Micron Technology Incorporated

Stmicroelectronics S.r.l.

Micro Technology, Inc.

Tommaso Zerilli

Antonino Mondello

Francesco Tomaiuolo

Carmelo Condemi

Raffaele Bufano

Sandra Lospalluti

Paolo Rolandi

Stefano Andreoli

Maurizio Giovanni Gaibotti

Poorna Kale

Antonino Conte

Chris Bueb

Marco Gibilaro

An apparatus, such as a memory system (e.g., a NAND memory system), can have a controller with a first error correction code component and a memory device (e.g., a NAND memory device) coupled to the controller. The memory device can have an array of memory cells, a second error correction code component coupled to the array and configured to correct data from the array, and a cryptographic component coupled to receive the corrected data from the second error correction code component.

Memory devices with cryptographic components

Various examples described herein are directed to systems and methods for generating data values using a NAND flash array. A memory controller may read a number of memory cells at the NAND flash array using an initial read level to generate a first raw string. The memory controller may determine that a difference between a number of bits from the first raw string having a value of logical zero and a number of bits from the first raw string having a value of logical one is greater than a threshold value and read the number of memory cells using a second read level to generate a second raw string. The memory controller may determine that a difference between a number of bits from the second raw string having a value of logical zero and a number of bits from the second raw string having a value of logical one is not greater than a threshold value and applying a cryptographic function using the second raw string to generate a first PUF value.

Physical unclonable function with NAND memory array

An apparatus, such as a memory (e.g., a NAND memory), can have a controller, a volatile counter coupled to the controller, and a non-volatile memory array coupled to the controller. The controller can be configured to write information, other than a count of the counter, in the array each time the count of the counter has been incremented by a particular number of increments. Counts can be monotonic, non-volatile, and power-loss tolerant.

Monotonic counters in memories

Example embodiments for configuring a serial non-volatile memory device may comprise a non-volatile configuration register to store a configuration value received from the processor, the configuration value to specify one or more attributes of a memory access operation. The configuration value may be read at least in part in response to power being applied to the memory device.

Non-volatile configuration for serial non-volatile memory

Example embodiments for configuring a serial non-volatile memory device for an execute-in-place mode may comprise a non-volatile configuration register to store an execute-in-place mode value that may be read at least in part in response to power being applied to the memory device.

Execute-in-place mode configuration for serial non-volatile memory

A method and a memory device are provided for accessing a storage location. The method includes storing an extended address value in a register in a non-volatile memory device. The method further includes subsequently receiving multiple addresses and combining the stored extended address value with each of the multiple received addresses to produce multiple combined addresses. The method further includes accessing multiple storage locations within the non-volatile memory device based, at least in part, on the multiple combined addresses.

Enhanced addressability for serial non-volatile memory

A generator circuit for voltage ramps is provided that includes a differential stage with positive feedback coupled between a first and a second voltage reference and having a first output connected to a control terminal of a first output transistor. The first output transistor is connected at an output terminal of the ramp generator circuit to a capacitive charge to be biased with voltage ramps. The ramp generator circuit also includes a second output transistor parallel connected to the first output transistor and having the control terminal connected to a second output of the differential stage.

Generator circuit for voltage ramps and corresponding voltage generation method

A bias circuit for read amplifier circuits for memories includes at least one first circuit branch formed by a first pair of MOS transistors connected between a supply voltage and ground. The first pair of MOS transistors includes a P-channel diode connected transistor and an N-channel transistor connected in series, with an enable transistor interposed therebetween. The first circuit branch drives a capacitive load for coupling to the supply voltage. The bias circuit further includes reference current amplifier circuit branches for amplifying a reference current which flows in the first circuit branch for charging the capacitive load. A circuit portion, which controls the charging current of the capacitive load, includes a feedback loop between the reference current amplifier circuit branches and the capacitive load.

Bias circuit for read amplifier circuits for memories

A boosted voltage driving circuit includes an inverter circuit with positive feedback and a selective breaking circuit. The selective breaking circuit disconnects the positive feedback from the output load during an operation phase of the boosted voltage driving circuit in order to reduce energy consumption. In a preferred embodiment, the boosted voltage driving circuit is the final stage of a decoder circuit for selecting and deselecting a line or column of a memory array, and the positive feedback is disconnected during a deselection phase in which the line or column is deselected. The present invention also provides a boosted voltage driving circuit that includes first, second, and third transistors and a selective breaking circuit. The first transistor is connected between a supply voltage and an output node, the second transistor is connected between the output node and ground, and the third transistor is connected between the supply voltage and the gate of the first transistor. Further, the selective breaking circuit is connected between the output node and the gate of the third transistor to disconnect the gate of the third transistor from the output node during an operation phase of the boosted voltage driving circuit.

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Tremestieri Etneo, Italy

Tommaso Zerilli