Dainippon Screen Mfg. Co., Ltd.

Screen Holdings Co., Ltd.

Tomoaki Aihara

Takashi Ota

Takahiro Yamaguchi

Jun Sawashima

Masayuki Hayashi

Kunio Yamada

Rikuta Aoki

Jiro Okuda

Daijo Mizukami

A substrate processing apparatus includes a processing liquid tank, a first circulation pipe, a filter, a pump, and a controller. The first circulation pipe has an upstream end connected to the processing liquid tank and a downstream end connected to the processing liquid tank. A processing liquid circulates in the first circulation pipe. The filter is deposed in the first circulation pipe and captures particles contained in the processing liquid. The pump is disposed in the first circulation pipe. The pump includes a rotor and feeds the processing liquid by rotating the rotor. In activation of the pump in a stopped state, the controller controls the pump so that the rotor rotates at a rotational acceleration of no greater than 400 rpm/sec.

Substrate processing apparatus and substrate processing method

A substrate processing apparatusincludes a processing unit, a reservoir, a processing liquid pipe, a pump, a filter, a first flow rate section, a first return pipe, a first adjustment valve, a second return pipe, a branch supply pipe, a second flow rate section, and a controller. The first flow rate sectionis placed in the processing liquid pipeand measures a flow rate or pressure of the processing liquid flowing through the processing liquid pipe. The first adjustment valveis placed in the first return pipeand adjusts a flow rate of the processing liquid flowing through the first return pipe. The controller controls an opening degree of the first adjustment valvebased on the flow rate or the pressure of the processing liquid measured by the first flow rate section

A substrate processing apparatus includes a substrate holder, a processing liquid supplying unit with a liquid nozzle discharging a processing liquid to an upper surface of the substrate. A moving unit moves the supplying unit between a process position at which the liquid nozzle faces the upper surface of the substrate and a retreat position. The supplying unit includes a first flow path in the processing liquid nozzle. The first flow path has one end part and the other end part that face a central region of the substrate and a peripheral region of the substrate, respectively, in a state where the supplying unit is positioned at the process position. It has a second flow path that supplies the processing liquid to the one end part, and a plurality of discharge ports in the processing liquid nozzle that are arranged along the first flow path direction and discharge the processing liquid in the first flow path to the substrate's upper surface.

Substrate processing apparatus

A substrate treating apparatus for drying substrates with a solvent vapor after treating the substrates with a treating liquid, includes a solvent vapor supply device for supplying the solvent vapor into a treating chamber, an exhaust device for exhausting gas from the chamber through an exhaust pipe, a drain pipe connected to the chamber for draining the treating liquid from the chamber, a gas-liquid separator at the other end of the exhaust pipe for receiving the gas from the exhaust device, and connected to the other end of the drain pipe for receiving the treating liquid from the drain pipe, the gas-liquid separator separating the gas and the liquid, and a mixer mounted on the exhaust pipe for mixing deionized water into the gas exhausted by the exhaust device.

Substrate treating apparatus and substrate treating method

A substrate treating apparatus for treating substrates with a treating liquid is disclosed. The apparatus includes a treating tank for storing the treating liquid, and treating the substrates as immersed in the treating liquid, a chamber surrounding the treating tank, a supply device for supplying an inert gas containing an organic solvent into the chamber, a lift mechanism vertically movable, while supporting the substrates, between a process position in the treating tank and a wait position above the treating tank and inside the chamber, a tank temperature control device for controlling temperature of the treating tank, a chamber temperature control device for controlling temperature of the chamber, and a control device for causing the tank temperature control device and the chamber temperature control device to perform heating treatment at least while the inert gas containing the organic solvent is supplied from the supply device.

Substrate treating apparatus

A substrate treating apparatus for drying substrates by moving the substrates out of a treating liquid into a solvent atmosphere. The apparatus includes a treating tank for storing the treating liquid, a chamber enclosing the treating tank, a holding mechanism for holding the substrates, the holding mechanism being vertically movable between a treating position in the treating tank and a drying position in the chamber and above the treating tank, a supply device for supplying vapor of a solvent into the chamber, a buffer tank disposed outside the chamber for collecting the treating liquid discharged from the treating tank, a first vacuum pump for decompressing the chamber, a second vacuum pump for decompressing the buffer tank, and a controller for operating the supply device to fill the chamber with the solvent atmosphere, operating the holding mechanism to move the substrates from the treating position to the drying position, operating the first vacuum pump to decompress the chamber to a first pressure, and operating the second vacuum pump to adjust a pressure in the buffer tank to a second pressure equal to or lower than the first pressure before the treating liquid in the treating tank is discharged into the buffer tank.

Growing community of inventors

Kyoto, Japan

Tomoaki Aihara