At&t Bell Laboratories

American Telephone & Telegraph Co., At&t Bell Laboratories

American Telephone and Telegraph Corporation

Tommy L Poteat

James Edward West

John C Baumhauer, Jr

Jay R Simpson

William S Trimmer

Edmond J Murphy

Harold J Hershey

W Stewart Lindenberger

Robert L Batdorf

An array connector for optical fibers is disclosed which utilizes a plurality of grooves formed in the array substrate to hold the fibers. The connector is to be used with fibers having at least one sectional view substantially flattened side, where polarization maintaining fibers may be formed to assume this shape. The grooves are formed to have a relatively flat bottom surface so that the flattened side of the fiber is positioned to coincide with this flat bottom surface. The grooves themselves may have any desired cross section. A coverplate with corresponding grooves may be utilized to form an interlocking structure to prevent any lateral movement by the fibers. When used in association with polarization maintaining fibers, the connector of the present invention will preserve the polarization through the connection by preventing any axial angular motion. The connector may be used to align a plurality of fibers with another plurality of fibers or, alternatively, with a plurality of optical waveguides.

Array connector for optical fibers

Disclosed is a device which in one aspect effects a continuous realignment of the optical fiber in transmitters, receivers, or transceivers after the lightwave package is assembled and in use, and in another aspect provides movement of optical fibers or other small elements for general applications. In one embodiment, the fiber is mechanically coupled to a piezoelectric crystal which expands and contracts in response to electrical pulses supplied to electrodes on the crystal. Clamping and releasing the ends of the crystal by magnetic or electrostatic forces result in movement of the fiber in incremental steps to its aligned position.

Lightwave component package

An electroacoustic transducer, primarily in the form of a capacitive microphone, for incorporation into a semiconductor substrate. The vibrating element comprises a largely nontensioned diaphragm, such as an epitaxial layer formed on the semiconductor substrate, so as to greatly reduce its mechanical stiffness. The substrate is etched away in the desired area to define the diaphragm and form an acoustic cavity. A continuous array of microscopic holes is formed in the backplate to cut down the lateral flow of air in the gap between capacitor electrodes. Narrow gaps made possible by the hole array allow low voltage diaphragm biasing. In at least one embodiment, the acoustic input can be provided through the air hole array. An acoustic port may be added to alter the frequency response of the device, and a back closure provided to act as a rear acoustic cavity and an EMI shield.

Integrated electroacoustic transducer

Disclosed is an electroacoustic transducer structure which can be formed in a semiconductor substrate and incorporated as part of an integrated circuit, and which provides a built-in dc bias for operation. An appropriate density of fixed charge is provided in an insulating layer adjacent to one of the electrodes in the gap between electrodes. Methods of manufacture are also disclosed including means for introducing the charge by contacting the insulating layer with a liquid medium, plasma charging, or by ion beam implanting into the layer.

Integrated electroacoustic transducer with built-in bias

A method for micromachining precise semiconductor features involving a pre-etch for establishing proper mask alignment. In one embodiment, the pre-etch utilizes a mask opening which has at least two edges oriented at a significant angle with the nominal (110) direction of a silicon wafer. The silicon is anisotropically etched through this opening until the true (110) lines are revealed by the intersection of the (111) planes with the wafer surface. Two parallel lines will therefore be formed to provide alignment of the mask for subsequent feature definition. In a further embodiment, the silicon wafer is completely etched through so that a pit edge on the front surface is offset on the back surface by an amount equal to the wafer thickness. This provides front-to-back alignment in subsequent processing.

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Bridgewater, NJ, United States of America

Tommy L Poteat