Terumo Kabushiki Kaisha

Renesas Electronics Corporation

Mitsubishi Denki Kabushiki Kaisha

Other

Renesas Technology Corp.

Ryoden Semiconductor System Engineering Corporation

Tomoaki Hashimoto

Tsuyoshi Hasegawa

Tatsuya Hirai

Masatoshi Yasunaga

Takashi Kikuchi

Ryohei Katsuki

Yuuki Hara

Masaki Watanabe

Jun Shibata

Kazuhiko Kurafuchi

Hiroshi Seki

Akiyoshi Sawai

Katsunori Asai

Yoshikazu Narutaki

Michiaki Sugiyama

Tetsuya Matsuura

Tomoki Utsugida

Yasushi Kasatani

Makio Okada

An extracorporeal blood circulation system monitors blood level in a reservoir which temporarily stores the blood. A memory storage unit stores blood pressure measurements from a pressure sensor monitoring a blood pressure within a tube unit conveying blood from the reservoir relative to atmosphere. A processing unit that detects a height of a top surface of the blood stored in the reservoir based on changes in the blood pressure measurements and a conservation of mechanical energy of a blood flow inside the tube unit. A notification is generated if an abnormality is detected in the height of the blood in the reservoir.

Extracorporeal circulation management device with blood level detection in a reservoir without a sensor

An extracorporeal circulation apparatus has a blood reservoir temporarily storing blood and a presence information acquisition unit to detect presence or absence of blood at respective wall locations in a two-dimensional array. A control unit determines the position of a blood surface on the basis of consecutive elements in the array having detected blood along at least one of a first direction parallel to the blood surface and a second direction perpendicular to the blood surface.

Extracorporeal circulation apparatus

An extracorporeal circulation management device pumps blood in synchronization with heartbeats of a patient based on measurements of blood flow. Maximum and minimum blood flow measurement samples are compared with upper and lower threshold values to identify candidate timing for a systolic phase and diastolic phase of the heartbeat. During pulsatile pumping of the blood using the candidate timing, differences in the pulsatile flow measurements are determined. Based on the size of the difference, a final correction may be made to identification of the systolic and diastolic phases, and the corrected phase information is used to start and stop the motor unit.

Extracorporeal circulation management device with heartbeat synchronizaton

An extracorporeal blood circulation management device having an oxygenator accurately determines oxygen consumption by the target person and oxygen delivery by the oxygenator. Oxygenation-related parameter values in the blood are determined at regular intervals. An in-body passing time (a cycle time for a particular volume of blood to pass from input sensors to output sensors) is determined. Parameter values separated by the in-body passing time are selected as comparison targets to evaluate oxygenation consumption of the target person. An oxygenator unit passing time is determined. Parameter values separated by the oxygenator unit passing time are selected as comparison targets to evaluate oxygenation delivery of the oxygenation unit.

Extracorporeal circulation management device and extracorporeal circulation device having it

An extracorporeal blood circulator includes a control unit and a speed manipulation section. A rotation display section displays a lower limit rotation setting value of a pump motor in accordance with a command of the control unit. The lower limit rotation speed setting value is a minimum rotation speed for preventing backflow of blood inside a circulation circuit A manually adjusted speed setting request from the manipulation section controls the pump speed, except that the controller enforces the lower limit speed setting unless receiving confirmation from a manipulator.

Extracorporeal circulation device

Bump electrodes (conductive members) bonded onto lands disposed at a peripheral portion side than terminals (bonding leads) electrically coupled to pads (electrode pads) of a microcomputer chip (semiconductor chip) are sealed with sealing resin (a sealing body). Thereafter, the sealing resin is ground (removed) partially such that a part of each of the bump electrodes is exposed. The step of protruding the part of each of the bump electrodes from a front surface of the sealing resin is performed, after the grinding step.

Method for manufacturing a package-on-package type semiconductor device

The reliability of a semiconductor device is improved. A sealing resin (sealed body) is formed between a sub-substrate (first base member) and a base substrate (second base member) that are provided individually and distinctly to be integrated therewith, and then, the sub-substrate is electrically coupled to the second base member. As a means for electrically coupling the sub-substrate to the base substrate, lands (first lands) formed on the sub-substrate and lands (second lands) formed on the base substrate are disposed such that the respective positions thereof are aligned. After through holes are formed from the lands of the sub-substrate toward the lands of the base substrate, a solder member (conductive member) is formed in each of the through holes.

Manufacturing method of semiconductor device

Flux is supplied to the surface of each land by a flux supplying apparatus. A solder ball having a predetermined size is supplied onto a land by using a ball supplying apparatus. A memory IC is disposed on a logic IC and each of a plurality of external leads comes into contact with a predetermined position in each of a plurality of corresponding lands. By performing predetermined heat treatment, the solder ball is melted to bond each external lead and each land with each other. After that, the melted solder is cooled down, the bonded portion is formed, and a stacked semiconductor device in which the memory IC is stacked on the logic IC is completed. In such a manner, a stacked semiconductor device in which external leads of a semiconductor device body are bonded to electrodes on a substrate securely is obtained.

Method of manufacturing stacked semiconductor device

A land grid array semiconductor device provides greater positioning accuracy for an external electrode with respect to a mounting substrate. External electrodes are arranged on one surface of a substrate in area array. The external electrode includes an external electrode pad and an external electrode interconnection. Each external electrode pad includes a first pad layer having a cylindrical shape and a second pad layer covering the surface of the first pad layer and having a conical shape.

Land grid array semiconductor device

The minimum spacing between wires disposed on a printed circuit board of a printed circuit board ball grid array package is reduced. Wiring layers are narrower than in the prior art because they are not plated and because only one metal layer is plated on the wiring layers. The narrower wiring layers can be formed easily with small spaces between wires.

Growing community of inventors

Kanagawa, Japan

Tomoaki Hashimoto