Showa Aluminum Corporation

Showa Denko K.k.

Tomio Ito

Yuichi Furukawa

Yuko Ito

Masayuki Suda

Mitsugu Sumitani

Toshiji Akagi

Suzushi Hashimoto

Takashi Kiyosue

Yoshifumi Shimajiri

Akira Furusawa

According to the present invention, there is provided an automotive sunshade panel formed from a metallic hollow panel and having flanged edges and a two-dimensional curved surface or a three-dimensional curved surface formed at least partially of its central portion excepting the peripheries of the metallic hollow panel. For use in the present invention, a fabric may be laminated to at least one side of the metallic hollow panel. The metallic hollow panel is formed into a one-side expanded Roll-Bond&reg; panel, a both-side expanded Roll-Bond&reg; panel, a both-side flat three-layer Roll-Bond&reg; panel or a honeycomb panel.

Method of manufacturing automotive sunshade panel

Automotive sunshade panel and method of manufacturing same

A heat sink device for use in desktop electronic devices comprises a heat sink which can be firmly attached to a CPU assembly with extremely great strength. The holes to be formed in the CPU circuit board of the CPU assembly or the heat sink can be made as small as possible to ensure a great advantage in design. Fastening members, connecting pins or like fasteners used are unlikely to project beyond the outer surface of the CPU assembly to ensure compactness. Furthermore, the heat sink device achieves a high radiation efficiency and is less costly to manufacture.

Heat sink devices for use in electronic devices

A heat sink for use in a portable electronic device for disposing of the heat generated by an electronic component of the device, the heat sink comprising in its entirety a metal clad plate composed of two metal sheets and having a nonbonded portion in a required pattern, the nonbonded portion providing a heat pipe portion formed by outwardly inflating at least one of the two metal sheets of the nonbonded portion to make a hollow portion and enclosing a working liquid in the hollow portion, the metal clad plate having on one surface thereof a mount portion for the electronic component at a region thereof where the heat pipe portion is partly present, the heat pipe portion having a heat receiving portion at the region thereof where the mount portion is present. When a heat-generating electronic component is attached to the mount portion, the working liquid in the heat receiving portion is heated with the heat produced by the component to evaporate. The resulting gas flows toward other portion, where the gas releases heat through the clad plate and liquefies. The working liquid thus liquefied again returns to the heat receiving portion. The liquid remaining at locations other than the heat receiving portion flows into the heat receiving portion. This operation is repeated to dispose of the heat produced by the component.

Heat sink for portable electronic devices

A heat sink having pin-shaped fins, for example, for use in disposing of heat in printed boards for computers comprises a heat dissipating base plate and a plurality of comblike fin members arranged in parallel at a predetermined spacing on one surface of the base plate approximately perpendicular thereto, each of the fin members comprising pin-shaped fins arranged in a row and connector connecting the fins together each at one end thereof, the connector of each fin member being joined to the surface of the base plate. The fins are given a greater height and arranged with a reduced pitch with a higher density for disposal of increased amounts of heat. To prepare the heat sink, the fin members are blanked out from a metal sheet, the fin members and spacer plates are arranged alternately on one surface of a heat dissipating base plate approximately perpendicular thereto, the connectors of the fin members are joined to the base plate and the spacer plates are thereafter removed. A comblike fin member having pin-shaped fins and a large length is bent to a zigzag form when seen from above.

Heat sinks having pin-shaped fins and process for producing same

Growing community of inventors

Oyama, Japan

Tomio Ito