Toyota Jidosha Kabushiki Kaisha

Nippon Soken, Inc.

Tomo Sasaki

Tae Sugimura

Tadashi Yamada

Tadafumi Yoshida

Josuke Yamane

Tomoyuki Kozuka

Naoki Hakamada

Mitsuhiro Miura

Kazunori Uchiyama

Tooru Nakanishi

Masataka Deguchi

Koji Hotta

Akio Kitami

The VCIB includes a memory, a communication unit, and a processor. The memory stores beforehand pieces of execution information that are used to execute processes corresponding respectively to a plurality of APIs included in an API set that is a combination of APIs for requesting the VP to execute a predetermined function and requesting transmission of predetermined information from the VP. The communication unit receives, from the ADK, a request according to an API included in a permitted API set that the ADK is permitted to use beforehand. The processor executes a process corresponding to the request received by the communication unit by using execution information for an API relating to the request that is stored in the memory.

Vehicle, vehicle platform, vehicle control interface box, autonomous driving kit, control method of vehicle, and control method of vehicle platform for platform-adaptive control

An information processing device includes a control unit. The control unit acquires biometric information and occupant information of an occupant of a vehicle, estimates state information of the occupant based on the acquired biometric information, and compares the estimated state information and the acquired occupant information with past data for another occupant in which the state information and the occupant information are associated with facility information of a service facility used, to determine a service facility fit for the occupant.

Information processing device, information processing system, program, and vehicle

An information processing device that provides a travel route to a destination to an occupant of a vehicle includes a controller. The controller is configured to acquire travel information obtained by another vehicle that travels on a candidate route to the destination set by the occupant from a second point in time prior to a first point in time when the destination is set to the first point in time in relation to traveling of the other vehicle, and to decide the travel route optimal for driving of the vehicle to the destination based on the acquired travel information.

An information processing device includes a control unit. The control unit acquires actual traveling information about a first vehicle that travels along a first traveling route, and generates control information for reproducing a traveling state of the first vehicle on the first traveling route, based on the acquired traveling information about the first vehicle.

In a method for predicting deterioration of grease, the grease is applied between a semiconductor module and a cooler. The semiconductor module accommodates a semiconductor element. The method for predicting deterioration includes predicting deterioration of the grease after specified heat cycles by using: a variable G/Gthat is acquired by dividing an initial storage modulus Gof the grease by an initial loss modulus Gof the grease at an expected maximum use temperature of the semiconductor element; and distortion dD of the grease at the time when the initial storage modulus Gand the initial loss modulus Ghave the same value.

Method for predicting deterioration of grease, grease, and method for manufacturing grease

A semiconductor device may include a stack in which a cooler and a semiconductor module are stacked, the semiconductor module housing a semiconductor element; a contact plate contacting the stack in a stacking direction of the semiconductor module and the cooler; and a spring contacting the contact plate and pressurizing the stack via the contact plate in the stacking direction, wherein the spring may contact a center portion of the contact plate in a direction perpendicular to the stacking direction, and a recess or a cavity may be provided at the center portion of the contact plate, the recess facing the stack.

Semiconductor device

A semiconductor device includes a semiconductor module. The semiconductor module includes a package made of resin. The package contains a semiconductor element and a heat sink. The heat sink has a thermal conductive surface exposed on a part of one surface of the package. The semiconductor device includes an insulating plate, which is a part of a cooler, facing the thermal conductive surface of the heat sink and a resin surface around the thermal conductive surface, and pressed against the semiconductor module. At least a part of the thermal conductive surface comprises a recessed region recessed with respect to the resin surface. A solid heat transfer layer is interposed between the recessed region of the thermal conductive surface and the insulating plate, and is not interposed between the resin surface and the insulating plate.

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Toyota, Japan

Tomo Sasaki