Mitsubishi Gas Chemical Company, Inc.

Tomo Chiba

Eisuke Shiga

Katsuya Tomizawa

Hiroshi Takahashi

Meguru Ito

Yoichi Takano

Takaaki Ogashiwa

Nobuyoshi Ohnishi

Takashi Kubo

Yoshihiro Kato

Takafumi Oda

Keisuke Takada

Daisuke Ueyama

Kentaro Nomizu

The present invention provides an easily tearable aluminum-vapor-deposited biaxially oriented film in which at least an aluminum vapor deposition layer (A), a barrier layer (B), an adhesive layer (C), and a polypropylene layer (D) are layered in this order, wherein the barrier layer (B) includes a mixture of a polyamide (a) and an amorphous polyamide (b), the polyamide (a) includes diamine units including at least 70 mol % of constituent units derived from xylylene diamine and dicarboxylic acid units including at least 70 mol % of constituent units derived from a C&#x3b1;,&#x3c9;-straight-chain aliphatic dicarboxylic acid, the content of the polyamide (a) in the barrier layer (B) is 30-70% by mass, and the content of the amorphous polyamide (b) in the barrier layer (B) is 30-70% by mass.

Easily tearable aluminum-vapor-deposited biaxially oriented film

A resin composition comprising a thermosetting resin, a functional group-modified copolymer, and an inorganic filler, wherein the functional group-modified copolymer has two or more alkyl (meth)acrylate units, or one or two or more alkyl (meth)acrylate units and an acrylonitrile unit, and at least a part of alkyl ester groups of the alkyl (meth)acrylate units and/or a cyano group of the acrylonitrile unit are/is modified with at least one selected from the group consisting of an epoxy group, a carboxyl group, and an amide group.

Resin composition, prepreg, metal foil-clad laminate, and printed circuit board

The present invention provides a resin composition containing an alkenyl-substituted nadimide and a perinone-based colorant, wherein the content of the perinone-based colorant is 0.8 parts by mass or less based on 100 parts by mass in total of resin-constituting components in the resin composition.

Resin composition and prepreg, resin sheet, laminate, and printed circuit board comprising same

A resin composition containing a compound represented by the following general formula (a) or the following general formula (b), an alkenyl-substituted nadimide compound, and a maleimide compound: wherein Rrepresents a group represented by the following general formula (c), 

Resin composition and prepreg, resin sheet, laminate, and printed circuit board

The present invention provides an insulating layer for printed circuit boards having a difference of within 20% between the flexural modulus at 25&#xb0; C. and the flexural modulus under heat at 250&#xb0; C.

Insulating layer for printed circuit board and printed circuit board

An object of the present invention is to provide a resin composition that has a variety of properties required for a material for printed circuit boards such as high flame retardancy, and can attain a cured product having high moldability, high resistance against chemicals in a desmearing step, and a small coefficient of thermal expansion, a prepreg comprising the resin composition, a laminate including the prepreg, a metallic foil clad laminate including the prepreg, and a printed circuit board including the prepreg. A resin composition comprising an acrylic-silicone copolymer (A), a halogen-free epoxy resin (B), a cyanic acid ester compound (C) and/or a phenol resin (D), and an inorganic filler (E).

Resin composition, prepreg, laminate, metallic foil clad laminate, and printed circuit board

The present invention provides a resin composition including: nanoparticles (A) of alumina and/or boehmite having an average particle size of 1.0 nm to 100 nm; fine particles (B) having an average particle size of 0.20 &#x3bc;m to 100 &#x3bc;m; and a thermosetting resin (C), wherein the nanoparticles (A) have their surfaces treated with a polysiloxane-based modifier.

Resin composition, prepreg, laminate, metal foil-clad laminate, and printed-wiring board

An object of the present invention is to provide a resin composition that can attain cured products having high flame retardancy, high heat resistance, a small coefficient of thermal expansion, and high drilling processability, a prepreg having the resin composition, a laminate and a metal foil clad laminate having the prepreg, and a printed circuit board having the resin composition. A resin composition, having at least an epoxy silicone resin (A) prepared by reacting a linear polysiloxane (a) having a carboxyl group with a cyclic epoxy compound (b) having an epoxy group such that the epoxy group of the cyclic epoxy compound (b) is 2 to 10 equivalents based on the carboxyl group of the linear polysiloxane (a), a cyanic acid ester compound (B) and/or a phenol resin (C), and an inorganic filler (D).

Resin composition, pre-preg, laminate, metal foil-clad laminate, and printed wiring board

A resin composition containing a cyclic epoxy-modified silicone compound (A) represented by formula (1), a cyanic acid ester compound (B) and/or a phenol resin (C) and an inorganic filler (D): wherein Reach independently represent an organic group having an epoxy group; Reach independently represent a substituted or unsubstituted monovalent hydrocarbon group; x represents an integer of 0 to 2; and y represents an integer of 1 to 6; and the siloxane unit marked with x and the siloxane unit marked with y are arranged mutually at random.

Growing community of inventors

Tokyo, Japan

Tomo Chiba