Advanced Semiconductor Engineering, Inc.

Other

Tommy Pan

Chi-Chih Shen

Jen-Chuan Chen

Hui-Shan Chang

Chia-Lin Hung

A package structure includes: 1) a circuit substrate; 2) a first semiconductor device disposed on the circuit substrate; 3) a first insulation layer covering a sidewall of the first semiconductor device; 4) a second insulation layer covering the first insulation layer; and 5) a third insulation layer disposed on the circuit substrate and in contact with the second insulation layer.

Package process and package structure

A package process is provided. An adhesive layer is disposed on a carrier board and then plural first semiconductor devices are disposed on the adhesive layer. A first molding compound formed on the carrier board covers the sidewalls of the first semiconductor devices and fills the gaps between the first semiconductor devices so as to form a chip array board constructed by the first semiconductor devices and the first molding compound. Next, plural second semiconductor devices are flip-chip bonded to the first semiconductor devices respectively. Then, a second molding compound formed on the chip array board at least covers the sidewalls of the second semiconductor devices and fills the gaps between the second semiconductor devices. Subsequently, the chip array board is separated from the adhesive layer. Then, the first and the second molding compound are cut along the gaps between the second semiconductor devices.

A package process includes following steps. A circuit mother board comprising a plurality of circuit boards is disposed on a carrier. Semiconductor devices are provided, wherein each of the semiconductor devices has a top surface and a bottom surface opposite thereto. Each of the semiconductor devices has conductive vias each having a first end surface and a second end surface exposed by the bottom surface of the semiconductor device. The semiconductor devices are connected to the corresponding circuit boards through their conductive vias with their bottom surface facing the circuit mother board. An insulating paste is formed between each of the semiconductor devices and its corresponding circuit board. A protection layer is formed on the circuit mother board to cover the semiconductor devices. Then, the protection layer and the semiconductor devices are thinned to expose the first end surface of each of the conductive vias.

Package structure and package process

A flip chip package structure including a chip, a carrier, and a plurality of bumps is provided. The chip has a bonding surface and a plurality of bump pads thereon. The carrier is disposed corresponding to the chip and includes a substrate and a plurality of pre-solders. The substrate has a carrying surface and a patterned trace layer thereon. The patterned trace layer has a plurality of traces, and each of the traces has an outward protruding bonding portion corresponding to the bump. The line width of the bonding portion is greater than that of the trace. The pre-solders are disposed on the bonding portions, respectively. The bumps are disposed between the bump pads and the corresponding pre-solders such that the chip is electrically connected to the carrier through the bumps.

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Taipei, Taiwan

Tommy Pan