vinyl ether compound (A) and/or an alicyclic-epoxy-containing vinyl ether compound (B); and an oligomer or polymer (C) having a molecular weight of 500 or more, being liquid at 0&#xb0; C., and containing at least one of structures represented by following Formulae (1a) to (1f), wherein Rrepresents hydrogen atom or methyl group; Rto Reach independently represent a hydrocarbon group having 1 to 5 carbon atoms; 'a' is an integer of from 0 to 5; and 'b' is 1 or 2. This cationically polymerizable resin composition has a low viscosity, is easy to work, cures extremely rapidly upon irradiation with light, and can give a cured object excellent in flexibility, thermal stability, and bendability after heat treatment. 

Cationically polymerizable resin composition and cured object obtained therefrom

Provided is a radical-polymerizable resin capable of giving a cured material which is satisfactorily flexible, can relax stress upon usage as an adhesive, and does not cause disadvantages such as separation at the adhesive interface or breakage of an adherend, which stress occurs between the adhesive and the adherend upon heating or cooling and is caused by difference in coefficient of thermal expansion between them. The radical-polymerizable resin is obtained through cationic polymerization of a compound represented by any of following Formulae (1a) and (1b) and a compound represented by any of following Formulae (2a), (2b), (2c), (2d), (2e), and (2f). The radical-polymerizable resin is liquid at 0 &#xb0; C. and has a weight-average molecular weight of 500 or more. Symbols in the formulae are as defined in the description. 

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Himeji, Japan

Tomoaki Mahiko