Nec Corporation

Mitsubishi Electric Corporation

Meidensha Corporation

Tomoaki Kimura

Junichi Tanaka

Tsutomu Kubota

Satoshi Murata

Taku Sato

Seiji Ichikawa

Tomoaki Hirokawa

Takeo Ogihara

Kenji Uchida

Masatoshi Ohara

Takeshi Amimoto

Kenji Watanabe

Kikuo Izumi

Yu Kawai

Yuki Itogawa

Takao Akiyama

Tatsuya Okuda

Yusuke Higaki

Tsutomu Noguti

Kenji Utida

An insulating transformer includes a plurality of sub-insulating transformers connected in series. Polarity directions of all sub-windings are identical. When a current I flows from a first main terminal to a third main terminal through the first sub-winding, an interphase capacitance, and the second sub-winding, excitation inductance of the first sub-winding and excitation inductance of the second sub-winding are configured to have opposite polarities.

Insulating transformer and power conversion device equipped with same

In a DC/DC converter, in first power transmission in which power is transmitted from a first DC power source to a second DC power source, on/off drive of a positive electrode-side switching element and a negative electrode-side switching element is stopped in a third bridge circuit on the power-receiving side. When a power transmission amount by the first power transmission is smaller than a first reference value, a control circuit lowers the switching frequency of the switching elements of a first bridge circuit and a second bridge circuit on the power-transmitting side and a fourth bridge circuit on the power-receiving side, compared with when the power transmission amount is equal to or greater than the first reference value.

DC/DC converter and power conversion device

A power conversion device converts a direct-current power on the DC side of the power conversion device to an alternating-current power by an inverter circuit having a plurality of semiconductor switching elements, and outputs the AC power from the AC side of the power conversion device. A current detector detects a reactor current output from the inverter circuit. As overcurrent detector detects overcurrent in a control mode in which the reactor current is caused to follow a reactor current command value, control circuit starts an overcurrent mode in which a time period where the reactor current monotonically decreases is provided. In the overcurrent mode, whether to switch the overcurrent mode to the normal control mode is determined based on the reactor current or in accordance with a timing corresponding to a zero-cross point of a voltage or current on the AC side.

Power conversion device

A control device of a dynamometer system is provided with: a driving force observer which estimates a generated driving force of a vehicle; an electrical inertia control unit which uses the driving force to generate a front wheel basic torque command signal and a rear wheel basic torque command signal; a synchronization control unit which generates a synchronization control torque command signal with respect to the basic torque command signal and the basic torque command signal in such a way as to eliminate a speed difference; and torque command signal generating units which use the synchronization control torque command signal to adjust the basic torque command signal and the basic torque command signal. The synchronization control unit is defined in such a way that the poles of a denominator polynomial of a transfer function from the driving force to the speed difference are all negative real numbers.

Control device of dynamometer system

An electronic component includes a substrate portion, a bank portion, a plurality of lead members, an anchor hole, and at least a pair of notches. A chip is supported on the substrate portion. The bank portion is formed on a periphery of the substrate portion to surround the chip. The plurality of lead members are made of conductive strip pieces, and each lead member has an inner lead electrically connected to the chip and an outer lead extending to an outside. The substrate portion and the bank portion are integrally molded with a resin to include the lead members, so that the inner and outer leads are fixed to a connecting portion between the substrate portion and the bank portion. The anchor hole is formed in a portion where each of the lead members is in contact with the bank portion, and is filled with a resin. The pair of notches are formed in two ends of each of the lead members to sandwich the anchor hole.

Electronic component

An ultrahigh-frequency electronic component has an ultrahigh-frequency chip encased in a molded-resin package. The ultrahigh-frequency electronic component includes a first sealing layer encasing the ultrahigh-frequency chip therein and a second sealing layer encasing the first sealing layer therein. The first sealing layer contains a number of voids or minute air bubbles therein which are effective in reducing the permittivity of the first sealing layer. A method of manufacturing the ultrahigh-frequency electronic component is also disclosed.

Ultrahigh-frequency electronic component and method of manufacturing the

In a lead frame flash removing method and apparatus, a lead frame is molded integrally with a case. After molding, abrasive agent-mixed water is sprayed to a surface of the lead frame where a flash is formed. The lead frame is dipped in an electrolytic solution and applying a DC voltage is applied across the lead frame and an electrode in the electrolytic solution, thereby electrolytically processing the lead frame. After the electrolytic process, an external force is applied to the surface of the lead frame, thereby removing the flash.

Lead frame flash removing method and apparatus

A hollow package manufacturing method includes the adhesive spreading step, the adhesive applying step, and the cap adhering step. In the adhesive spreading step, an adhesive is spread on a circular table to a uniform thickness. In the adhesive applying step, an open end face of a cylindrical cap having a bottom is urged against the circular table to apply the adhesive to the cap. In the cap adhering step, the cap applied with the adhesive is adhered to a case. A hollow package manufacturing apparatus is also disclosed.

Hollow package manufacturing method

A package of the present invention comprises a base molded integrally with a lead frame by resin, a chip mounted on the lead frame, and a cap made of resin, which covers the chip and is fixed to the base. The base includes a substrate portion sealing the lead frame therein, a frame-shaped bank portion formed at a periphery of an upper surface of said substrate portion, the bank portion having said lead frame interposed between it snd the substrate portion, and an anchor portion formed at a portion of the lead frame interposed between the substrate portion and the bank portion. The chip is mounted on a region of the lead frame surrounded by the bank portion. The cap is fixed to the bank portion.

Mold package for sealing a chip

Ultrahigh-frequency electronic component

A semiconductor device includes a square pellet, a gate electrode pad, a drain electrode pad, a pair of source electrode pads, and a source electrode path. The pellet has first and second diagonal lines. The gate electrode pad is arranged on one of two corners located on the first diagonal line on the pellet. The drain electrode pad is arranged on the other of the two corners located on the first diagonal line on the pellet. The pair of source electrode pads are arranged on two corners located on the second diagonal line on the pellet. The source electrode path connects the source electrode pads to each other.

Growing community of inventors

Tokyo, Japan

Tomoaki Kimura