Nvidia Corporation

Tommy Lee

Glenn Alan Wernig

Nelson Au

Arman Toorians

Siarhei Murauyou

Zhihai Zack Yu

Berhanu Zerayohannes

Zoran Stefanoski

Joseph Douglass Walters

Jeong Hun Kim

Jen-Hsun Huang

Don C Miller

Chong Kin Kuok

Mark J Johnson

Sergey Murauyou

Harjinder S Dulai

A peripheral device for a computing device comprises a body configured for insertion into a storage cavity in the computing device, a first magnet, and a second magnet. The first magnet is disposed within the body proximate a first external surface of the body and having a first pole of a first polarity and a second pole of a second polarity, wherein the first pole is oriented toward the first external surface. The second magnet is disposed within the body between a second external surface and the first magnet and having a first pole of the first polarity and a second pole of the second polarity, wherein the first pole of the second magnet is oriented toward the second external surface.

Magnetic retention of peripheral device for a tablet computer

A passive stylus with a deformable tip is described herein. In one embodiment, a thin annular body configured to be hand-held with a chisel shaped tip disposed at the first end of the body is provided. The chisel shaped tip includes a deformable material such that the chisel shaped tip is operable to interface with a touch a sensitive surface with a detectable surface area when a first pressure is exerted on the body and translated to the chisel shaped tip. The chisel shaped tip is operable to interface with the touch sensitive surface with a second detectable surface area, this one different from the first detectable surface area, when a second pressure is exerted on the body and translated to the chisel shaped tip. The stylus may include a second tip on the back end for providing an erase function.

Stylus tool with deformable tip

Stylus with chisel-shaped tip

Stylus with fine tip

A system, method, and computer program product are provided for transmitting wireless signals to one or more portable devices. In use, a plurality or wireless signals is received utilizing a plurality of protocols. In addition, the plurality of protocols associated with the plurality of wireless signals are converted to a single different protocol. Further, the plurality of wireless signals is transmitted to at least one portable device utilizing the single different protocol.

Wireless communication system, method, and computer program product

A heat exchanger carrier system, method, and computer program product are provided. Included is a circuit board with components mounted thereon. Further included is a carrier coupled to the circuit board. Also included is a plurality of heat exchangers coupled to the carrier for transferring heat from the components.

Circuit board heat exchanger carrier system and method

A system, method, and computer program product are provided for circulating external air about a chipset. Included is a circuit board with a chipset mounted thereon that communicates with a central processing unit and controls interaction with memory. Further provided is an airflow subsystem coupled to the circuit board for circulating external air about the chipset.

Heat exchanger system and method for circulating external air about a chipset

A system and method are provided for controlling a transfer of heat between circuit board components. Included is a circuit board with components mounted thereon. Also provided is a controllable heat transfer medium for controlling a transfer of heat between the components.

Controllable heat transfer medium system and method for use with a circuit board

One embodiment of a modular, scalable cooling system includes a core cooling module configured to be thermally coupled to a heat-generating electronic device and a supplemental cooling module configured to be thermally coupled to the core cooling module. A first interface attached to the core cooling module is configured to thermally couple the core cooling module to the supplemental cooling module. The core cooling module and the supplemental cooling module may be used alone or in combination to dissipate heat from the heat-generating electronic device.

Growing community of inventors

Danville, CA, United States of America

Tommy Lee