Ngk Spark Plug Company, Limited

Tomio Satou

Kazuo Kimura

Koichi Ishikawa

Takahiro Shibata

Futoshi Sonoda

Disclosed is a method of producing an integrated circuit package, wherein portions of the package are electroplated by getting a direct electrical connection with each of lead pins joined to a package substrate. The electrical connection is obtained by force-fitting each of the lead pins in corresponding one of openings formed in a plating jig made of an electrically conductive material for thereby bringing a side surface of each of the lead pins in contact with the jig. The portions of the package are electroplated under the condition where each of the lead pins is held in conduction. After the electroplating, each of the lead pins is separated from the jig through movement in the direction differing from an axial direction of each of the lead pins. Various jigs used for carrying out the above method are also disclosed.

Jig for electroplating lead pins of an integrated circuit package

Disclosed is a method of producing an integrated circuit package, wherein portions of The package are electroplated by getting a direct electrical connection with each of lead pins joined to a package substrate. The electrical connection is obtained by force-fitting each of the lead pins in corresponding one of openings formed in a plating jig made of an electrically conductive material for thereby bringing a side surface of each of the lead pins in contact with the jig. The portions of the package are electroplated under the condition where each of the lead pins is held in conduction. After the electroplating, each of the lead pins is separated from the jig through movement in the direction differing from an axial direction of each of the lead pins. Various jigs used for carrying out the above method are also disclosed.

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Nagoya, Japan

Tomio Satou